AMD EPYC 9335 socket: SP5
The AMD EPYC 9335 uses the SP5 socket. It is a 32-core Turin server processor at 210 W for efficient dual-socket edge and virtualization hosts.
AMD EPYC 9335 specifications
| Cores | 32 |
|---|---|
| Threads | 64 |
| Core architecture | Zen 5 |
| Clocks | 3.0 GHz base to 4.4 GHz boost |
| Cache | 128 MB L3 |
| Default TDP | 210 W |
| Manufacturing process | TSMC 4 nm for the compute dies, 6 nm for the I/O die |
| Memory support | DDR5 up to 6400 MT/s, ECC RDIMM, 12 channels, up to 6 TB per socket |
| PCI Express | PCIe 5.0 x128 per socket, with CXL 2.0 |
| ECC memory | ECC through DDR5 RDIMM |
| Package | SP5 (LGA6096) |
| Sockets supported | 1P and 2P |
Motherboard compatibility
AMD EPYC 9335 needs a motherboard with a SP5 socket. Chipset by chipset data for this codename is not recorded yet. See the SP5 chipset list and the board maker's CPU support list.
SP5 at a glance
| Type | LGA, 6,096 contacts |
|---|---|
| Package size | 72 × 75.4 mm |
| Introduced | November 2022 |
| Memory | DDR5 ECC RDIMM, 12 channels (up to DDR5-6000, DDR5-6400 in target configs, up to 6 TB per socket) |
| Cooler mounting holes | Board specific (server heatsink) |
What the EPYC 9335 is
The EPYC 9335 is a 32-core, 64-thread server processor that AMD released on October 10, 2024 with Turin. Zen 5 cores run at 3.0 GHz base with boost to 4.4 GHz and all-core boost at 4.0 GHz. Shared L3 cache totals 128 MB across four compute dies. Default TDP is 210 W configurable between 200 and 240 W, the efficiency end of this batch for edge duty.
Low power with high boost is the design point: 4.4 GHz peak matches bigger SKUs for bursty work while 210 W keeps sustained draw modest. Against the 36-core AMD EPYC 9365 it gives up four cores for lower watts per socket. Against the 24-core class below it keeps more threads for guests without leaving the efficient envelope. Four CCDs keep the die configuration simple, which helps consistent latency across the socket.
There is no integrated graphics and the multiplier is locked. ECC DDR5 RDIMMs carry correction. Edge sites and branch virtualization hosts value the 210 W rating because cooling and power budgets there run tight. Configurable TDP down to 200 W fits constrained feeds without a SKU change.
Socket and motherboard compatibility
The 9335 fits the SP5 socket in FC-LGA6096 packaging on 210 W-class server boards. Genoa boards accept it after a Turin-capable firmware update. The board maker CPU support list confirms the SKU with the minimum BIOS. Power delivery on qualified boards assumes the 240 W upper bound with margin for transients.
One or two sockets are supported. Efficient SKUs like this one pair well with compact chassis and telecom cabinets where power feeds limit bigger chips. Dual-socket layouts double cores while staying near 420 W for both processors, which fits capped power feeds. Operators with capped racks fit more 9335 hosts per row than with 300 W silicon.
Single-socket edge boards take this SKU directly. The socket and memory generation match the rest of Turin, so mixing efficient and dense SKUs across a fleet shares spares and firmware. Remote management through the board BMC covers sites without local staff.
Memory, PCIe and cooling
DDR5 up to 6400 MT/s in 12 channels with ECC RDIMMs reaches 6 TB per socket. Per-core bandwidth at 32 cores is ample, which flatters memory-bound analytics on efficient hosts. Even channel population remains the rule for full speed. Edge hosts that cache content locally should size DIMMs for the working set first, since storage speed matters less once data sits in fast RAM.
PCIe 5.0 x128 lanes with CXL 2.0 serve NVMe, networking and accelerators. Edge hosts often wire fewer slots, but the CPU lane budget stays full for chassis that need it. Board manuals set the exact splits. A single fast NIC plus boot NVMe covers most branch deployments with lanes to spare.
Cooling at 210 W fits standard air heatsinks in most chassis. No tray cooler ships. This is the easiest Turin class in the batch to cool, which is part of its appeal for remote sites with simple maintenance. Operators should still validate sustained clocks under summer ambient conditions before signing off.
Upgrade paths
Within SP5 the 9335 grows from smaller efficient SKUs or trims down from the 36-core AMD EPYC 9365 for power limits, reusing boards and memory. The 48-core AMD EPYC 9455 above adds threads at 300 W for denser guests. BIOS checks cover each move. Operators should revalidate power capping policies after any swap, since cTDP bands differ across the stack.
Frequency-optimized F SKUs such as the AMD EPYC 9175F serve per-core speed on the same boards at higher power. Platform exits wait for later sockets. Refresh planning normally follows warranty terms, so efficient hosts often serve a full second life at the edge after datacenter duty.
Frequently asked questions
What socket does the EPYC 9335 use?
It uses SP5 in the FC-LGA6096 package on 210 W-class server boards.
How many cores does the EPYC 9335 have?
32 Zen 5 cores with 64 threads at 3.0 GHz base and up to 4.4 GHz boost, with 128 MB of L3 cache.
What is the TDP of the EPYC 9335?
210 W default, configurable between 200 and 240 W.
How much cache does the EPYC 9335 have?
128 MB of shared L3 cache across four Zen 5 compute dies, or 4 MB per core.
What memory does the EPYC 9335 support?
DDR5 up to 6400 MT/s in 12 channels with ECC RDIMMs, to 6 TB per socket.
Sources and verification
Facts last checked against these sources on . Page last edited on .