AMD EPYC 9455P socket: SP5

The AMD EPYC 9455P uses the SP5 socket. It is a 48-core Turin server processor at 300 W built for single-socket virtualization clusters.

Socket
SP5
Launched
October 10, 2024
Cores and threads
48 and 96
Default TDP
300 W
Codename
Turin
Segment
Server
Family
AMD EPYC
Clocks
3.15 / 4.4 GHz

AMD EPYC 9455P specifications

Cores48
Threads96
Core architectureZen 5
Clocks3.15 GHz base to 4.4 GHz boost
Cache256 MB L3
Default TDP300 W
Manufacturing processTSMC 4 nm for the compute dies, 6 nm for the I/O die
Memory supportDDR5 up to 6400 MT/s, ECC RDIMM, 12 channels, up to 6 TB per socket
PCI ExpressPCIe 5.0 x128 per socket, with CXL 2.0
ECC memoryECC through DDR5 RDIMM
PackageSP5 (LGA6096)
Sockets supported1P only (single-socket boards)

Motherboard compatibility

AMD EPYC 9455P needs a motherboard with a SP5 socket. Chipset by chipset data for this codename is not recorded yet. See the SP5 chipset list and the board maker's CPU support list.

SP5 at a glance

TypeLGA, 6,096 contacts
Package size72 × 75.4 mm
IntroducedNovember 2022
MemoryDDR5 ECC RDIMM, 12 channels (up to DDR5-6000, DDR5-6400 in target configs, up to 6 TB per socket)
Cooler mounting holesBoard specific (server heatsink)

Read the full SP5 socket guide

What the EPYC 9455P is

The EPYC 9455P is a 48-core, 96-thread server processor that AMD released on October 10, 2024 for single-socket Turin systems. Zen 5 cores run at 3.15 GHz base with boost to 4.4 GHz and all-core boost at 4.1 GHz. Shared L3 cache totals 256 MB across eight compute dies. Default TDP is 300 W configurable between 240 and 300 W.

The P suffix marks 1P platforms: the AMD EPYC 9455 matches it on cores, clocks, cache and power but scales to two sockets, while the 9455P is qualified for single-socket boards at lower platform cost. Mid-size clouds often standardize on 48-core single-socket hosts because the guest-to-host ratio stays manageable for small operations teams. The embedded twin AMD EPYC Embedded 9455P serves industrial carriers.

There is no integrated graphics and the multiplier is locked. ECC DDR5 RDIMMs carry correction. With 96 threads in one socket and no inter-socket hops, branch virtualization clusters run at their most predictable. Configurable TDP down to 240 W fits constrained power feeds without a SKU change.

Workload fit decides between the 9455P and its neighbors: branch clouds with steady guest counts love the 48-core single-socket shape, while headquarters clusters with thousands of guests scale out on denser SKUs such as the AMD EPYC 9655. Operators often tier the fleet with P SKUs at the edge and non-P silicon in the core datacenter, which keeps licensing and spares aligned per site.

Socket and motherboard compatibility

The 9455P fits the SP5 socket in FC-LGA6096 packaging on single-socket server boards with 300 W delivery. Only 1P board designs qualify, even though the socket matches dual-capable platforms. The board maker CPU support list confirms the SKU with its minimum BIOS, and power stages assume the upper configurable bound with margin.

Choosing P over non-P happens at purchase: 1P boards cost less with simpler NUMA layout, while 2P boards with the AMD EPYC 9455 keep expansion open. Memory bandwidth per core is identical at 12 channels either way. Socket-count licensing favors the P line wherever a second socket adds no value for the workload.

Genoa-era boards generally accept Turin after a firmware update with validated stepping support. Confirm support per board revision rather than assuming the socket alone guarantees boot. Mixed P and non-P fleets share firmware trains and management tooling for simpler administration.

Memory, PCIe and cooling

DDR5 up to 6400 MT/s in 12 channels with ECC RDIMMs reaches 6 TB in one socket. Single-socket hosts concentrate virtual machines behind one memory system, so fully populated channels matter for consistent guest performance. The board memory guide sets legal DIMM mixes for the 300 W envelope. Cluster planners should reserve headroom for hypervisor overhead before packing guests tightly together.

PCIe 5.0 x128 lanes with CXL 2.0 serve NVMe, networking and accelerators from the single CPU without inter-socket links. Slot bifurcation follows the 1P board layout. Uniform latency across all devices is the architectural payoff of one socket for branch clusters large and small.

Cooling at 300 W needs vendor-qualified air or liquid heatsinks for the chassis height and airflow pattern. No tray cooler ships. Single-socket 2U designs cool comfortably at this power, while 1U bodies need the vendor high-performance sink selected for the exact chassis model.

Upgrade paths

Inside single-socket SP5 the 9455P grows from smaller P SKUs such as the 32-core AMD EPYC 9355P when guest density rises, keeping board and memory with a BIOS check while power steps to 300 W. Larger 1P options add threads at higher envelopes for denser hosts. Operators should revalidate thermal margins after any step up in power class.

Moving to dual-socket means new boards with the AMD EPYC 9455 instead for expansion headroom. Leaving SP5 entirely waits for later sockets with fresh memory qualification across the estate.

Frequently asked questions

What socket does the EPYC 9455P use?

It uses SP5 in the FC-LGA6096 package on single-socket server boards.

How does the 9455P differ from the 9455?

Cores, clocks, cache and power match at 48 cores and 300 W. The P runs on single-socket boards only, while the non-P scales to two sockets.

How much cache does the EPYC 9455P have?

256 MB of shared L3 cache across eight Zen 5 compute dies.

What memory does the EPYC 9455P support?

DDR5 up to 6400 MT/s in 12 channels with ECC RDIMMs, to 6 TB in the single socket.

What is the TDP of the EPYC 9455P?

300 W default, configurable between 240 and 300 W.

Sources and verification

  1. AMD EPYC 9455P (AMD)
  2. AMD EPYC 9455P Specs (TechPowerUp CPU Database)

Facts last checked against these sources on . Page last edited on .