Socket FT3 socket: CPUs, chipsets and cooler fit
Socket FT3 is AMD ball grid array package with 769 contacts in a 24.5 × 24.5 mm footprint. It solders directly to mobile and embedded boards and carries Jaguar and Puma cores with integrated graphics, memory controller and I/O in one chip. AMD lists the package as BGA-769 in its specification material.
Quick facts
| Maker | AMD |
|---|---|
| Package type | BGA |
| Contacts | 769 |
| Package size | 24.5 × 24.5 mm |
| Introduced | May 2013 |
| Status | Legacy |
| Memory | DDR3-1600, one or two channels, ECC on selected designs |
| PCIe from the CPU | PCIe 2.0 with up to 8 lanes from the SoC |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package arrived in May 2013 with Kabini and Temash for notebooks and tablets, then served Kyoto Opteron X1100 and X2100 parts for micro servers. Steppe Eagle refreshed the line in 2016 with Puma cores, including the Opteron X2170 at 2.4 GHz and 25 W with Radeon R5E graphics. All variants share the same ball pattern, with FT3b boards accepting FT3 parts where listed.
Memory stays DDR3 across the family, up to 1600 MT/s with ECC on selected embedded designs. PCIe runs at version 2.0 with up to 8 lanes from the SoC for storage and board devices. Because the chip is soldered, core count and graphics tier are fixed at purchase.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Kabini | A-series and E-series Kabini | 2013 | Jaguar based mobile and embedded APUs with GCN graphics, launched in May 2013 on Socket FT3 with DDR3. |
| Temash | A-series Temash tablets | 2013 | Low power Jaguar APUs for tablets and convertibles, launched in 2013 on Socket FT3 with DDR3. |
| Kyoto | Opteron X1100 and X2100 Kyoto | 2013 to 2014 | Jaguar based embedded server APUs including X1150 and X2150, launched in May 2013 on Socket FT3 with DDR3 and ECC on selected boards. |
| Steppe Eagle | Opteron X2000 Steppe Eagle | 2016 | Puma based embedded APUs including X2170 at 2.4 GHz and 25 W, launched in September 2016 on Socket FT3 with DDR3. |
| Beema | E-series Beema | 2014 to 2015 | Puma based entry notebook APUs including E1-6015 at 1.4 GHz and 10 W with Radeon R2 graphics, launched in 2015 on Socket FT3 with DDR3. |
| Carrizo-L | E-series Carrizo-L | 2015 | Puma based entry notebook APUs including E2-7110 at 1.8 GHz and 15 W with Radeon R2 graphics, launched in May 2015 on Socket FT3 with DDR3L. |
| Mullins | Micro APUs for tablets | 2014 | Puma based tablet SoCs with 2 to 4 cores at 4 W and 5 W, launched in April 2014. |
Who Socket FT3 serves
Socket FT3 belongs in fanless tablets, small notebooks, micro servers and embedded boards where 9 W to 25 W matters. Kyoto Opteron parts target cold storage and communications gear with ECC memory. Steppe Eagle parts such as X2170 target industrial controllers and edge boxes that need four x86 cores with graphics on one board.
Boards pair the SoC with SODIMM or UDIMM slots for DDR3, plus SATA and USB from the integrated hub. Display outputs drive control panels directly from Radeon graphics, so many designs run without a discrete card. Power input stays modest, which suits DIN rail and compact chassis builds.
Memory and PCIe
Memory support covers DDR3 SODIMM and UDIMM modules up to 1600 MT/s across one or two channels. ECC works on selected embedded boards for storage nodes. Matched pairs lift graphics and file throughput where bandwidth matters.
PCIe arrives as version 2.0 with up to 8 lanes from the SoC, wired as one x4 graphics link plus configurable general purpose ports. Boards split lanes between SATA controllers, Ethernet and Mini PCIe slots per manual. Gen3 cards run at Gen2 speed here, which still covers control and storage traffic.
Identification is simple in maker documents: package reads BGA769 and size reads 24.5 mm x 24.5 mm. That line separates FT3 from AM1 desktop parts at 721 pins and from FP4 mobile parts at 769 contacts with a different ball map. The LGA, PGA and BGA: CPU package types explained guide explains why soldered packages cannot move between boards.
CPUs on Socket FT3
31 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| AMD Opteron X2170 | 4 / 4 | 2.4 GHz | 25 W | Sep 2016 |
| AMD E2-7110 | 4 / 4 | 1.8 GHz | 15 W | May 2015 |
| AMD E1-6015 | 2 / 2 | 1.4 GHz | 10 W | Apr 2015 |
| AMD A4 PRO-3340B | 4 / 4 | 2.2 GHz | 25 W | Dec 2014 |
| AMD A10 Micro-6700T | 4 / 4 | 1.2 / 2.2 GHz | 4.5 W | Apr 2014 |
| AMD A4 Micro-6400T | 4 / 4 | 1.0 / 1.6 GHz | 4.5 W | Apr 2014 |
| AMD A4-6210 | 4 / 4 | 1.8 GHz | 15 W | Apr 2014 |
| AMD A4-6250J | 4 / 4 | 2.0 GHz | 25 W | Apr 2014 |
| AMD A6 Micro-6500T | 4 / 4 | 1.2 / 1.8 GHz | 5 W | Apr 2014 |
| AMD A6-6310 | 4 / 4 | 1.8 / 2.4 GHz | 15 W | Apr 2014 |
| AMD A8-6410 | 4 / 4 | 2.0 / 2.4 GHz | 15 W | Apr 2014 |
| AMD E1 Micro-6200T | 2 / 2 | 1.0 / 1.4 GHz | 3.95 W | Apr 2014 |
| AMD E1-6010 | 2 / 2 | 1.35 GHz | 10 W | Apr 2014 |
| AMD E2-6110 | 4 / 4 | 1.5 GHz | 15 W | Apr 2014 |
| AMD A4-5050 | 4 / 4 | 1.55 GHz | 13.5 W | Feb 2014 |
| AMD E1-2150 | 2 / 2 | 1.05 GHz | n/a | Feb 2014 |
| AMD E2-3800 | 4 / 4 | 1.3 GHz | 15 W | Jan 2014 |
| AMD A4-5100 | 4 / 4 | 1.55 GHz | 15 W | Nov 2013 |
| AMD E1-2200 | 2 / 2 | 1.05 GHz | 9 W | Nov 2013 |
| AMD A4-1350 | 4 / 4 | 1.0 GHz | 8 W | Oct 2013 |
| AMD A4-1200 | 2 / 2 | 1.0 GHz | 4 W | May 2013 |
| AMD A4-1250 | 2 / 2 | 1.0 GHz | 8 W | May 2013 |
| AMD A4-5000 | 4 / 4 | 1.5 GHz | 15 W | May 2013 |
| AMD A6-1450 | 4 / 4 | 1.0 / 1.4 GHz | 8 W | May 2013 |
| AMD A6-5200 | 4 / 4 | 2.0 GHz | 25 W | May 2013 |
| AMD E1-2100 | 2 / 2 | 1.0 GHz | 9 W | May 2013 |
| AMD E1-2500 | 2 / 2 | 1.4 GHz | 15 W | May 2013 |
| AMD E2-3000 | 2 / 2 | 1.65 GHz | 15 W | May 2013 |
| AMD Opteron X1150 | 4 / 4 | 2.0 GHz | 17 W | May 2013 |
| AMD Opteron X2150 | 4 / 4 | 1.9 GHz | 22 W | May 2013 |
| AMD GX-210UA | 2 / 2 | 1.0 GHz | 9 W | Apr 2013 |
Frequently asked questions
Can a Socket FT3 processor be replaced or upgraded?
No. The chip solders to the board with 769 balls. Replacement means changing the board or the whole device.
What is the difference between Socket FT3 and Socket AM1?
Socket FT3 at 769 contacts serves Jaguar Kabini, Temash and Kyoto plus Puma Steppe Eagle parts such as X2170 with DDR3. Socket AM1 at 721 pins serves desktop Kabini with DDR3. The two do not interchange.
What memory does Socket FT3 use?
Boards use DDR3 up to 1600 MT/s in one or two channels, with ECC on selected embedded designs. The X2170 uses DDR3 through its integrated controller.
What PCIe does Socket FT3 provide?
PCIe 2.0 with up to 8 lanes from the SoC for board devices and storage. Exact wiring follows the embedded board design.
Sources and verification
Facts last checked against these sources on . Page last edited on .