AMD A4-6250J socket: Socket FT3

The AMD A4-6250J uses the Socket FT3 socket as a soldered BGA chip and cannot be replaced. It is a quad core Beema APU at 2.0 GHz and 25 W with Radeon R3 graphics for embedded boards.

Launched
April 2014
Cores and threads
4 and 4
Default TDP
25 W
Codename
Beema
Segment
Mobile (soldered)
Family
AMD A4
Clocks
2.0 GHz

AMD A4-6250J specifications

Cores4
Threads4
Core architecturePuma cores on 28 nm
Clocks2.0 GHz (no boost)
Cache2 MB shared L2 cache
Processor base power (TDP)25 W
Manufacturing process28 nm
Memory supportDDR3, single channel
PCI ExpressPCIe 2.0, up to 8 lanes
Integrated graphicsAMD Radeon R3
MultiplierLocked
PackageSocket FT3 (BGA769, soldered)

Motherboard compatibility

AMD A4-6250J needs a motherboard with a Socket FT3 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket FT3 chipset list and the board maker's CPU support list.

Socket FT3 at a glance

TypeBGA, 769 contacts
Package size24.5 × 24.5 mm
IntroducedMay 2013
MemoryDDR3-1600, one or two channels, ECC on selected designs
Cooler mounting holesNot applicable (soldered)

Read the full Socket FT3 socket guide

What the A4-6250J is

The A4-6250J is a higher power Beema quad on Socket FT3 for embedded boards. It runs 4 Puma cores and 4 threads at a fixed 2.0 GHz with 2 MB of shared L2 cache. Power is 25 W on 28 nm from April 2014. The soldered BGA package suits boards that never expect a chip swap.

The 2.0 GHz fixed clock leads Beema A4 embedded parts for control workloads. Four threads handle gateway services with background tasks. The 25 W envelope allows small fans or large passive sinks. Desktop placement in the databases reflects board use rather than a socketed desktop chip.

Radeon R3 graphics cover setup displays and light signage. DDR3 over one channel feeds cores and graphics. Buyers pick the 6250J where embedded Beema boards need the fastest fixed A4 clocks.

Socket and motherboard compatibility

The A4-6250J solders to the board on Socket FT3 and cannot be replaced. Embedded vendors validate memory and I/O for long lifecycles. The socket FT3 Beema generation covers this part.

Single channel DDR3 is fixed by the SoC. The LGA, PGA and BGA: CPU package types explained guide explains soldered embedded design. Confirm operating temperature ratings for field installs.

Memory, PCIe and cooling

DDR3 over a single channel suits embedded control duty. Size memory once for the whole workload. ECC is not offered on these value parts.

PCIe 2.0 with up to 8 lanes from the SoC serves NICs and flash. Appliances use lanes for network expansion. Small SSDs hold logging data.

Cooling uses embedded heatsinks for 25 W. Fixed clocks keep thermals steady. Wide temperature builds need validated paths.

Upgrade paths

No soldered upgrade exists. Compare the AMD A4-6210 at 1.8 GHz with 15 W tuning nearby, or the AMD A6-6310 at 1.8 GHz to 2.4 GHz with R4 graphics above. All share FT3 boards.

A new embedded platform needs a new board. The How to find your CPU socket type guide helps identify soldered AMD boards.

Frequently asked questions

What socket does the AMD A4-6250J use?

It uses Socket FT3 as a soldered BGA chip.

How many cores does the A4-6250J have?

Four cores and four threads at 2.0 GHz with 2 MB of shared L2 cache.

Which graphics does the A4-6250J include?

AMD Radeon R3 for setup displays.

What is the TDP of the A4-6250J?

25 W.

Sources and verification

  1. A4-6250J specs (Technical City, socket and clocks)
  2. AMD A4-6250J APU Benchmark (PassMark, class and cache)

Facts last checked against these sources on . Page last edited on .