AMD E1-2200 socket: Socket FT3

The AMD E1-2200 uses the Socket FT3 package soldered to notebook boards. It is a dual core Kabini APU at 1.05 GHz and 9 W with Radeon HD 8210 graphics.

Launched
November 2013
Cores and threads
2 and 2
Default TDP
9 W
Codename
Kabini
Segment
Mobile (soldered)
Clocks
1.05 GHz

AMD E1-2200 specifications

Cores2
Threads2
Core architectureJaguar cores on 28 nm
Clocks1.05 GHz (no boost)
Cache1 MB shared L2 cache
Default TDP9 W
Manufacturing process28 nm
Memory supportDDR3L-1333, single channel
PCI ExpressPCIe 2.0, up to 8 lanes
Integrated graphicsAMD Radeon HD 8210
MultiplierLocked
PackageSocket FT3 (BGA769, soldered)

Motherboard compatibility

AMD E1-2200 needs a motherboard with a Socket FT3 socket. Chipset by chipset data for this codename is not recorded yet. See the Socket FT3 chipset list and the board maker's CPU support list.

Socket FT3 at a glance

TypeBGA, 769 contacts
Package size24.5 × 24.5 mm
IntroducedMay 2013
MemoryDDR3-1600, one or two channels, ECC on selected designs
Cooler mounting holesNot applicable (soldered)

Read the full Socket FT3 socket guide

What the E1-2200 is

The E1-2200 is a late Kabini Jaguar refresh for budget notebooks on Socket FT3. AMD set two Jaguar cores at 1.05 GHz with 1 MB of shared L2 cache. Power is 9 W on 28 nm from November 2013. Radeon HD 8210 graphics cover school work and video. A small clock step over the 1.0 GHz E1-2100 suits late production laptops with the same cooling.

Slightly higher fixed clocks help single thread apps without leaving the 9 W class. Two threads handle browsing with background tools and an SSD. Integrated graphics decode video for laptop panels. The soldered package locks memory at purchase. Panel and SSD quality shape feel more than 50 MHz in these bodies.

Single channel DDR3L feeds cores and graphics. The 9 W envelope fits thin notebook pipes and small fans. The E1-2200 covers late budget laptops where a small refresh step at 9 W is wanted.

Socket and motherboard compatibility

The E1-2200 solders to Socket FT3 as BGA769. No socket exists and no swap is possible. The chip cannot be replaced. Boards wire memory per laptop model. Maker specs set exact ceilings.

The LGA, PGA and BGA: CPU package types explained guide explains soldered notebook limits. Storage and wireless are the later changes. A faster laptop needs a new board.

Temash and Kabini share the FT3 package class but target different thermals. Boards never cross between slate and notebook lines.

Memory, PCIe and cooling

DDR3L-1333 class memory in a single channel suits budget laptops. Four gigabytes covers school images. Soldered sizes lock at order. Bandwidth fits HD panels.

PCIe 2.0 with up to 8 lanes from the SoC serves radios and storage. Notebook wiring follows the model. Maker manuals list slots.

Cooling is a small pipe and fan for 9 W with pattern Not applicable (soldered). No boxed cooler exists. Keep intakes clear for steady 1.05 GHz use.

Upgrade paths

On the same soldered line the AMD E1-2100 at 1.0 GHz is a slightly slower twin on similar boards. The AMD E1-2500 at 1.4 GHz adds speed where 15 W cooling allows. Both share FT3 fit.

A modern laptop needs a new platform. The E1-2200 holds late budget notebooks where 1.05 GHz dual cores at 9 W suffice.

Frequently asked questions

What socket does the E1-2200 use?

It uses Socket FT3, soldered. It cannot be replaced.

How many cores does the E1-2200 have?

Two cores at 1.05 GHz with 1 MB of shared L2 cache.

Which graphics does the E1-2200 include?

AMD Radeon HD 8210.

What is the TDP of the E1-2200?

9 W for budget notebooks.

Sources and verification

  1. Jaguar microarchitecture (Wikipedia, Kabini E-Series notebook data)
  2. Bobcat microarchitecture (Wikipedia, Kabini succession context)

Facts last checked against these sources on . Page last edited on .