Intel Xeon E-2276M socket: BGA 1440
The Intel Xeon E-2276M uses BGA 1440, a soldered mobile workstation package. The six core 45 W chip cannot be replaced.
- Socket
- BGA 1440
- Launched
- May 2019
- Cores and threads
- 6 and 12
- Base power
- 45 W
- Codename
- Coffee Lake-H
- Segment
- Mobile (soldered)
- Family
- Intel Xeon E
- Clocks
- 2.8 / 4.7 GHz
Intel Xeon E-2276M specifications
| Cores | 6 |
|---|---|
| Threads | 12 |
| Core architecture | Coffee Lake-H cores on 14 nm |
| Clocks | 2.8 GHz base, up to 4.7 GHz with Turbo Boost 2.0 |
| Cache | 12 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 45 W (35 W configurable down) |
| Manufacturing process | 14 nm |
| Memory support | DDR4-2666 and LPDDR3-2133 ECC, two channels, up to 128 GB |
| PCI Express | 16 lanes from the CPU, PCIe 3.0 |
| Integrated graphics | Intel UHD Graphics P630 (350 MHz to 1.2 GHz) |
| Multiplier | Locked |
| ECC memory | Supported |
| Package | FCBGA1440 (42 by 28 mm, soldered) |
Motherboard compatibility
Intel Xeon E-2276M needs a motherboard with a BGA 1440 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1440 chipset list and the board maker's CPU support list.
BGA 1440 at a glance
| Type | BGA, 1,440 contacts |
|---|---|
| Package size | 42 × 28 mm |
| Introduced | April 2018 |
| Memory | DDR4-2933 on Comet Lake-H and DDR4-2666 on Coffee Lake-H, two channels, up to 128 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Xeon E-2276M is
The Xeon E-2276M brings six cores with Hyper-Threading to mobile workstations in a soldered package. It launched in the second quarter of 2019 with a 2.8 GHz base and up to 4.7 GHz boost at 45 W. Intel positions it for field engineering laptops that need ECC away from the desk.
Twelve megabytes of Smart Cache support CAD viewers and compile jobs across twelve threads. The lower base versus desktop Xeon E parts stretches battery and thermals, while boost still reaches 4.7 GHz for interactive peaks. Twelve threads keep design and analysis tools apart on the road.
UHD Graphics P630 from 350 MHz to 1.2 GHz drives laptop displays and external monitors for docked use. The process is 14 nm and the multiplier is locked. ECC memory is supported in two channels, which is rare for mobile parts and suits workstation reliability.
Socket and motherboard compatibility
The E-2276M solders to BGA 1440 permanently. Laptop makers tune the 45 W envelope with dual fan cooling and 35 W down configuration for thin mobile workstations. There is no socketed path to another chip.
Memory is DDR4-2666 or LPDDR3-2133 in two channels up to 128 GB with ECC where the board wires it. Mobile workstation boards validate specific SO-DIMM ECC kits. The How to find your CPU socket type guide shows where maker specs list FCBGA1440.
BGA 1528 thin laptop boards cannot take this 45 W part. Power and package differ entirely. Upgrading means replacing the laptop, so memory size at order time matters.
Memory, PCIe and cooling
DDR4-2666 SO-DIMMs or LPDDR3-2133 in two channels up to 128 GB cover mobile workstation use. ECC operation needs both a capable board and ECC SO-DIMMs. Matched pairs help P630 graphics when docked without a discrete GPU.
PCIe 3.0 with up to 16 lanes from the CPU feeds a mobile workstation GPU and NVMe storage. Most designs pair a Quadro with fast SSD for field rendering. Exact lane splits follow the laptop board layout.
Cooling is custom per laptop with shared CPU and GPU heat pipes for 45 W plus graphics. Sustained loads settle near base clocks in thin chassis. No retail cooler pattern exists, since the package solders directly and service follows the maker manual.
Upgrade paths
Soldered BGA blocks CPU upgrades. Memory expansion where slots exist and larger NVMe storage extend field life. Battery service restores travel use after heavy cycles.
Within mobile workstations, larger BGA 1440 SKUs with eight cores offer more threads on the same BGA 1440 family where the chassis allows. The desktop Intel Xeon E-2276G gives similar six cores at higher clocks on LGA 1151 for desk towers. Both need board checks for support.
Past BGA 1440 a new laptop is required. The E-2276M covers mobile ECC work where six cores must travel, and only a full system replacement justifies moving on.
Frequently asked questions
What socket does the Intel Xeon E-2276M use?
It uses BGA 1440 soldered to the mobile workstation board, listed as FCBGA1440 by Intel.
How many cores does the E-2276M have?
Six cores with Hyper-Threading give twelve threads. Base is 2.8 GHz with boost to 4.7 GHz.
Can the E-2276M be replaced or upgraded?
No. The chip solders directly. Upgrading means replacing the board or the whole laptop.
What memory does the E-2276M support?
DDR4-2666 or LPDDR3-2133 ECC in two channels up to 128 GB, where the board supports ECC.
When did the E-2276M launch?
May 2019 in the second quarter of 2019 with mobile Xeon E parts.
Sources and verification
Facts last checked against these sources on . Page last edited on .