Intel Core i3-9100HL socket: BGA 1440

The Intel Core i3-9100HL uses BGA 1440, a soldered embedded package. The quad core 25 W chip cannot be replaced.

Socket
BGA 1440
Launched
April 2019
Cores and threads
4 and 4
Base power
25 W
Codename
Coffee Lake
Segment
Embedded
Clocks
1.6 / 2.9 GHz

Intel Core i3-9100HL specifications

Cores4
Threads4
Core architectureSkylake based cores on 14 nm
Clocks1.6 GHz base, up to 2.9 GHz with Turbo Boost 2.0
Cache6 MB Intel Smart Cache (L3)
Processor base power (TDP)25 W
Manufacturing process14 nm
Memory supportDDR4-2666 ECC, two channels, up to 64 GB
PCI Express16 lanes from the CPU, PCIe 3.0
Integrated graphicsIntel UHD Graphics 630 (350 MHz base, up to 1.1 GHz)
MultiplierLocked
ECC memorySupported, DDR4 ECC
PackageFCBGA1440 (42 by 28 mm, soldered)

Motherboard compatibility

Intel Core i3-9100HL needs a motherboard with a BGA 1440 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1440 chipset list and the board maker's CPU support list.

BGA 1440 at a glance

TypeBGA, 1,440 contacts
Package size42 × 28 mm
IntroducedApril 2018
MemoryDDR4-2933 on Comet Lake-H and DDR4-2666 on Coffee Lake-H, two channels, up to 128 GB
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1440 socket guide

What the Core i3-9100HL is

The Core i3-9100HL is a four core, four thread embedded processor with Coffee Lake silicon in a soldered package. It launched in the second quarter of 2019 with a 1.6 GHz base and up to 2.9 GHz boost at 25 W. The HL suffix marks embedded use with long supply.

Six megabytes of Smart Cache back control loops and thin clients. There is no Hyper-Threading on this i3. The 25 W envelope fits compact boards that cannot cool socketed desktop chips.

UHD Graphics 630 drive operator panels without a card. ECC memory support guards industrial uptime. Soldering removes socket cost and height for dense enclosures.

Socket and motherboard compatibility

The 9100HL solders to BGA 1440 at 42 by 28 mm permanently. Embedded carriers define memory slots, display outputs and I/O for the application. There is no socketed path.

Board makers validate 25 W thermals in sealed compact cases. ECC UDIMM needs a carrier with validation. The LGA, PGA and BGA: CPU package types explained guide explains soldered embedded practice.

Desktop LGA 1151 boards cannot host the BGA chip despite shared Coffee Lake silicon. Package and firmware differ.

Memory, PCIe and cooling

DDR4-2666 ECC in two channels up to 64 GB is the rated embedded memory. Compact carriers use SODIMM slots for serviceability. ECC corrects errors during continuous duty.

Sixteen PCIe 3.0 lanes split for NICs, capture and NVMe per carrier design. Industrial carriers often dedicate x8 to networking. Chipset style board logic adds serial and USB.

Cooling is a compact 25 W block with case airflow. Sealed enclosures need vent paths for sustained boost. No retail cooler pattern exists.

Upgrade paths

Soldered packaging blocks processor upgrades. Memory and storage growth extend embedded service. Carrier replacement is the performance path.

Newer embedded BGA platforms bring current cores for requalification cycles. For 9100HL fleets, spare carriers matter more than faster chips.

Frequently asked questions

What socket does the Intel Core i3-9100HL use?

It uses BGA 1440 soldered to the embedded carrier.

What does HL mean?

An embedded soldered package variant with long supply for industrial boards.

Does the 9100HL support ECC?

Yes, DDR4 ECC on validated carriers.

How fast is the 9100HL?

1.6 GHz base with up to 2.9 GHz boost across four cores.

When did the 9100HL launch?

Second quarter of 2019 with the Coffee Lake embedded line.

Sources and verification

  1. Intel Core i3-9100HL specifications (Intel)
  2. Intel Core i3-9100T specs (CPU-Compare, same Coffee Lake family pattern)

Facts last checked against these sources on . Page last edited on .