Intel Core i3-2357M socket: BGA 1023
The Intel Core i3-2357M uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part at 1.3 GHz with Hyper-Threading and cannot be replaced.
- Socket
- BGA 1023
- Launched
- June 2011
- Cores and threads
- 2 and 4
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 1.3 GHz
Intel Core i3-2357M specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.3 GHz (no turbo) |
| Cache | 3 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics 3000 (350 MHz to 950 MHz) |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Core i3-2357M needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-2357M is
Intel Core i3-2357M is a dual core Sandy Bridge mobile processor that Intel released in June 2011 for thin soldered laptops. It runs at a fixed 1.3 GHz with no turbo and includes Hyper-Threading, so 2 cores give 4 threads. Cache is 3 MB Intel Smart Cache. Power is 17 W on a 32 nm process.
Four threads at 17 W suit thin bodies for office work and travel. The chip trades clocks for battery life and low fan noise. Heavy compiles still wait on the 1.3 GHz ceiling.
Graphics are Intel HD Graphics 3000 at 350 MHz to 950 MHz. The block covers thin panels and video without a card. The How to find your CPU socket type guide shows how to confirm the soldered package.
Socket and motherboard compatibility
The Core i3-2357M solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.
The BIOS must list the exact 2357M string. The Socket vs chipset: what decides whether a CPU works guide explains why that list matters more than the chipset name.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Soldered RAM locks size at purchase on the thinnest bodies. Two channels still help shared graphics.
PCI Express lanes come from the CPU for Wi-Fi and storage. No graphics slot exists at 17 W.
Cooling is a slim 17 W spreader and fan. Cleaning keeps fan noise down under office loads.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The 2357M cannot be removed, so a faster thin laptop means a new board or a new device. A nearby soldered part at higher clocks is Intel Core i3-2367M.
A platform move means a new thin laptop on a current BGA package. Keep the old body for spare duty after a wipe.
Frequently asked questions
What socket does the Intel Core i3-2357M use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
Does the Core i3-2357M have Hyper-Threading?
Yes. Two cores give 4 threads.
What memory does the Core i3-2357M use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Core i3-2357M be upgraded?
No. Soldered BGA parts need a board or laptop replacement for more speed.
Sources and verification
- List of Intel Core i3 processors (Wikipedia, 2357M 1.3 GHz HD3000 350 to 950 17 W BGA-1023 June 2011)
- Intel Core i3-2357M Processor (Intel ARK, 1.3 GHz, 3M Cache)
Facts last checked against these sources on . Page last edited on .