Intel Core i3-2367M socket: BGA 1023
The Intel Core i3-2367M uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part at 1.4 GHz with Hyper-Threading and cannot be replaced.
- Socket
- BGA 1023
- Launched
- October 2011
- Cores and threads
- 2 and 4
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 1.4 GHz
Intel Core i3-2367M specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.4 GHz (no turbo) |
| Cache | 3 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics 3000 (350 MHz to 1000 MHz) |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Core i3-2367M needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-2367M is
Intel Core i3-2367M is a dual core Sandy Bridge mobile processor that Intel released in October 2011 for thin soldered laptops. It runs at a fixed 1.4 GHz with no turbo and includes Hyper-Threading, so 2 cores give 4 threads. Cache is 3 MB Intel Smart Cache. Power is 17 W on a 32 nm process.
The 100 MHz lift over the 2357M trims load times in office apps. Sales started October 1, 2011 at a $250 recommended price. The 17 W envelope allows slim bodies with small fans.
Graphics are Intel HD Graphics 3000 at 350 MHz to 1000 MHz. The block drives thin panels and an external monitor through board outputs. The controller takes DDR3 at 1066 or 1333 MT/s.
Socket and motherboard compatibility
The Core i3-2367M solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS. A different BGA part is not a field option.
The BIOS string must match exactly. The Socket vs chipset: what decides whether a CPU works guide covers why support lists decide compatibility.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Matched modules help shared graphics at low clocks. ECC is not supported.
PCI Express is revision 2.0 with up to 16 lanes from the CPU. Boards wire lanes per chassis, so no single lane map fits all 2367M devices.
Cooling is a slim 17 W thermal assembly. The CPU cooler compatibility by socket guide notes soldered laptops keep board specific cooling with no retail mount.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The 2367M cannot be lifted, so more speed means a new board or a new thin device. A nearby soldered part at lower clocks is Intel Core i3-2357M.
For a running 2367M box the useful work is storage and memory. Add an SSD where the chassis allows it and keep the system for light duty.
Frequently asked questions
What socket does the Intel Core i3-2367M use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
How is the Core i3-2367M different from the 2357M?
Base is 1.4 GHz instead of 1.3 GHz. Cache, power and package match.
What memory does the Core i3-2367M use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Core i3-2367M be upgraded?
No. A faster thin device means a new board or a new laptop.
Sources and verification
- Intel Core i3-2367M Processor (Intel ARK, 1.4 GHz, 4 threads, 17 W, HD3000 350 to 1000, BGA1023)
- Core i3-2367M (Technical City, 1.4 GHz, 17 W, Oct 2011, HD3000)
Facts last checked against these sources on . Page last edited on .