Intel Core i3-2340UE socket: BGA 1023
The Intel Core i3-2340UE uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge embedded part at 1.3 GHz with Hyper-Threading and cannot be replaced.
- Socket
- BGA 1023
- Launched
- June 2011
- Cores and threads
- 2 and 4
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Embedded
- Family
- Intel Core i3
- Clocks
- 1.3 GHz
Intel Core i3-2340UE specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.3 GHz (no turbo) |
| Cache | 3 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB, ECC supported on embedded carriers |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics 3000 (350 MHz to 800 MHz) |
| Multiplier | Locked |
| ECC memory | Supported (requires embedded carrier) |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Core i3-2340UE needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-2340UE is
Intel Core i3-2340UE is a dual core Sandy Bridge embedded processor that Intel released in June 2011 for soldered low power boards. It runs at a fixed 1.3 GHz with no turbo and includes Hyper-Threading, so 2 cores give 4 threads. Cache is 3 MB Intel Smart Cache. Power is 17 W on a 32 nm process.
The UE suffix marks ultra low power embedded with ECC memory. Four threads at 17 W suit fanless kiosks and control boxes. The chip trades clocks for thermal headroom and long supply.
Graphics are Intel HD Graphics 3000 at 350 MHz to 800 MHz. The block drives embedded panels at low power. Memory is DDR3 with ECC in two channels.
Socket and motherboard compatibility
The Core i3-2340UE solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Embedded carriers qualify each board for fixed strings. Factory rework is the only way to change the chip.
The carrier BIOS must list the exact 2340UE string. The Socket vs chipset: what decides whether a CPU works guide explains why maker lists decide embedded compatibility.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB with ECC on embedded carriers. ECC matters for always on control tasks. Capacity follows the carrier design.
PCI Express lanes come from the CPU for network and storage. Lane splits vary by carrier.
Cooling is a slim 17 W embedded spreader, often fanless with chassis airflow. Keep vents clear to hold the fixed 1.3 GHz behavior.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The 2340UE cannot be lifted, so more speed means a new carrier. A nearby soldered embedded part at higher power is Intel Celeron 1020E.
A platform move means a new embedded box on a current package. Keep the old carrier for spare duty after a wipe.
Frequently asked questions
What socket does the Intel Core i3-2340UE use?
It uses BGA 1023, a soldered embedded package. The chip cannot be removed.
Does the Core i3-2340UE have Hyper-Threading?
Yes. Two cores give 4 threads.
What memory does the Core i3-2340UE use?
DDR3-1066 and 1333 with ECC on embedded carriers, two channels, up to 16 GB.
Can the Core i3-2340UE be upgraded?
No. Soldered embedded parts need a new carrier for more speed.
Sources and verification
- List of Intel Core i3 processors (Wikipedia, 2340UE 1.3 GHz HD3000 350 to 800 ECC BGA-1023 June 2011)
- Legacy Intel Core Processors (Intel ARK, i3-2340UE Q2-11 HD3000)
Facts last checked against these sources on . Page last edited on .