Intel Celeron 857 socket: BGA 1023
The Intel Celeron 857 uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part at 1.2 GHz and cannot be replaced.
- Socket
- BGA 1023
- Launched
- July 2011
- Cores and threads
- 2 and 2
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Celeron
- Clocks
- 1.2 GHz
Intel Celeron 857 specifications
| Cores | 2 |
|---|---|
| Threads | 2 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.2 GHz (no turbo) |
| Cache | 2 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Celeron 857 needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Celeron 857 is
Intel Celeron 857 is a dual core Sandy Bridge mobile processor that Intel released in July 2011 for soldered thin laptops. It runs at a fixed 1.2 GHz with no turbo and no Hyper-Threading, so 2 cores give 2 threads. Cache is 2 MB Intel Smart Cache. Power is 17 W on a 32 nm process.
The 100 MHz lift over the 847 trims load times in office apps. Video calls and document work feel a touch smoother. Long compiles and large photo edits remain outside its scope.
Graphics are Intel HD Graphics for Sandy Bridge. The block covers internal panels and board display outputs. Thin bodies pair the chip with 2 GB to 4 GB of DDR3 and small drives. The How to find your CPU socket type guide helps confirm the soldered form from the service tag.
Socket and motherboard compatibility
The Celeron 857 solders to BGA 1023 with 1,023 balls and cannot be moved. Each laptop model ships with a fixed board and BIOS for this exact string. Swapping to another BGA number is factory work, not a field upgrade.
Mobile 6 series era boards carried the early soldered Sandy parts. Support depends on the laptop maker list rather than the chipset badge.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Thin chassis often solder one or both channels, so capacity locks at purchase. Check the manual before assuming a slot is free.
PCI Express lanes come from the CPU for Wi-Fi and storage. Lane splits vary by board design.
Cooling is a slim 17 W assembly with a small fan. Keep vents clear to hold the fixed 1.2 GHz behavior.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The Celeron 857 cannot be removed, so a faster thin laptop means a new device. A nearby soldered dual at higher clocks is Intel Celeron 877.
For a working 857 laptop the practical steps are an SSD and a clean OS install. Keep it for travel or spare use after the main machine moves on.
Frequently asked questions
What socket does the Intel Celeron 857 use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
How is the Celeron 857 different from the 847?
Base is 1.2 GHz instead of 1.1 GHz. Cache, power and package match.
What memory does the Celeron 857 use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Celeron 857 be upgraded?
No. Soldered parts need a board or laptop replacement for more speed.
Sources and verification
- Celeron 700/800/900-Series list (cpu-infos, 857 2 cores 1.2 GHz Sandy Bridge)
- Intel Mobile Celeron Dual-Core family (CPU-Upgrade, 857 BGA1023 17 W)
Facts last checked against these sources on . Page last edited on .