Intel Core i5-2537M socket: BGA 1023
The Intel Core i5-2537M uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part at 1.4 GHz with turbo to 2.3 GHz and cannot be replaced.
- Socket
- BGA 1023
- Launched
- February 2011
- Cores and threads
- 2 and 4
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Core i5
- Clocks
- 1.4 / 2.3 GHz
Intel Core i5-2537M specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.4 GHz base, 2.3 GHz turbo |
| Cache | 3 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | PCIe lanes from the CPU (layout varies by board design) |
| Integrated graphics | Intel HD Graphics 3000 (350 MHz to 900 MHz) |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Core i5-2537M needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i5-2537M is
Intel Core i5-2537M is a dual core Sandy Bridge mobile processor that Intel released in February 2011 for thin soldered laptops. It runs at 1.4 GHz base with turbo to 2.3 GHz on one core and includes Hyper-Threading, so 2 cores give 4 threads. Cache is 3 MB Intel Smart Cache. Power is 17 W on a 32 nm process.
Turbo lifts single threaded tasks well above the low base clock. Office suites and browsing feel quick for a 17 W part. The chip trades sustained clocks for battery life.
Graphics are Intel HD Graphics 3000 at 350 MHz to 900 MHz. The block covers thin panels and video without a card. The How to find your CPU socket type guide shows how to confirm the soldered package.
Socket and motherboard compatibility
The Core i5-2537M solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.
The BIOS must list the exact 2537M string. The Socket vs chipset: what decides whether a CPU works guide explains why that list matters more than the chipset name.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Soldered RAM locks size at purchase on the thinnest bodies. Two channels still help shared graphics.
PCI Express lanes come from the CPU for Wi-Fi and storage. No graphics slot exists at 17 W.
Cooling is a slim 17 W spreader and fan. Cleaning keeps fan noise down under office loads.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The 2537M cannot be removed, so a faster thin laptop means a new board or a new device. A nearby soldered ULV part at higher base clocks is the 2467M class.
A platform move means a new thin laptop on a current BGA package. Keep the old body for spare duty after a wipe.
Frequently asked questions
What socket does the Intel Core i5-2537M use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
Does the Core i5-2537M have Hyper-Threading?
Yes. Two cores give 4 threads.
What memory does the Core i5-2537M use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Core i5-2537M be upgraded?
No. Soldered BGA parts need a board or laptop replacement for more speed.
Sources and verification
- Intel Core i5-2537M Processor (Intel ARK, up to 2.3 GHz)
- Intel Core i5-2537M vs 2415M (Notebookcheck, 2537M 1.4 to 2.3 GHz BGA1023)
Facts last checked against these sources on . Page last edited on .