Intel Celeron 847 socket: BGA 1023

The Intel Celeron 847 uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part at 1.1 GHz and cannot be replaced.

Socket
BGA 1023
Launched
June 2011
Cores and threads
2 and 2
Base power
17 W
Codename
Sandy Bridge
Segment
Mobile (soldered)
Clocks
1.1 GHz

Intel Celeron 847 specifications

Cores2
Threads2
Core architectureSandy Bridge cores on 32 nm
Clocks1.1 GHz (no turbo)
Cache2 MB Intel Smart Cache (L3)
Processor base power (TDP)17 W
Manufacturing process32 nm
Memory supportDDR3-1066 and 1333, two channels, up to 16 GB
PCI ExpressPCIe lanes from the CPU (layout varies by board design)
Integrated graphicsIntel HD Graphics (350 MHz to 800 MHz)
MultiplierLocked
PackageBGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered)

Motherboard compatibility

Intel Celeron 847 needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.

BGA 1023 at a glance

TypeBGA, 1,023 contacts
Package size31 × 24 mm
IntroducedJanuary 2011
MemoryDDR3 and DDR3L, two channels, 1066 to 1600 MT/s
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1023 socket guide

What the Celeron 847 is

Intel Celeron 847 is a dual core Sandy Bridge mobile processor that Intel released in June 2011 for thin soldered laptops and compact nettops. It runs at a fixed 1.1 GHz with no turbo and no Hyper-Threading, so 2 cores give 2 threads. Cache is 2 MB Intel Smart Cache. Power is 17 W on a 32 nm process.

Two cores at low clocks handle office documents, browsing and playback. Heavy multitasking still waits on the 1.1 GHz ceiling. The 17 W envelope allows slim bodies with small fans.

Graphics are Intel HD Graphics for Sandy Bridge at 350 MHz to 800 MHz. The block drives thin panels and an external monitor through board outputs. The controller takes DDR3 at 1066 or 1333 MT/s.

Socket and motherboard compatibility

The Celeron 847 solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS. A different BGA part is not a field option.

HM65 class mobile boards and custom nettop boards carried this chip. The BIOS string must match exactly. The Socket vs chipset: what decides whether a CPU works guide covers why support lists decide compatibility.

Memory, PCIe and cooling

Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Matched modules help shared graphics at low clocks. ECC is not supported.

PCI Express lanes come from the CPU for wireless and storage. Boards wire lanes per chassis, so no single lane map fits all 847 devices.

Cooling is a slim 17 W thermal assembly. The CPU cooler compatibility by socket guide notes soldered laptops keep board specific cooling with no retail mount.

Upgrade paths

There is no CPU upgrade path on soldered BGA 1023. The Celeron 847 cannot be lifted, so more speed means a new board or a new thin device. A nearby soldered dual is Intel Celeron 877 at higher clocks.

For a running 847 box the useful work is storage and memory. Add an SSD where the chassis allows it and keep the system for light duty.

Frequently asked questions

What socket does the Intel Celeron 847 use?

It uses BGA 1023, a soldered package. The chip cannot be removed.

Does the Celeron 847 have Hyper-Threading?

No. Two cores give 2 threads at a fixed 1.1 GHz.

What memory does the Celeron 847 use?

DDR3-1066 and 1333, two channels, up to 16 GB.

Can the Celeron 847 be upgraded?

No. A faster thin device means a new board or a new laptop.

Sources and verification

  1. Intel Celeron 847 (CPU-Monkey, 2 cores, 1.1 GHz, 17 W, BGA1023, 350 to 800 MHz)
  2. BGA1023 CPU list (dmcpu, Celeron 847 1.1 GHz 2/2 Q2/2011)

Facts last checked against these sources on . Page last edited on .