Intel Core i3-2377M socket: BGA 1023
The Intel Core i3-2377M uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part with Hyper-Threading and cannot be replaced.
- Socket
- BGA 1023
- Launched
- September 2012
- Cores and threads
- 2 and 4
- Base power
- 17 W
- Codename
- Sandy Bridge
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 1.5 GHz
Intel Core i3-2377M specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sandy Bridge cores on 32 nm |
| Clocks | 1.5 GHz (no turbo) |
| Cache | 3 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 17 W |
| Manufacturing process | 32 nm |
| Memory support | DDR3-1066 and 1333, two channels, up to 16 GB |
| PCI Express | 16 lanes from the CPU, PCIe 2.0 |
| Integrated graphics | Intel HD Graphics 3000 (350 MHz to 1000 MHz) |
| Multiplier | Locked |
| Package | BGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered) |
Motherboard compatibility
Intel Core i3-2377M needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.
BGA 1023 at a glance
| Type | BGA, 1,023 contacts |
|---|---|
| Package size | 31 × 24 mm |
| Introduced | January 2011 |
| Memory | DDR3 and DDR3L, two channels, 1066 to 1600 MT/s |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-2377M is
Intel Core i3-2377M is a dual core Sandy Bridge mobile processor for thin laptops with soldered boards. It runs at a fixed 1.5 GHz with no turbo, with 3 MB Intel Smart Cache and Hyper-Threading for 4 threads. Power is rated at 17 W on a 32 nm process. Intel lists the launch in the second quarter of 2012, while retail availability traces to September, which is the date used here.
Graphics are Intel HD Graphics 3000 at 350 MHz to 1000 MHz. The low base suits thin bodies with small batteries. The controller takes DDR3 at 1066 or 1333 MT/s.
Four threads at low clocks cover light multitasking in thin bodies built for battery. Laptops pair it with HM76 class boards and small SSDs. The How to find your CPU socket type guide shows how to confirm the soldered package.
Socket and motherboard compatibility
The Core i3-2377M solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.
The BIOS must list the exact Core i3-2377M string. The CPU cooler compatibility by socket guide notes soldered mobile cooling stays board specific.
Memory, PCIe and cooling
Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Thin bodies may solder RAM and lock size. Two channels help shared graphics.
PCI Express is 16 lanes from the CPU at PCIe 2.0 for Wi-Fi and storage. No graphics slot exists at 17 W.
Cooling is a slim 17 W spreader and fan. Fixed clocks need little airflow.
Upgrade paths
There is no CPU upgrade path on soldered BGA 1023. The Core i3-2377M cannot be removed, so a faster thin laptop means a new board or a new device. A socketed Sandy i3 comparison is Intel Core i3-2370M on Socket G2, which allows service.
A platform move means a new thin laptop on a current BGA package. Keep the old body for travel duty after a wipe.
Frequently asked questions
What socket does the Intel Core i3-2377M use?
It uses BGA 1023, a soldered package. The chip cannot be removed.
Does the Core i3-2377M have Hyper-Threading?
Yes. Two cores give 4 threads at a fixed 1.5 GHz.
What memory does the Core i3-2377M use?
DDR3-1066 and 1333, two channels, up to 16 GB.
Can the Core i3-2377M be upgraded?
No. Soldered BGA parts need a board or laptop replacement for more speed.
Sources and verification
Facts last checked against these sources on . Page last edited on .