Intel Celeron 877 socket: BGA 1023

The Intel Celeron 877 uses the BGA 1023 package. It is a soldered 17 W dual core Sandy Bridge part and cannot be replaced.

Socket
BGA 1023
Launched
July 2012
Cores and threads
2 and 2
Base power
17 W
Codename
Sandy Bridge
Segment
Mobile (soldered)
Clocks
1.4 GHz

Intel Celeron 877 specifications

Cores2
Threads2
Core architectureSandy Bridge cores on 32 nm
Clocks1.4 GHz (no turbo)
Cache2 MB Intel Smart Cache (L3)
Processor base power (TDP)17 W
Manufacturing process32 nm
Memory supportDDR3-1066 and 1333, two channels, up to 16 GB
PCI ExpressPCIe lanes from the CPU (layout varies by board design)
Integrated graphicsIntel HD Graphics (350 MHz to 1000 MHz)
MultiplierLocked
PackageBGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered)

Motherboard compatibility

Intel Celeron 877 needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.

BGA 1023 at a glance

TypeBGA, 1,023 contacts
Package size31 × 24 mm
IntroducedJanuary 2011
MemoryDDR3 and DDR3L, two channels, 1066 to 1600 MT/s
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1023 socket guide

What the Celeron 877 is

Intel Celeron 877 is a dual core Sandy Bridge mobile processor that Intel released in July 2012 for thin soldered laptops. It runs at a fixed 1.4 GHz with no turbo and no Hyper-Threading, so 2 cores give 2 threads. Cache is 2 MB Intel Smart Cache. Power is rated at 17 W on a 32 nm process. The 100 MHz step over the 867 is the only change in kind.

Graphics are Intel HD Graphics for Sandy Bridge at 350 MHz to 1000 MHz. The block covers thin panels and video without a card. The controller takes DDR3 at 1066 or 1333 MT/s.

Mid 2012 thin bodies pair it with HM76 class boards and small SSDs for a quiet feel. Fixed clocks keep fleet behavior predictable. The How to find your CPU socket type guide shows how to confirm the soldered package.

Socket and motherboard compatibility

The Celeron 877 solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.

The BIOS must list the exact Celeron 877 string. The Socket vs chipset: what decides whether a CPU works guide explains why that list matters more than the chipset name.

Memory, PCIe and cooling

Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Soldered RAM locks size at purchase on the thinnest bodies. Two channels help shared graphics.

PCI Express lanes come from the CPU for Wi-Fi and storage. No graphics slot exists at 17 W.

Cooling is a slim 17 W spreader and fan. Cleaning keeps fan noise down under office loads.

Upgrade paths

There is no CPU upgrade path on soldered BGA 1023. The Celeron 877 cannot be removed, so a faster thin laptop means a new board or a new device. A nearby soldered dual is Intel Celeron 867, though boards rarely cross.

A platform move means a new thin laptop on a current BGA package. Keep the old body for spare duty after a wipe.

Frequently asked questions

What socket does the Intel Celeron 877 use?

It uses BGA 1023, a soldered package. The chip cannot be removed.

How is the Celeron 877 different from the 867?

Base is 1.4 GHz instead of 1.3 GHz. Cache, power and graphics match.

What memory does the Celeron 877 use?

DDR3-1066 and 1333, two channels, up to 16 GB.

Can the Celeron 877 be upgraded?

No. Soldered BGA parts need a board or laptop replacement for more speed.

Sources and verification

  1. Intel Celeron 877 Specs (TechPowerUp)
  2. Intel Celeron 877 Notebook Processor (Notebookcheck)

Facts last checked against these sources on . Page last edited on .