Intel Atom x7835RE socket: BGA 1264

What the Atom x7835RE is

The Atom x7835RE is an eight-core embedded processor that Intel released in April 2024 with Amston Lake for extended-temperature industrial systems. Eight Gracemont Efficient-cores run at 1.3 GHz base with turbo to 3.6 GHz and no Hyper-Threading for deterministic industrial timing. Shared cache totals 6 MB of L3 for control tables and vision buffers that must stay resident. Processor base power is 12 W on Intel 7 for efficiency per core that suits dense DIN-rail racks.

The RE suffix marks extended industrial temperature range with validation far beyond commercial parts, which suits curbside cabinets, factory floors and transport systems with wide thermal swings. Against the commercial Intel Atom x7809C at 25 W the RE trades sustained clocks for half the power with industrial qualification. Base and turbo clocks are confirmed three ways across ARK turbo, the database and the Intel RE brief for audit-ready documentation.

Graphics come from Intel UHD with 32 execution units at 800 MHz base and up to 1200 MHz, driving DisplayPort, HDMI, eDP and MIPI outputs for HMI panels and digital signage. That display support separates the RE graphics SKUs from the headless C parts in mixed-fleet planning.

Workload fit is industrial edge compute: machine vision adjacent control, HMI-driven automation and network appliances in harsh enclosures where 8 cores must sip power. Operators pick the x7835RE where the 4-core Intel Atom x7433RE lacks threads but the thermal budget stays at 12 W. System integrators often standardize on this SKU for their industrial PC line because one board covers control, display and networking together.

Socket and motherboard compatibility

The x7835RE fits the BGA 1264 soldered package at 35 × 24 mm. Industrial carriers solder it with extended-temperature validation across the full operating band. There is no socketed option and no later processor swap, so integrators lock the board design with firmware for long service.

Carrier I/O follows industrial needs: multiple display outputs for operator panels, isolated serial and GPIO for control, plus networking for plant floors with deterministic timing. Extended temperature qualification covers the enclosure class rather than office ambients, with test reports per carrier for audit trails.

Inside Amston Lake the x7835RE tops the RE line on cores, with the 4-core Intel Atom x7433RE below for lighter duty. Package and platform match across both for shared carrier families.

Memory, PCIe and cooling

DDR4-3200, DDR5-4800 and LPDDR5-4800 support arrives over a single channel with board capacities to 32 GB on ARK. The database notes 16 GB limits on some RE board layouts, so carrier manuals decide the fitted maximum per design and enclosure. ECC at the CPU level stays unconfirmed across sources, so this page makes no ECC claim.

PCIe 3.0 x9 lanes serve industrial NICs, capture cards and NVMe on carriers. Nine lanes cover control networking plus boot storage with margin for one fieldbus card. Display traffic rides the integrated GPU outputs rather than PCIe.

Cooling at 12 W suits fanless sealed enclosures with modest heatsinks rated for industrial ambients. No cooler ships with the soldered part. Extended-temperature heatsink selection follows the carrier thermal guide for the worst-case enclosure.

Upgrade paths

Soldering blocks field upgrades, so the x7835RE is specified against its siblings up front during carrier design reviews: the 4-core Intel Atom x7433RE for lighter control loops, or server-class silicon where 8 efficient cores run out. Storage and I/O mezzanines change over the product life while the processor stays fixed.

Newer embedded families need fresh carrier qualification with new longevity terms and extended temperature revalidation. The LGA, PGA and BGA: CPU package types explained guide covers why soldered industrial designs trade away the desktop upgrade path.