Intel Atom x7433RE socket: BGA 1264

What the Atom x7433RE is

The Atom x7433RE is a four-core embedded processor that Intel released in April 2024 with Amston Lake for industrial control. Four Gracemont Efficient-cores run at 1.5 GHz base with turbo to 3.4 GHz and no Hyper-Threading for deterministic control timing. Shared cache totals 6 MB of L3. Processor base power is 9 W on Intel 7 for efficiency per core that suits DIN-rail controllers.

The RE suffix brings extended industrial temperature validation for cabinets and vehicles that commercial parts never see in service, including washdown zones. Against the 8-core Intel Atom x7835RE the x7433RE halves cores for control loops that need determinism more than throughput at lower cost. Clocks are confirmed across ARK turbo, the database and the Intel RE brief for audit-ready documentation and certification files.

Graphics use Intel UHD with 32 execution units at 600 MHz base and up to 1000 MHz for operator panels over DisplayPort, HDMI, eDP and MIPI with touch support and hardware overlays. Full 32 EU graphics on a 4-core 9 W part keeps HMI duty smooth without a separate controller or extra power rail for the panel.

Workload fit is deterministic control for factory duty: PLCs, gateways and HMI terminals where 4 cores with graphics cover the whole machine inside 9 W. Operators pick the x7433RE where the 2-core Intel Atom x7213RE lacks headroom but 8 cores waste power and budget. Machine builders often standardize on this SKU for their mid-range controller line because one board covers display and control together at low cost and power.

Socket and motherboard compatibility

The x7433RE fits the BGA 1264 soldered package at 35 × 24 mm with industrial carrier validation. There is no socketed variant and no upgrade path, so machine builders qualify board plus firmware as one long-life unit with locked revisions.

Carrier designs favor control I/O for reliable factory duty: serial, GPIO and fieldbus beside display outputs for panels with touch overlays. Extended temperature operation covers the enclosure class, not office ambients, and carrier manuals state the validated band for each model and revision.

The 8-core Intel Atom x7835RE above shares the package and platform for heavier industrial compute with more threads and display outputs. Carriers often span both SKUs in one board family with power stages sized per model and shared heatsink footprints for easy servicing.

Memory, PCIe and cooling

Single-channel DDR4-3200, DDR5-4800 or LPDDR5-4800 feeds 4 cores with margin for control tables and frame buffers in typical HMI duty. Board capacities follow the carrier manual per design and enclosure class for each controller model. CPU-level ECC stays unconfirmed across sources, so this page makes no ECC claim and board-level correction depends on the carrier.

PCIe 3.0 x9 lanes attach industrial NICs, fieldbus cards and NVMe boot storage with room for deterministic add-ons. Nine lanes exceed what 4-core control duty typically needs, which leaves room for capture or inference mezzanines on smarter carriers.

Cooling at 9 W fits small passive heatsinks in sealed boxes rated for washdown zones. No cooler ships with the soldered part. Fanless operation is the norm for this class in dusty cabinets and washdown-adjacent zones.

Upgrade paths

No soldered part upgrades in place. The Amston Lake ladder moves from 2-core RE SKUs through this 4-core part to the 8-core Intel Atom x7835RE, chosen when the carrier is specified. I/O mezzanines and storage evolve while the processor stays fixed for the life of the machine design and its service contract.

Newer embedded families need fresh carrier qualification. The LGA, PGA and BGA: CPU package types explained guide explains the soldered tradeoff that industrial designs accept for reliability and service life.