Intel Atom x7211RE socket: BGA 1264

What the Atom x7211RE is

The Atom x7211RE is a dual-core embedded processor that Intel released in April 2024 with Amston Lake for minimal industrial duty. Two Gracemont Efficient-cores run at 1.0 GHz base with turbo to 3.2 GHz and no Hyper-Threading for deterministic concentrator timing. Shared cache totals 6 MB of L3. Processor base power is 6 W on Intel 7, the lowest in this batch for passively cooled telemetry duty.

The RE suffix brings extended industrial temperature validation for sealed curbside and transport enclosures with wide thermal swings. Against the 9 W Intel Atom x7213RE the x7211RE halves base clocks for the tightest thermal budgets while keeping turbo within 200 MHz for responsive bursts. A note on graphics base: the database prints 600 MHz with 1000 MHz max while the brief lists 400 MHz base, so this page records the undisputed 1000 MHz maximum only for panel planning.

Graphics use Intel UHD with 16 execution units up to 1000 MHz for simple operator displays with touch overlays. Low 1.0 GHz base clocks sip power at idle while turbo answers touch input without delay for operators and field technicians.

Workload fit is minimal industrial: sensors concentrators, access terminals and telemetry gateways where 2 cores inside 6 W replace older multi-chip boards. Operators pick the x7211RE where power and heat dominate every other requirement, including battery-backed sites that must ride through outages. Transport telematics builders value the 6 W envelope because sealed boxes survive engine bays without active cooling or maintenance visits.

Socket and motherboard compatibility

The x7211RE fits the BGA 1264 soldered package at 35 × 24 mm with industrial validation. There is no socketed option and no upgrade path. Builders qualify the board as a fixed appliance for decade-long service in harsh sites with locked firmware and spares.

Carrier boards stay minimal around this SKU: display output, serial, GPIO and boot storage cover most deployments with room for a CAN module and TPM. Extended temperature operation per the carrier manual decides enclosure choice more than raw performance for roadside duty.

The 9 W Intel Atom x7213RE above shares the package for faster industrial duty with higher base clocks and headroom. Carriers often span both 2-core RE parts in one family with heatsinks sized per model and shared panel connectors.

Memory, PCIe and cooling

Single-channel DDR4-3200, DDR5-4800 or LPDDR5-4800 feeds 2 cores with wide margin to 32 GB. Tiny fixed images need little RAM, so 4 GB covers most concentrator builds with room for logging partitions and update slots for years. CPU-level ECC stays unconfirmed, so this page makes no ECC claim.

PCIe 3.0 x9 lanes attach a NIC, boot storage and one control device at most. Simple carriers wire fewer lanes where the gateway needs less, which trims cost without functional loss for high-volume telemetry rollouts.

Cooling at 6 W fits board-spreader designs with no heatsink in ventilated boxes rated for continuous duty and long service intervals. No cooler ships with the soldered part. This is the easiest Amston Lake class to cool in the batch for sealed roadside cabinets.

Upgrade paths

No field upgrade exists on soldered boards for telemetry fleets. The RE ladder starts here at 6 W and climbs through the 9 W Intel Atom x7213RE to the 4-core Intel Atom x7433RE, chosen at specification time for responsiveness headroom and growth across product lines. Peripherals change while the processor stays fixed for the concentrator service life and support term.

Newer embedded families need fresh carrier qualification. The LGA, PGA and BGA: CPU package types explained guide explains the soldered tradeoff behind concentrator designs.