Intel Atom x7213RE socket: BGA 1264

What the Atom x7213RE is

The Atom x7213RE is a dual-core embedded processor that Intel released in April 2024 with Amston Lake for industrial HMI duty. Two Gracemont Efficient-cores run at 2.0 GHz base with turbo to 3.4 GHz and no Hyper-Threading for deterministic HMI timing and control loops. Shared cache totals 6 MB of L3 for HMI frame buffers. Processor base power is 9 W on Intel 7 for efficiency per core that suits DIN-rail HMI controllers.

The RE suffix brings extended industrial temperature validation for harsh cabinets and vehicles with wide thermal swings year-round. Against the headless commercial Intel Atom x7203C at matching clocks the x7213RE adds 200 MHz of turbo with UHD graphics for panels that need displays in the field and at remote sites. Clocks and graphics are confirmed across ARK, the database and the Intel RE brief for audit-ready panel documentation and certification.

Graphics use Intel UHD with 16 execution units at 600 MHz base and up to 1000 MHz for operator displays over DisplayPort, HDMI and eDP with touch overlays. A small panel with touch input runs directly without a separate controller or added power rail for the display.

Workload fit is industrial HMI for panel duty: operator terminals, access panels and compact gateways where 2 cores with graphics cover the whole machine inside 9 W. Operators pick the x7213RE where the lower-clock Intel Atom x7211RE responds too slowly but 4 cores waste power and budget for simple panels. Panel builders often standardize on this SKU for their touch-terminal line because one board covers display and control together at low cost per seat and power.

Socket and motherboard compatibility

The x7213RE fits the BGA 1264 soldered package at 35 × 24 mm with industrial carrier validation. There is no socketed variant and no upgrade path, so terminal builders qualify board plus firmware as one long-life unit with locked revisions and spares.

Carrier designs center on the panel: display outputs with touch controllers beside serial and GPIO for machinery and safety interlocks. Extended temperature operation covers the enclosure class per the carrier manual with test data for certification files and audits.

The 6 W Intel Atom x7211RE below shares the package for slower duty at lower power with matching display outputs and touch support. Carriers often span both 2-core RE SKUs in one family with shared panel outputs and mounting for easy field swaps.

Memory, PCIe and cooling

Single-channel DDR4-3200, DDR5-4800 or LPDDR5-4800 feeds 2 cores with margin for HMI frame buffers to 32 GB for crisp panel duty and logging. Modest capacities suit fixed terminal images that never grow beyond factory provisioning and over-the-air deltas. CPU-level ECC stays unconfirmed across sources, so this page makes no ECC claim for terminal fleets.

PCIe 3.0 x9 lanes attach industrial NICs, touch controllers and NVMe boot storage. Display traffic rides the integrated GPU outputs rather than PCIe, which keeps lane budgets free for control devices and fieldbus cards in compact terminals.

Cooling at 9 W fits small passive heatsinks in sealed panel PCs rated for continuous duty. No cooler ships with the soldered part. Fanless operation suits dusty factory floors and washdown-adjacent zones with sealed panels.

Upgrade paths

No soldered part upgrades in place. The RE ladder moves from the 6 W Intel Atom x7211RE through this 9 W part to the 4-core Intel Atom x7433RE, chosen at specification time for responsiveness with touch latency budgets in mind. Panels and storage evolve while the processor stays fixed for the terminal service life and support contract.

Newer embedded families need fresh carrier qualification. The LGA, PGA and BGA: CPU package types explained guide covers the soldered tradeoff behind terminal designs.