Intel Atom x7433FE socket: BGA 1264

What the Intel Atom x7433FE is

The Intel Atom x7433FE is the 4-core member of the Atom x7000FE Amston Lake stack on BGA 1264. It runs 4 threads at 1.5 GHz base with boost to 3.4 GHz, backed by 6 MB of shared L3 cache and a 9 W TDP. Intel lists the part as an embedded vertical segment SKU in the FCBGA1264 package with October 2025 availability at an 86 USD recommended customer price, built on Intel 7 with Gracemont E-cores.

Four E-cores without Hyper-Threading suit fanless gateways, kiosks, HMIs, thin clients and light network appliances where a single-digit power budget matters more than burst speed. The 1.5 GHz base keeps idle draw low, while boost to 3.4 GHz clears interactive spikes. The 6 MB cache is shared across the cores to keep control loops near the execution units.

Against the 8-core Intel Atom x7835FE above it, the x7433FE halves the cores for the smallest boards and enclosures at 9 W. Against older 2-core embedded Atoms, it doubles the cores with modern Gracemont efficiency and UHD Graphics for kiosk displays. Embedded lifecycle supply suits qualified industrial builds. See Socket vs chipset: what decides whether a CPU works for how socket, platform and firmware fit together on embedded boards.

Socket and motherboard compatibility

The x7433FE fits BGA 1264, a 1,264-ball soldered package measuring 35 × 24 mm. The chip is soldered once at the factory and stays with the board for life, so there is no retention lever and no aftermarket mounting choice. Cooling is part of the board design for the 9 W class, often a spreader or small passive sink inside a sealed enclosure.

Board choice follows the embedded vendor list rather than a chipset series. Single-channel memory is fixed per board between DDR4, DDR5 and LPDDR5, and display outputs cover eDP, DP, HDMI and MIPI for kiosk panels. A board revision needs firmware that knows the Amston Lake stepping. Moving from any other package is a full board change with memory and thermal design replaced together.

Memory, PCIe and cooling

Memory on BGA 1264 is single-channel DDR4, DDR5 or LPDDR5 up to 4800 MT/s for up to 32 GB with up to 38.4 GB per second of bandwidth. One channel keeps board routing simple and power low, which fits 4-thread control and display workloads. ECC is not part of this SKU, so designs that need error correction step up to a larger embedded platform such as LGA 1700 Bartlett Lake.

PCI Express connectivity is Gen 3 with x9 lanes from the CPU. That lane budget suits NVMe boot storage, gigabit networking and small expansion on a compact board rather than large arrays. Intel UHD Graphics 32EU serves kiosk and HMI displays with 4K support and triple-display capability, so most designs skip discrete graphics entirely.

Cooling follows the board maker specification for the 9 W class with a 105 degree junction limit. No cooler ships with the tray embedded part. Firmware power limits can cap draw below the default where a sealed cabinet demands it, at some cost in sustained clocks.

Upgrade paths

On the same package, the path up from the x7433FE is the 8-core Intel Atom x7835FE for busier boards on BGA 1264 where 12 W cooling allows. The move doubles the cores while keeping the same memory and lane layout, plus firmware that already supports Amston Lake.

There is no smaller Amston Lake part below the x7433FE in this batch, so a lower power target means an older Atom or a different low-power family. A move to LGA 1700 Bartlett Lake is a different platform with socketed Core parts, ECC options and many more lanes. That change replaces board, memory and cooling from scratch. The decision turns on whether the site needs a sealed 9 W node or room to grow.