AMD EPYC 7502P socket: SP3

What the EPYC 7502P is

The EPYC 7502P is a 32-core, 64-thread server processor from Rome. It launched in August 2019 for single socket cloud nodes with a 2.5 GHz base and up to 3.35 GHz boost at 180 W. Four chiplets of eight cores share 128 MB of L3.

Thirty two cores per socket without a second processor license or board suit hosters that bill per node. Sixteen megabytes of L2 back dense container fleets. The moderate base clock trades single thread speed for throughput per watt.

The P suffix keeps the platform to one socket, which halves board and memory cost against dual socket 16-core pairs. The non-P 7502 mirrors it for 2P clusters. Thirty two cores mark the point where single socket beats two smaller sockets on price.

Socket and motherboard compatibility

The EPYC 7502P fits SP3 on single socket boards with 180 W power delivery. Vendor lists must name the SKU. Rome boards post it with shipping firmware.

Cloud node boards wire full NVMe cages beside 64 threads in 1U. Redundant power sizing follows the manual. The How to find your CPU socket type guide explains platform generations.

Milan era firmware extended many boards to newer single socket SKUs, protecting 2019 investments.

Memory, PCIe and cooling

Eight DDR4-3200 ECC channels feed 64 threads at full bandwidth. A terabyte of RAM pairs naturally with 32 cores for VM density. ECC corrects errors across long uptimes.

PCIe Gen4 lanes total 128 for NICs, accelerators and NVMe. Single socket clouds attach 100 Gb networking without lane starvation. Switch cards multiply slower devices.

The 180 W heatsink class needs high airflow 1U or relaxed 2U cooling. Liquid options exist for dense racks. Paste patterns cover four chiplets plus the I/O die.

Where this Rome part fits

Thirty two cores fit virtual private servers, CI fleets and mid size analytics. Per node density beats dual socket complexity for operations teams. The 128 MB L3 smooths noisy neighbor effects.

Hosters standardize on one board with 512 GB to 2 TB of RAM. Empty memory channels cost real throughput on analytics, so fill all eight. The AMD EPYC 7502 twin scales the same silicon to dual socket.

Power capping in firmware can hold racks to facility limits without swapping silicon.

Upgrade paths

On SP3 density grows to 48-core 7552 and 64-core 7702P single socket parts where boards validate them. Milan P parts follow with BIOS updates.

SP5 platforms bring DDR5 for the next density step. The CPU cooler compatibility by socket guide tracks heatsink bands.