Intel Core i7-1060G7 socket: BGA 1377
The Intel Core i7-1060G7 uses BGA 1377, a soldered ultra mobile package. The quad core 9 W flagship boosts to 3.8 GHz.
- Socket
- BGA 1377
- Launched
- August 2019
- Cores and threads
- 4 and 8
- Base power
- 9 W
- Codename
- Ice Lake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core i7
- Clocks
- 1.0 / 3.8 GHz
Intel Core i7-1060G7 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Sunny Cove cores on 10 nm |
| Clocks | 1.0 GHz base, up to 3.8 GHz with Turbo Boost 2.0 |
| Cache | 8 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 9 W (12 W cTDP up) |
| Manufacturing process | 10 nm |
| Memory support | LPDDR4X-3733 and DDR4-3200, two channels |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Intel Iris Plus Graphics (64 execution units) |
| Multiplier | Locked |
| Package | BGA1377 (26.5 by 18.5 mm, soldered) |
Motherboard compatibility
Intel Core i7-1060G7 needs a motherboard with a BGA 1377 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1377 chipset list and the board maker's CPU support list.
BGA 1377 at a glance
| Type | BGA, 1,377 contacts |
|---|---|
| Package size | 26.5 × 18.5 mm |
| Introduced | August 2019 |
| Memory | LPDDR4X-3733 and DDR4-3200 on Ice Lake-Y, LPDDR3-2133 and DDR3L-1600 on Amber Lake-Y, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i7-1060G7 is
The Core i7-1060G7 is a four core, eight thread Ice Lake-Y flagship for premium detachables. It launched in August 2019 with a 1.0 GHz base and up to 3.8 GHz boost at 9 W. Eight megabytes of cache lead the Y family.
The 3.8 GHz single core peak tops fanless bursts for launches and edits. All core turbo lands near 3.4 GHz with adequate cooling. Cache per core beats i5 Y parts for multitasking.
Iris Plus graphics with 64 execution units cover pen creation and 4K timelines in thin bodies. The chip fits flagship detachables where every watt shows. Buyers who render regularly step up to U series.
Socket and motherboard compatibility
The 1060G7 solders to BGA 1377 on flagship detachable boards. Intel documents 8 MB cache with 9 W sustained. There is no socketed path.
Premium makers tune 9 to 12 W with metal unibodies spreading heat. Soldered LPDDR4X pairs with the top graphics tier. The LGA, PGA and BGA: CPU package types explained guide explains soldered premium design.
U series boards cannot host the Y flagship. Power envelopes differ.
Memory, PCIe and cooling
LPDDR4X-3733 or DDR4-3200 soldered in two channels feeds CPU and graphics. Flagship detachables fix 16 GB for creation drafts. Bandwidth peaks near 58.3 GB per sec.
PCIe 3.0 wires internal NVMe storage up to 512 GB in this tier. Board lanes add wireless and pen digitizers. USB-C extends to external displays.
Passive metal body cooling covers 9 W silently. Brief turbo exceeds the sustained envelope by design. No cooler pattern exists.
Upgrade paths
Soldered packaging blocks upgrades. Flagship pens, keyboards and docks extend detachable life. Device replacement is the performance step.
The 1060G7 already tops its BGA 1377 family at purchase time. Later detachables moved to newer efficient silicon.
Frequently asked questions
What socket does the Intel Core i7-1060G7 use?
It uses BGA 1377 soldered to the detachable board.
How fast does the 1060G7 boost?
Up to 3.8 GHz single core from a 1.0 GHz base.
What graphics are in the 1060G7?
Intel Iris Plus with 64 execution units.
When did the 1060G7 launch?
August 2019 with the Ice Lake-Y family.
Can the 1060G7 be upgraded?
No. Soldered BGA prevents processor changes.
Sources and verification
Facts last checked against these sources on . Page last edited on .