Intel Core i5-1030G4 socket: BGA 1377
The Intel Core i5-1030G4 uses BGA 1377, a soldered ultra mobile package. The quad core 9 W chip cannot be replaced.
- Socket
- BGA 1377
- Launched
- August 2019
- Cores and threads
- 4 and 8
- Base power
- 9 W
- Codename
- Ice Lake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core i5
- Clocks
- 0.7 / 3.5 GHz
Intel Core i5-1030G4 specifications
| Cores | 4 |
|---|---|
| Threads | 8 |
| Core architecture | Sunny Cove cores on 10 nm |
| Clocks | 0.7 GHz base, up to 3.5 GHz with Turbo Boost 2.0 |
| Cache | 6 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 9 W (12 W cTDP up) |
| Manufacturing process | 10 nm |
| Memory support | LPDDR4X-3733 and DDR4-3200, two channels |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Intel Iris Plus Graphics (48 execution units) |
| Multiplier | Locked |
| Package | BGA1377 (26.5 by 18.5 mm, soldered) |
Motherboard compatibility
Intel Core i5-1030G4 needs a motherboard with a BGA 1377 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1377 chipset list and the board maker's CPU support list.
BGA 1377 at a glance
| Type | BGA, 1,377 contacts |
|---|---|
| Package size | 26.5 × 18.5 mm |
| Introduced | August 2019 |
| Memory | LPDDR4X-3733 and DDR4-3200 on Ice Lake-Y, LPDDR3-2133 and DDR3L-1600 on Amber Lake-Y, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i5-1030G4 is
The Core i5-1030G4 is a four core, eight thread Ice Lake-Y processor for thin detachables. It launched in August 2019 with a 0.7 GHz base and up to 3.5 GHz boost at 9 W. The very low base stretches battery while boost handles bursts.
Six megabytes of Smart Cache back multitasking across eight threads. All core sustained speed lands near 3.2 GHz with adequate cooling. The 12 W up mode helps thicker detachables hold boost longer.
Iris Plus graphics with 48 execution units cover pen displays and photo editing. The chip fits travelers who multitask on detachables. Four cores keep background sync smooth.
Socket and motherboard compatibility
The 1030G4 solders to BGA 1377 on thin detachable boards. Makers tune cTDP between 9 and 12 W per thickness. There is no socketed alternative.
Soldered memory and storage share the slim board. Display and pen run through the SoC. The LGA, PGA and BGA: CPU package types explained guide explains soldered trade offs.
U series boards cannot host the Y chip. Ultra mobile power maps differ.
Memory, PCIe and cooling
LPDDR4X-3733 or DDR4-3200 soldered in two channels feeds CPU and graphics. Devices typically fix 8 GB. Bandwidth peaks near 58.3 GB per sec.
PCIe 3.0 wires internal NVMe storage in 256 GB sizes typical of this tier. Board lanes add wireless. USB-C extends displays.
Passive cooling covers 9 W silently with brief turbo above. The 12 W up mode needs slightly thicker bodies. No cooler pattern exists.
Upgrade paths
Soldered packaging blocks upgrades. Accessories and cloud storage extend detachable life. Device replacement is the performance path.
At purchase time the i5-1030G7 adds graphics cores on the same BGA 1377 family. The i3 dual cores step down for lighter budgets.
Frequently asked questions
What socket does the Intel Core i5-1030G4 use?
It uses BGA 1377 soldered to the detachable board.
How is the 1030G4 different from the 1030G7?
Same CPU with Iris Plus 48EU graphics against 64EU on the G7.
Why is the base clock only 0.7 GHz?
The low base stretches battery; boost to 3.5 GHz handles bursts.
When did the 1030G4 launch?
August 2019 with the Ice Lake-Y family.
Can the 1030G4 be upgraded?
No. Soldered BGA prevents processor changes.
Sources and verification
- Intel Ice Lake mobile specs (TrustedReviews)
- Intel launches 10nm Ice Lake mobility processors (WCCFTECH)
Facts last checked against these sources on . Page last edited on .