Intel Core i3-1000G4 socket: BGA 1377
The Intel Core i3-1000G4 uses BGA 1377, a soldered ultra mobile package. The dual core 9 W chip pairs Iris Plus graphics with a thin body.
- Socket
- BGA 1377
- Launched
- August 2019
- Cores and threads
- 2 and 4
- Base power
- 9 W
- Codename
- Ice Lake-Y
- Segment
- Mobile (soldered)
- Family
- Intel Core i3
- Clocks
- 1.1 / 3.2 GHz
Intel Core i3-1000G4 specifications
| Cores | 2 |
|---|---|
| Threads | 4 |
| Core architecture | Sunny Cove cores on 10 nm |
| Clocks | 1.1 GHz base, up to 3.2 GHz with Turbo Boost 2.0 |
| Cache | 4 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 9 W |
| Manufacturing process | 10 nm |
| Memory support | LPDDR4X-3733 and DDR4-3200, two channels |
| PCI Express | PCIe 3.0 from the CPU |
| Integrated graphics | Intel Iris Plus Graphics (48 execution units) |
| Multiplier | Locked |
| Package | BGA1377 (26.5 by 18.5 mm, soldered) |
Motherboard compatibility
Intel Core i3-1000G4 needs a motherboard with a BGA 1377 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1377 chipset list and the board maker's CPU support list.
BGA 1377 at a glance
| Type | BGA, 1,377 contacts |
|---|---|
| Package size | 26.5 × 18.5 mm |
| Introduced | August 2019 |
| Memory | LPDDR4X-3733 and DDR4-3200 on Ice Lake-Y, LPDDR3-2133 and DDR3L-1600 on Amber Lake-Y, two channels |
| Cooler mounting holes | Not applicable (soldered) |
What the Core i3-1000G4 is
The Core i3-1000G4 is a dual core, four thread Ice Lake-Y processor for premium thin detachables. It launched in August 2019 with the same 1.1 GHz base and 3.2 GHz boost as the 1000G1 at 9 W. The G4 suffix steps graphics up to Iris Plus with 48 execution units.
CPU performance matches its G1 twin core for core, since clocks and cache are identical. The graphics tier makes the difference for pen drawing and photo touch ups. Four megabytes of Smart Cache back light multitasking.
Iris Plus graphics cover the detachable display with smoother animation than UHD parts. The chip fits students who draw and write on one device. Gaming stays at casual titles.
Socket and motherboard compatibility
The 1000G4 solders to BGA 1377 on thin detachable boards. Makers validate passive cooling for 9 W with graphics bursts. There is no socketed version.
Soldered LPDDR4X memory pairs with the stronger graphics for smooth pen drawing. Display outputs run through USB-C. The LGA, PGA and BGA: CPU package types explained guide frames soldered device design.
U series boards cannot take the Y chip. The ultra mobile package is unique.
Memory, PCIe and cooling
LPDDR4X-3733 or DDR4-3200 soldered in two channels feeds Iris Plus graphics best. Devices typically fix 8 GB. Faster memory helps drawing apps most.
PCIe 3.0 wires internal storage in 128 to 256 GB sizes. Board lanes add wireless and touch. External monitors run through USB-C DisplayPort.
Passive cooling covers 9 W in sealed bodies. Graphics bursts briefly exceed the sustained envelope. No cooler pattern exists.
Upgrade paths
Soldered packaging blocks upgrades. Pens, keyboards and cloud storage extend detachable use. Device replacement is the performance step.
Quad core Y parts on the same BGA 1377 family add threads at purchase time. The G1 twin is the step down for lighter budgets.
Frequently asked questions
What socket does the Intel Core i3-1000G4 use?
It uses BGA 1377 soldered to the detachable board.
How is the 1000G4 different from the 1000G1?
Same CPU with Iris Plus 48EU graphics against UHD graphics.
How many threads does the 1000G4 have?
Two cores with four threads at 1.1 GHz base and up to 3.2 GHz boost.
When did the 1000G4 launch?
August 2019 with the Ice Lake-Y family.
Can the 1000G4 be replaced?
No. Soldered BGA prevents processor swaps.
Sources and verification
Facts last checked against these sources on . Page last edited on .