Intel Atom x6214RE socket: BGA 1493

What the Atom x6214RE is

The Atom x6214RE is the 2-core industrial Elkhart Lake part for extended temperature boards in the first quarter of 2023. Two Tremont efficient cores without hyperthreading run at a fixed 1.4 GHz with no turbo mode, backed by 1.5 MB of L2 and no L3. The 10 nm die targets 6 W for fanless enclosures from minus 40 to 85 C. The RE suffix marks industrial temperature and long supply against commercial E parts.

UHD graphics to 400 MHz drive HMIs and signage through eDP, DisplayPort, HDMI and MIPI-DSI. Single channel DDR4-3200 SODIMM or LPDDR4x-4267 feeds the SoC to 32 GB with In-Band ECC where the board enables it. Time Coordinated Computing support suits real-time control alongside display duty.

Industrial buyers pick the x6214RE for the lowest power Elkhart Lake node where fixed control images run for years. Two cores cover gateways and HMIs at 6 W, while 4-core RE parts suit vision on the same footprint. Boards that support Elkhart Lake generally cover RE parts with extended temperature validation. The How to find your CPU socket type guide shows where ARK lists FCBGA1493 package data.

Socket and motherboard compatibility

The x6214RE solders to BGA 1493 on industrial boards with no socketed path. Memory form, display wiring and temperature qualification follow board design. BGA 1493 does not cross to BGA 1264 Alder Lake-N boards. ARK lists FCBGA1493 as the package with a 35 × 24 mm footprint.

Eight PCIe Gen3 lanes serve NVMe, wireless and expansion, while USB, SATA and serial IO come from board wiring. Factory firmware carries Elkhart Lake support, so work centres on temperature validation and driver images.

Memory, PCIe and cooling

Single DDR4 SODIMM to DDR4-3200 up to 32 GB or soldered LPDDR4x suits vibration targets. In-Band ECC with standard memory adds error protection without ECC DIMMs where enabled. Single channel bandwidth matches 6 W control loads.

PCIe Gen3 with 8 lanes covers storage and radios on Pico-ITX and board designs. Cooling is a chassis spreader for 6 W across the full industrial range, usually fully fanless. Sustained behaviour follows ambient temperature more than clock tables, since turbo does not exist here.

Upgrade paths

No CPU change is possible on soldered BGA 1493. Storage and radio modules move where slots exist. Display cabling and serial expansion add more value than internal swaps for fixed HMI images.

Within BGA 1493 the step up is the 4-core x6416RE at 9 W on the same DDR4 platform. Outside Elkhart Lake, Alder Lake-N on BGA 1264 adds Gracemont speed and DDR5 where boards support newer firmware.