Intel Atom x6211E socket: BGA 1493

What the Atom x6211E is

Released in January 2021, the Intel Atom x6211E targets embedded duty with 2 cores and 2 threads on a 35 × 24 mm soldered package. Tremont cores run 1.3 GHz base, up to 3.0 GHz burst, backed by 1.5 MB L2. Processor base power is 6 W for small enclosures.

Memory support covers DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. One channel keeps board routing simple in compact gateways, and In-Band ECC corrects errors where the board enables it. Eight Gen3 lanes serve NVMe, wireless and expansion on small carriers. Intel UHD Graphics (16 execution units, up to 750 MHz) drives local displays for kiosks and HMIs.

Embedded boards take this E part with burst clocks for responsive HMIs and gateways. Base at 1.3 GHz sips power while burst to 3.0 GHz covers interaction peaks. Compare the fixed-clock Intel Atom x6212RE where deterministic timing matters.

Socket and motherboard compatibility

The Atom x6211E fits BGA 1493 on embedded boards with soldered retention. The chip is soldered and cannot be replaced. Carrier lists must name the exact suffix for qualification, since E, RE and FE differ in burst and temperature behavior.

There is no socketed variant and no board choice beyond the carrier design. Memory type, display outputs and expansion follow the gateway or controller layout. Boards for the 6 W dual-core class share carriers with 12 W quad-core parts such as Intel Atom x6212RE.

Memory, PCIe and cooling

DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. Matched modules hold the rated speed on the single channel.

Eight Gen3 lanes from the SoC serve NVMe, wireless and expansion on small carriers. Lane splits follow the carrier manual.

Cooling belongs to the enclosure maker across the 6 W band with spreaders or small fans. No boxed cooler exists. Paste service follows the carrier manual for the small soldered package.

Suffixes and clock behavior

E marks embedded broad-market parts at extended temperatures with burst clocks up to the turbo frequency. The Atom x6211E bursts from 1.3 GHz to 3.0 GHz, which suits interactive gateways and HMIs that idle most of the day.

Extended temperatures span minus 40 C to plus 85 C ambient on these SKUs, with junction limits above 100 C. Industrial buyers match the suffix to the site: RE for real-time control, FE for functional safety, E for broad embedded use.

Boards pair these SKUs with single-channel DDR4 or LPDDR4 modules up to 32 GB depending on the carrier, since soldered LPDDR designs fix memory at order time. Industrial buyers match the suffix to the site temperature range before volume orders.

Upgrade paths

On BGA 1493 the moves run from dual-core 6 W parts through this 2-core SKU to 12 W quad-core options such as Intel Atom x6212RE on carriers that take the power. Core growth needs no carrier change when the maker lists the part.

Beyond the series the replacement is a whole carrier on newer Atom platforms. The How to find your CPU socket type guide explains when a platform change pays off.