Intel Atom x6212RE socket: BGA 1493
The Intel Atom x6212RE uses BGA 1493, a soldered BGA for Atom embedded processors with single-channel memory. The 2-core chip at 6 W needs an embedded board, and the soldered part cannot be replaced.
- Socket
- BGA 1493
- Launched
- January 2021
- Cores and threads
- 2 and 2
- Base power
- 6 W
- Codename
- Elkhart Lake
- Segment
- Embedded
- Family
- Intel Atom
- Clocks
- 1.2 GHz
Intel Atom x6212RE specifications
| Cores | 2 |
|---|---|
| Threads | 2 |
| Core architecture | Tremont (Elkhart Lake) |
| Clocks | 1.20 GHz fixed, no burst |
| Cache | 1.5 MB L2 |
| Processor base power (TDP) | 6 W |
| Manufacturing process | 10 nm |
| Memory support | DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled |
| PCI Express | PCIe Gen3, 8 lanes from the SoC |
| Integrated graphics | Intel UHD Graphics (16 execution units, 350 MHz fixed) |
| Multiplier | Locked |
| Package | FCBGA1493 soldered, 35 × 24 mm |
| Cooler in the box | None (embedded cooling) |
Motherboard compatibility
Intel Atom x6212RE needs a motherboard with a BGA 1493 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1493 chipset list and the board maker's CPU support list.
BGA 1493 at a glance
| Type | BGA, 1,493 contacts |
|---|---|
| Package size | 35 × 24 mm |
| Introduced | January 2023 |
| Memory | DDR4-3200 or LPDDR4x-4267, single channel, up to 32 GB, board dependent with In-Band ECC where enabled |
| Cooler mounting holes | Not applicable (soldered) |
What the Atom x6212RE is
The Intel Atom x6212RE is a 2-core, 2-thread Elkhart Lake processor for BGA 1493 embedded boards from January 2021. Tremont cores run 1.20 GHz fixed, no burst, backed by 1.5 MB L2. Processor base power is 6 W for small enclosures.
Memory support covers DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. One channel keeps board routing simple in compact gateways, and In-Band ECC corrects errors where the board enables it. Eight Gen3 lanes serve NVMe, wireless and expansion on small carriers. Intel UHD Graphics (16 execution units, 350 MHz fixed) drives local displays for kiosks and HMIs.
Industrial controllers take this RE part for continuous real-time duty at extended temperatures. Fixed clocks with no burst keep behavior predictable across years of service. Compare the burst-capable Intel Atom x6211E where peak responsiveness matters.
Socket and motherboard compatibility
The Atom x6212RE fits BGA 1493 on embedded boards with soldered retention. The chip is soldered and cannot be replaced. Carrier lists must name the exact suffix for qualification, since E, RE and FE differ in burst and temperature behavior.
There is no socketed variant and no board choice beyond the carrier design. Memory type, display outputs and expansion follow the gateway or controller layout. Boards for the 6 W dual-core class share carriers with 12 W quad-core parts such as Intel Atom x6211E.
Memory, PCIe and cooling
DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. Matched modules hold the rated speed on the single channel.
Eight Gen3 lanes from the SoC serve NVMe, wireless and expansion on small carriers. Lane splits follow the carrier manual.
Cooling belongs to the enclosure maker across the 6 W band with spreaders or small fans. No boxed cooler exists. Paste service follows the carrier manual for the small soldered package.
Suffixes and clock behavior
RE marks industrial parts for continuous real-time duty at extended temperatures with fixed clocks and no burst. The Atom x6212RE holds 1.20 GHz with no burst, which suits control loops and certified timing.
Extended temperatures span minus 40 C to plus 85 C ambient on these SKUs, with junction limits above 100 C. Industrial buyers match the suffix to the site: RE for real-time control, FE for functional safety, E for broad embedded use.
Boards pair these SKUs with single-channel DDR4 or LPDDR4 modules up to 32 GB depending on the carrier, since soldered LPDDR designs fix memory at order time. Industrial buyers match the suffix to the site temperature range before volume orders.
Upgrade paths
On BGA 1493 the moves run from dual-core 6 W parts through this 2-core SKU to 12 W quad-core options such as Intel Atom x6211E on carriers that take the power. Core growth needs no carrier change when the maker lists the part.
Beyond the series the replacement is a whole carrier on newer Atom platforms. The CPU cooler compatibility by socket guide explains when a platform change pays off.
Frequently asked questions
What socket does the Intel Atom x6212RE use?
It uses BGA 1493, a soldered BGA for Atom embedded processors. The chip cannot be replaced.
How many cores does the Intel Atom x6212RE have?
2 cores with 2 threads at 1.20 GHz fixed, no burst, with 1.5 MB L2.
Why does the Intel Atom x6212RE list a fixed clock?
Fixed clocks with no burst keep behavior predictable in industrial and safety duty.
What graphics does the Intel Atom x6212RE include?
Intel UHD Graphics (16 execution units, 350 MHz fixed).
What memory does the Intel Atom x6212RE support?
DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled.
What is the TDP of the Intel Atom x6212RE?
6 W with embedded cooling.
What cooler fits this processor?
None boxed. The enclosure cools the soldered chip with spreaders or small fans.
What is the package size?
35 × 24 mm soldered, shared across the Elkhart Lake stack.
When did the Intel Atom x6212RE launch?
January 2021 with the Atom x6000 embedded stack.
Sources and verification
Facts last checked against these sources on . Page last edited on .