Intel Atom x6200FE socket: BGA 1493
The Intel Atom x6200FE uses the BGA 1493 package, a grid array that solders to the board. It is a 2-core Elkhart Lake processor at 4.5 W, and the soldered chip cannot be replaced.
- Socket
- BGA 1493
- Launched
- January 2021
- Cores and threads
- 2 and 2
- Base power
- 4.5 W
- Codename
- Elkhart Lake
- Segment
- Embedded
- Family
- Intel Atom
- Clocks
- 1.0 GHz
Intel Atom x6200FE specifications
| Cores | 2 |
|---|---|
| Threads | 2 |
| Core architecture | Tremont (Elkhart Lake) |
| Clocks | 1.00 GHz fixed, no burst |
| Cache | 1.5 MB L2 |
| Processor base power (TDP) | 4.5 W |
| Manufacturing process | 10 nm |
| Memory support | DDR4 up to 2400 MT/s or LPDDR4 up to 2400 MT/s, single channel, up to 32 GB, In-Band ECC where enabled |
| PCI Express | PCIe Gen3, 8 lanes from the SoC |
| Integrated graphics | None (no integrated graphics) |
| Multiplier | Locked |
| Package | FCBGA1493 soldered, 35 × 24 mm |
| Cooler in the box | None (embedded cooling) |
Motherboard compatibility
Intel Atom x6200FE needs a motherboard with a BGA 1493 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1493 chipset list and the board maker's CPU support list.
BGA 1493 at a glance
| Type | BGA, 1,493 contacts |
|---|---|
| Package size | 35 × 24 mm |
| Introduced | January 2023 |
| Memory | DDR4-3200 or LPDDR4x-4267, single channel, up to 32 GB, board dependent with In-Band ECC where enabled |
| Cooler mounting holes | Not applicable (soldered) |
What the Atom x6200FE is
The Intel Atom x6200FE is a 2-core, 2-thread Elkhart Lake processor for BGA 1493 systems from January 2021. Clocks hold 1.00 GHz with no burst, backed by 1.5 MB L2. Processor base power is 4.5 W for small enclosures.
Memory support covers DDR4 up to 2400 MT/s or LPDDR4 up to 2400 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. One channel keeps board routing simple in compact gateways, and In-Band ECC corrects errors where the board enables it. Eight Gen3 lanes serve NVMe, wireless and expansion on small carriers. The graphics block is absent, so carrier boards stay headless or add a display device.
Functional-safety controllers take this fixed-clock Atom with no graphics block for headless real-time duty. The 1.00 GHz pace never bursts, which keeps control loops predictable across years of service. The burst-capable Intel Atom x6211E suits gateways that idle and spike instead.
Socket and motherboard compatibility
The Atom x6200FE fits the BGA 1493 soldered package. The chip is soldered and cannot be replaced. Makers solder it with cooling for the 4.5 W band, so configuration happens once at order time.
There is no socketed variant and no board choice beyond the carrier design. Memory type, display outputs and expansion follow the gateway layout, with E, RE and FE suffixes marking temperature and safety behavior. Carriers for the 6 W dual-core class share layouts with 12 W quad-core parts.
Memory, PCIe and cooling
DDR4 up to 2400 MT/s or LPDDR4 up to 2400 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. Matched modules hold the rated speed on the single channel. Single-channel routing keeps small carriers cheap.
Gen3 lanes wire NVMe, wireless and board devices, with the split fixed per design.
Cooling belongs to the enclosure maker across the 4.5 W band with spreaders or small fans. No boxed cooler exists. Paste service follows the carrier manual for the small soldered package.
Suffixes and embedded duty
The suffix on the Intel Atom x6200FE places it in the embedded stack: E for broad-market boards, RE for industrial real-time duty at extended temperatures, and FE for functional-safety designs. This SKU holds 1.00 GHz with no burst, which suits control loops and certified timing.
Extended temperatures span minus 40 C to plus 85 C ambient on these SKUs, with junction limits above 100 C. Industrial buyers match the suffix to the site: RE for real-time control, FE for functional safety, E for broad embedded use. N marks mobile-style boards while J marks desktop-style carriers.
Upgrade paths
On BGA 1493 the moves run from dual-core 5 W parts through this 2-core SKU to 12 W quad-core options such as Intel Atom x6211E on carriers that take the power. Core growth needs no carrier change when the maker lists the part.
Beyond the series the replacement is a whole system on newer platforms. The LGA, PGA and BGA: CPU package types explained guide explains when a platform change pays off.
Frequently asked questions
What socket does the Intel Atom x6200FE use?
It uses BGA 1493, a soldered grid array. The chip cannot be replaced.
How many cores does the Intel Atom x6200FE have?
2 cores with 2 threads at 1.00 GHz fixed, with 1.5 MB L2.
What graphics does the Intel Atom x6200FE include?
No integrated graphics block on this SKU.
What memory does the Intel Atom x6200FE support?
DDR4 up to 2400 MT/s or LPDDR4 up to 2400 MT/s, single channel, up to 32 GB, In-Band ECC where enabled.
What is the TDP of the Intel Atom x6200FE?
4.5 W base power.
What cooler fits this processor?
None boxed. The enclosure cools the soldered chip.
When did the Intel Atom x6200FE launch?
January 2021 2021.
Does this processor have L3 cache?
No L3 on these SKUs. A total of 1.5 MB of shared L2 serves the Tremont cores.
What is the package size?
35 × 24 mm soldered, shared across the Elkhart Lake stack with 1493 balls.
Sources and verification
- Intel Intel Atom x6200FE specifications (Intel ARK)
- Intel Intel Atom x6200FE specs (TechPowerUp CPU database)
Facts last checked against these sources on . Page last edited on .