Intel Atom x6414RE socket: BGA 1493

What the Atom x6414RE is

Intel Atom x6414RE, launched in January 2021 for BGA 1493, brings 4 Tremont cores to fanless gateways and controllers. Tremont cores run 1.50 GHz fixed, no burst, backed by 1.5 MB L2. Processor base power is 9 W for small enclosures.

Memory support covers DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. One channel keeps board routing simple in compact gateways, and In-Band ECC corrects errors where the board enables it. Eight Gen3 lanes serve NVMe, wireless and expansion on small carriers. Intel UHD Graphics (16 execution units, 400 MHz fixed) drives local displays for kiosks and HMIs.

Industrial controllers take this RE part for continuous real-time duty at extended temperatures. Fixed clocks with no burst keep behavior predictable across years of service. Compare the burst-capable Intel Atom x6425RE where peak responsiveness matters.

Socket and motherboard compatibility

The Atom x6414RE fits BGA 1493 on embedded boards with soldered retention. The chip is soldered and cannot be replaced. Carrier lists must name the exact suffix for qualification, since E, RE and FE differ in burst and temperature behavior.

There is no socketed variant and no board choice beyond the carrier design. Memory type, display outputs and expansion follow the gateway or controller layout. Boards for the 6 W dual-core class share carriers with 12 W quad-core parts such as Intel Atom x6425RE.

Memory, PCIe and cooling

DDR4 up to 3200 MT/s or LPDDR4 up to 3200 MT/s, single channel, up to 32 GB, In-Band ECC where enabled. Matched modules hold the rated speed on the single channel.

Eight Gen3 lanes from the SoC serve NVMe, wireless and expansion on small carriers. Lane splits follow the carrier manual.

Cooling belongs to the enclosure maker across the 9 W band with spreaders or small fans. No boxed cooler exists. Paste service follows the carrier manual for the small soldered package.

Suffixes and clock behavior

RE marks industrial parts for continuous real-time duty at extended temperatures with fixed clocks and no burst. The Atom x6414RE holds 1.50 GHz with no burst, which suits control loops and certified timing.

Extended temperatures span minus 40 C to plus 85 C ambient on these SKUs, with junction limits above 100 C. Industrial buyers match the suffix to the site: RE for real-time control, FE for functional safety, E for broad embedded use.

Boards pair these SKUs with single-channel DDR4 or LPDDR4 modules up to 32 GB depending on the carrier, since soldered LPDDR designs fix memory at order time. Industrial buyers match the suffix to the site temperature range before volume orders.

Upgrade paths

On BGA 1493 the moves run from dual-core 6 W parts through this 4-core SKU to 12 W quad-core options such as Intel Atom x6425RE on carriers that take the power. Core growth needs no carrier change when the maker lists the part.

Beyond the series the replacement is a whole carrier on newer Atom platforms. The LGA, PGA and BGA: CPU package types explained guide explains when a platform change pays off.