AMD Ryzen AI Max+ 395 socket: FP11

What the Ryzen AI Max+ 395 is

The Ryzen AI Max+ 395 is a 16-core, 32-thread mobile APU that AMD launched in January 2025 at the head of the consumer Strix Halo lineup. Its sixteen uniform Zen 5 cores run at 3.0 GHz and boost to 5.1 GHz, backed by 16 MB of L2 and 64 MB of L3 cache for 80 MB of total cache. Graphics come from AMD Radeon 8060S Graphics with the full 40 compute units at up to 2900 MHz, and an XDNA 2 NPU rated at up to 50 TOPS covers local AI work.

The 395 is the halo part in the original sense. It combines the widest CPU configuration with the widest GPU configuration on one package, so a thin laptop or mini workstation gets workstation class thread count and high end integrated graphics without a discrete card. Total platform AI throughput is rated at up to 126 TOPS across CPU, GPU and NPU. Error correcting memory is supported on LPDDR5X, which helps long running work that keeps large data sets resident.

Strix Halo is a chiplet design. Two Zen 5 core chiplets sit beside a large I/O die that holds the graphics engine, the NPU and the 256-bit memory controller, and AMD builds the compute silicon on the TSMC 4 nm FinFET process. The system maker sets power and cooling inside a 45 to 120 W configurable window, with 55 W as the default TDP for this SKU.

Against the rest of the consumer stack, the 395 adds four CPU cores over the 12-core class and widens the GPU from 32 to 40 compute units at the same time. Multithreaded creation work scales with those cores, and games respond to the wider graphics engine fed by the 256-bit memory bus. The PRO twin with management features is the 16-core PRO 395 class documented in the commercial lineup.

Socket and motherboard compatibility

AMD ships the Ryzen AI Max+ 395 only as a soldered part for FP11, which means the processor arrives fixed to the board and it cannot be replaced or upgraded in the field. Assembly solders all 2,077 balls of the 37.5 × 45 mm package in one factory step, and the thermal design is validated for that single configuration through the service life of the machine.

There is no board or chipset choice in the retail sense. The vendor selects the soldered memory capacity, tunes the firmware and validates cooling for the 45 to 120 W window. Moving to a different core count means a different board build, not a part swap, even though the Strix Halo SKUs share the FP11 package. Readers new to soldered packages can review LGA, PGA and BGA: CPU package types explained for how a ball grid array differs from a socketed desktop part.

The FP11 footprint is shared with the embedded branch of Halo silicon, including long lifecycle parts such as the AMD Ryzen AI Embedded X188i, which suits equipment vendors with extended service schedules. The Gorgon Halo refresh later reused the same footprint with a higher memory ceiling, led by the 16-core AMD Ryzen AI Max+ PRO 495. Halo boards stay distinct from mainstream thin laptop designs by memory width, package size and power class.

Memory, PCIe and cooling

Memory is soldered LPDDR5X up to 8000 MT/s on a 256-bit bus, with up to 128 GB in one unified pool shared by the CPU cores, the 40 compute unit graphics engine and the NPU. Up to 96 GB of that pool can be reserved for graphics workloads on the 300 series platform. Error correcting memory is supported, so long running technical workloads get protection against single bit errors in the large shared pool. Capacity is fixed when the board is built, so it ranks with the SKU as a permanent choice.

Expansion comes from 16 PCIe Gen4 lanes from the SoC, which typically serve NVMe storage and high speed peripherals, plus native USB4 ports for docks and external devices. Display and parallel compute run on the integrated Radeon graphics, so the lanes stay free for storage and I/O duties. The exact lane split and port list are set per machine design, so the vendor specification governs.

Cooling is a system responsibility across the 45 to 120 W configurable range. Sixteen Zen 5 cores plus a full 40 compute unit GPU make this the hardest consumer Strix Halo SKU to cool, so chassis choice decides how long the chip holds peak clocks under combined load. There is no boxed cooler and no retail heatsink list for a soldered mobile APU.

Upgrade paths

There is no CPU upgrade path on a soldered package. This SKU already tops the consumer Strix Halo stack in cores, cache and graphics, so a faster chip means a new board or a new machine. When the workload shrinks, the 12-core class is the step down with the same memory platform and a smaller GPU.

Moving off FP11 means a new platform. The Gorgon Halo generation raises the memory ceiling to 192 GB for buyers who outgrow 128 GB, while socketed desktop builders meet related Zen 5 silicon on boards such as AM5. Because memory is soldered on FP11, even a memory size change means a new board, so capacity planning belongs at the start of the project rather than at the end. For identifying which platform a machine uses, How to find your CPU socket type walks through the checks.