AMD Ryzen AI 5 330 socket: FP8

The AMD Ryzen AI 5 330 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is a quad-core Krackan Point 2 APU with a 28 W default TDP, and the soldered processor cannot be replaced.

Socket
FP8
Launched
July 30, 2025
Cores and threads
4 and 8
Default TDP
28 W
Segment
Mobile (soldered)
Clocks
2.0 / 4.5 GHz

AMD Ryzen AI 5 330 specifications

Cores4 (1 Zen 5 and 3 Zen 5c)
Threads8
Core architectureZen 5 and Zen 5c, monolithic Krackan Point 2 die
Clocks2.0 GHz base, up to 4.5 GHz maximum boost (Zen 5c cores up to 3.4 GHz)
Cache8 MB L3 and 4 MB L2 (12 MB total)
Default TDP28 W
Configurable TDP15 to 28 W
Manufacturing processTSMC 4 nm
Memory supportDDR5-5600 or soldered LPDDR5X up to 8000 MT/s, two channels, up to 256 GB (16 GB or more for Copilot+)
PCI ExpressPCIe 4.0, 14 total lanes and 14 usable, for NVMe storage and expansion
Integrated graphicsRadeon 820M, 2 compute units, up to 2800 MHz
NPUXDNA 2, up to 50 TOPS (up to 56 TOPS platform total)
MultiplierLocked
PackageFP8 (BGA1140, 25 × 40 mm, soldered)

Motherboard compatibility

AMD Ryzen AI 5 330 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.

FP8 at a glance

TypeBGA, 1,140 contacts
Package size25 × 40 mm
Introduced2023
MemoryDDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards
Cooler mounting holesNot applicable (soldered)

Read the full FP8 socket guide

What the Ryzen AI 5 330 is

The Ryzen AI 5 330 is the entry quad-core of the Ryzen AI 300 family, built on the cut-down Krackan Point 2 die. One full-size Zen 5 core and three compact Zen 5c cores give 8 threads at 2.0 GHz base, with the fast core boosting to 4.5 GHz and the compact cores to 3.4 GHz. Cache totals 4 MB of L2 plus 8 MB of L3. The chip is built on TSMC 4 nm as a single small monolithic die, and its default TDP is 28 W inside a narrow 15 to 28 W configurable range.

Graphics come from just 2 RDNA 3.5 compute units as Radeon 820M at up to 2800 MHz. That size drives the desktop, video playback and everyday applications with ease, while 3D games at high settings are beyond it. The surprise is the NPU: a full-size XDNA 2 unit with up to 50 TOPS, the same NPU rating as the larger Krackan chips, with combined platform throughput up to 56 TOPS. Systems with enough memory earn Copilot+ certification, which is exactly why this chip exists.

Against the 6-core Krackan parts above it, the 330 trades cores, cache and graphics size for a lower price floor that brings Copilot+ to mainstream laptops. Office work, study, browsing and streaming run well within four cores, and battery life benefits from the small die. AMD lists a July 30, 2025 launch date, and entry laptops from makers such as Lenovo carried this APU in the months after.

Socket and motherboard compatibility

The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.

Entry laptops pair this APU with cost sensitive boards, where the narrow 15 to 28 W range simplifies the thermal design. Firmware and drivers come from the laptop maker, so the support page for the exact laptop model is the reference that matters. Fourteen usable PCIe Gen4 lanes cover a boot SSD plus card readers and networking, so check the board layout before assuming room for more.

Memory, PCIe and cooling

Systems pair the 330 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels to 256 GB. DDR5-5600 is the fastest socketed speed AMD lists for the platform, while soldered LPDDR5X reaches 8000 MT/s. Two compute units lean on memory bandwidth, so a dual-channel configuration matters more here than on larger chips. Soldered memory sizes freeze at purchase, and Copilot+ features need 16 GB or more in the system.

Expansion comes from 14 usable PCIe Gen4 lanes for NVMe storage and add-on devices. USB4 ports from the SoC handle docking stations, fast external drives and extra displays, with up to four monitors supported from the integrated graphics. Entry chassis rarely expose every interface the silicon offers, so confirm ports and SSD slots in the laptop specification sheet.

Cooling spans only 15 to 28 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. The tight range means thin and light chassis can cool the chip without exotic thermal designs. Boost behavior still tracks power and temperature on each machine, so reviews of the exact laptop model show what sustained performance to expect.

Upgrade paths

Soldered laptop silicon cannot be upgraded, so buyers pick the memory size and storage at purchase and judge used machines on battery health and panel quality. The 330 suits buyers who want an affordable Copilot+ laptop for office work, study and streaming. Buyers who edit video, program with large projects or play 3D games should step to a 6-core Krackan design or to a laptop with discrete graphics.

Shoppers should compare the whole laptop rather than the core count alone. Sixteen gigabytes of memory in dual channel, a decent display and a healthy battery decide daily experience more than the APU badge at this tier. Used buyers should weigh battery condition first, since a soldered processor can never be swapped to fix a slow machine.

Frequently asked questions

What socket does the Ryzen AI 5 330 use?

It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.

How are the 4 cores of the Ryzen AI 5 330 arranged?

One full-size Zen 5 core reaches up to 4.5 GHz, and three compact Zen 5c cores reach up to 3.4 GHz, sharing 8 MB of L3 cache for 8 threads in total.

What memory does the Ryzen AI 5 330 support?

Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 8000 MT/s, over two channels to 256 GB.

Does the Ryzen AI 5 330 include an NPU?

Yes, a full-size XDNA 2 NPU with up to 50 TOPS, plus up to 56 TOPS of combined platform throughput, which earns Copilot+ certification with enough system memory.

Sources and verification

  1. AMD Ryzen AI 5 330 (AMD)
  2. AMD Ryzen AI 5 330 Krackan Point 2 Silicon Has 1P+3C Cores (TechPowerUp)
  3. AMD Ryzen AI 5 330 Specs (TechPowerUp)

Facts last checked against these sources on . Page last edited on .