AMD Ryzen 5 230 socket: FP8
The AMD Ryzen 5 230 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is a 6-core Hawk Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- February 18, 2025
- Cores and threads
- 6 and 12
- Default TDP
- 28 W
- Codename
- Hawk Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen 5
- Clocks
- 3.5 / 4.9 GHz
AMD Ryzen 5 230 specifications
| Cores | 6 |
|---|---|
| Threads | 12 |
| Core architecture | Zen 4, monolithic Hawk Point die |
| Clocks | 3.5 GHz base, up to 4.9 GHz maximum boost |
| Cache | 16 MB L3 and 6 MB L2 (22 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 30 W |
| Manufacturing process | TSMC 4 nm FinFET |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 7500 MT/s, two channels, DDR5 up to 96 GB and LPDDR up to 64 GB |
| PCI Express | PCIe 4.0, 20 total lanes and 20 usable, for NVMe storage and expansion |
| Integrated graphics | Radeon 760M, 8 compute units, up to 2600 MHz |
| NPU | XDNA, up to 16 TOPS (up to 31 TOPS platform total) |
| Multiplier | Locked |
| Package | FP8 (BGA1140, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen 5 230 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen 5 230 is
The Ryzen 5 230 is the 28 W six-core of the Ryzen 200 laptop lineup, built on the Hawk Point refresh of the Zen 4 architecture. Six full-size Zen 4 cores with simultaneous multithreading give 12 threads at a 3.5 GHz base clock, with boost speeds up to 4.9 GHz on lightly threaded work. Cache totals 6 MB of L2 plus 16 MB of L3. The chip is built on TSMC 4 nm as a single monolithic die of 178 square millimeters, and its default TDP of 28 W sits inside a 15 to 30 W configurable range that laptop makers set per design.
Graphics come from 8 RDNA 3 compute units as Radeon 760M at up to 2600 MHz. That size handles office displays, video playback and photo work with ease, and it plays light games at modest settings without a discrete card. The XDNA NPU reaches up to 16 TOPS, with combined platform throughput up to 31 TOPS across the CPU, GPU and NPU. Everyday tasks such as document work, web conferencing with background effects and classroom software all run comfortably inside this envelope.
Against the Ryzen 5 220 below it, the 230 uses six full-size Zen 4 cores instead of a mix of full-size and compact cores, and it steps graphics up from Radeon 740M to Radeon 760M. Buyers who keep many browser tabs open while running office applications will feel the steadier response. AMD announced the Ryzen 200 series at CES in January 2025 and lists February 18, 2025 as the launch date for this SKU, with laptops from makers such as HP and Lenovo carrying it through that year.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Mainstream everyday laptops pair this APU with either socketed DDR5 or soldered LPDDR5X, depending on whether the design favors serviceability or thinness. Firmware and drivers come from the laptop maker, so the support page for the exact laptop model is the reference that matters. Thicker performance designs can configure the chip toward the top of its 15 to 30 W range, while thin designs hold it near the bottom for quieter running.
Memory, PCIe and cooling
Systems pair the 230 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels. DDR5-5600 is the fastest socketed speed AMD lists for the platform, while soldered LPDDR5X reaches 7500 MT/s for extra graphics bandwidth. DDR5 configurations scale to 96 GB and LPDDR configurations to 64 GB. Eight graphics compute units reward fast dual-channel memory, so a matched pair of modules gives the best result in games and photo work. Soldered memory sizes freeze at purchase, so buyers should choose capacity with the full life of the machine in mind.
Expansion comes from 20 usable PCIe Gen4 lanes for NVMe storage and add-on devices, plus two native USB4 ports from the SoC for docking stations, fast external drives and extra displays. The integrated graphics drives up to four monitors, which suits desk setups with a laptop dock. Lane splits are fixed per board, so check the laptop specification sheet before assuming a second fast SSD slot.
Cooling spans 15 to 30 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. Boost behavior tracks power and temperature on each machine, so the same APU scores differently in a thin ultrabook and a thicker performance chassis. The maximum operating temperature is 100 degrees C, and sustained loads settle where the cooling design allows. Reviews of the exact laptop model show what performance to expect over long sessions.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, memory size and panel quality. The 230 suits buyers who want a responsive everyday laptop for study, office work and light creation. Buyers who only browse and write can save money with the smaller chip below it, while buyers who edit video or compile code regularly should look at the 8-core Ryzen 7 parts.
The Ryzen 5 PRO 230 twin shares the die, clocks, graphics and NPU but adds fleet management features that only IT departments use. A home buyer with one machine gains nothing from the PRO badge and should compare complete laptops on display, keyboard, battery and service options instead. Gaming laptops with this APU plus a discrete card are judged on the card and the screen as much as on the processor.
Frequently asked questions
What socket does the Ryzen 5 230 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.
How fast is the Ryzen 5 230?
Six full-size Zen 4 cores with simultaneous multithreading give 12 threads, a 3.5 GHz base clock and boost speeds up to 4.9 GHz, backed by 6 MB of L2 and 16 MB of L3 cache.
What memory does the Ryzen 5 230 support?
Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 7500 MT/s, over two channels, with DDR5 configurations up to 96 GB and LPDDR configurations up to 64 GB.
Does the Ryzen 5 230 include an NPU?
Yes, an XDNA NPU with up to 16 TOPS, inside up to 31 TOPS of combined platform throughput from the CPU, GPU and NPU together.
Sources and verification
Facts last checked against these sources on . Page last edited on .