AMD Ryzen 7 250 socket: FP8
The AMD Ryzen 7 250 uses the FP8 package, a 25 × 40 mm grid array that solders to the laptop board. It is an 8-core Hawk Point APU with a 28 W default TDP, and the soldered processor cannot be replaced.
- Socket
- FP8
- Launched
- February 18, 2025
- Cores and threads
- 8 and 16
- Default TDP
- 28 W
- Codename
- Hawk Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen 7
- Clocks
- 3.3 / 5.1 GHz
AMD Ryzen 7 250 specifications
| Cores | 8 |
|---|---|
| Threads | 16 |
| Core architecture | Zen 4, monolithic Hawk Point die |
| Clocks | 3.3 GHz base, up to 5.1 GHz maximum boost |
| Cache | 16 MB L3 and 8 MB L2 (24 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 30 W |
| Manufacturing process | TSMC 4 nm FinFET |
| Memory support | DDR5-5600 or soldered LPDDR5X up to 7500 MT/s, two channels, DDR5 up to 96 GB and LPDDR up to 64 GB |
| PCI Express | PCIe 4.0, 20 total lanes and 20 usable, for NVMe storage and expansion |
| Integrated graphics | Radeon 780M, 12 compute units, up to 2700 MHz |
| NPU | XDNA, up to 16 TOPS (up to 38 TOPS platform total) |
| Multiplier | Locked |
| Package | FP8 (BGA1140, 25 × 40 mm, soldered) |
Motherboard compatibility
AMD Ryzen 7 250 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen 7 250 is
The Ryzen 7 250 is the 28 W eight-core of the Ryzen 200 laptop lineup, built on the Hawk Point refresh of the Zen 4 architecture. Eight full-size Zen 4 cores with simultaneous multithreading give 16 threads at a 3.3 GHz base clock, with boost speeds up to 5.1 GHz on lightly threaded work. Cache totals 8 MB of L2 plus 16 MB of L3. The chip is built on TSMC 4 nm as a single monolithic die of 178 square millimeters, and its default TDP of 28 W sits inside a 15 to 30 W configurable range that laptop makers set per design.
Graphics come from 12 RDNA 3 compute units as Radeon 780M at up to 2700 MHz. That is the same large integrated GPU as the higher-wattage Ryzen 7 260, so thin laptops without a discrete card still play popular games at 1080p with restrained settings and accelerate photo and video work. The XDNA NPU reaches up to 16 TOPS, with combined platform throughput up to 38 TOPS across the CPU, GPU and NPU. This combination of eight cores and a large GPU at 28 W is what makes the chip stand out for ultrabooks.
Against the Ryzen 5 230 below it, the 250 adds two cores, steps graphics from 8 compute units to 12, and keeps the same 28 W envelope and 5.1 GHz class boost. Buyers who edit photos, run virtual machines or keep heavy multitasking sessions open will feel the difference, while pure office work runs much the same on either chip. AMD announced the Ryzen 200 series at CES in January 2025 and lists February 18, 2025 as the launch date for this SKU, with thin and light laptops from makers such as HP and Lenovo carrying it.
Socket and motherboard compatibility
The chip solders into FP8, the 25 × 40 mm BGA that carries recent AMD mobile generations, so it cannot be removed or swapped after manufacture. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. There is no socket lever, no retention bracket and no secondhand upgrade market for the processor itself. The LGA, PGA and BGA: CPU package types explained guide explains how soldered packages differ from socketed ones.
Thin and light ultrabooks are the natural home for this APU, where the 28 W default fits slim cooling without giving up cores. Firmware and drivers come from the laptop maker, so the support page for the exact laptop model is the reference that matters. Most designs rely on the Radeon 780M alone, which makes fast dual-channel memory the single most effective configuration choice.
Memory, PCIe and cooling
Systems pair the 250 with DDR5 SODIMM modules or soldered LPDDR5X, over two channels. DDR5-5600 is the fastest socketed speed AMD lists for the platform, while soldered LPDDR5X reaches 7500 MT/s for extra graphics bandwidth. DDR5 configurations scale to 96 GB and LPDDR configurations to 64 GB. Twelve graphics compute units share system memory, so a matched dual-channel configuration gives the best result in games and GPU-accelerated creation. Soldered memory sizes freeze at purchase, so buyers should choose capacity with the full life of the machine in mind.
Expansion comes from 20 usable PCIe Gen4 lanes for NVMe storage and add-on devices, plus two native USB4 ports from the SoC for docking stations, fast external drives and extra displays. The integrated graphics drives up to four monitors, which suits desk setups with a laptop dock. Lane splits are fixed per board, so check the laptop specification sheet before assuming a second fast SSD slot.
Cooling spans 15 to 30 W around the 28 W default and belongs to the laptop maker, with heat pipes and fans drawn for the configured TDP of each model. The modest default lets slim machines sustain their clocks with less fan noise than 45 W designs. The maximum operating temperature is 100 degrees C, and sustained loads settle where the cooling design allows. Reviews of the exact laptop model show what performance to expect over long sessions.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick the core count, graphics size and memory at purchase and judge used machines on battery health, memory size and panel quality. The 250 suits buyers who want eight cores and strong integrated graphics in a portable machine with good battery life. Buyers who run long sustained all-core loads may prefer the 45 W Ryzen 7 260, which holds higher clocks in thicker chassis at the cost of heat and noise.
The Ryzen 7 PRO 250 twin shares the die, clocks, graphics and NPU but adds fleet management features that only IT departments use. A home buyer with one machine gains nothing from the PRO badge and should compare complete laptops on display, keyboard, battery and service options instead. A used machine with this chip is judged on battery wear and cooling condition as much as on the specification sheet.
Frequently asked questions
What socket does the Ryzen 7 250 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered, so a laptop upgrade means replacing the whole system.
How fast is the Ryzen 7 250?
Eight full-size Zen 4 cores with simultaneous multithreading give 16 threads, a 3.3 GHz base clock and boost speeds up to 5.1 GHz, backed by 8 MB of L2 and 16 MB of L3 cache.
What memory does the Ryzen 7 250 support?
Boards use DDR5 SODIMM modules at up to DDR5-5600 or soldered LPDDR5X up to 7500 MT/s, over two channels, with DDR5 configurations up to 96 GB and LPDDR configurations up to 64 GB.
Does the Ryzen 7 250 include an NPU?
Yes, an XDNA NPU with up to 16 TOPS, inside up to 38 TOPS of combined platform throughput from the CPU, GPU and NPU together.
Sources and verification
Facts last checked against these sources on . Page last edited on .