Qualcomm BGA 2073 socket: CPUs, chipsets and cooler fit
Qualcomm BGA 2073 is a soldered package for Snapdragon X1 Elite and X1 Plus processors. It is a ball grid array with 2,073 contacts covering 8-core Plus models and 12-core Elite models.
Quick facts
| Maker | Qualcomm |
|---|---|
| Package type | BGA |
| Contacts | 2,073 |
| Package size | n/a |
| Introduced | April 2024 |
| Status | Previous generation |
| Memory | LPDDR5X-8448, 135 GB/s shared bandwidth, up to 64 GB |
| PCIe from the CPU | PCIe Gen4 (12 lanes on Plus 8-core parts, per-class layout otherwise) plus NVMe over Gen4 and UFS 4.0 |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The package carries first-generation Oryon cores with Adreno X1 graphics and a 45 TOPS Hexagon NPU for Copilot+ laptops. Memory is soldered LPDDR5X-8448 shared between CPU, GPU and NPU with 135 GB per s of bandwidth.
BGA 2073 spans the April 2024 Elite 12-core launch and the August 2024 Plus 8-core expansion. The soldered design fixes cores, memory and NPU at purchase, so laptop choice decides the full configuration.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Oryon | Snapdragon X1 Elite and Plus series | 2024 | First-generation Oryon cores with Adreno X1 graphics and a 45 TOPS Hexagon NPU for Copilot+ laptops, launched in April 2024 with Plus 8-core parts in August 2024. |
Soldered package
BGA 2073 processors are soldered and cannot be removed or replaced. Cooling follows the laptop design for each model class from 23 W value Plus parts to 35 W Elite flagships, and memory is soldered LPDDR5X-8448 chosen by the vendor.
Compare full laptop designs including display, battery and ports, since the processor and memory cannot be upgraded later.
Memory, expansion and cooling
Memory on BGA 2073 is soldered LPDDR5X-8448 with 135 GB per s shared by Oryon CPU, Adreno X1 graphics and Hexagon NPU. Capacity up to 64 GB is fixed at order time. Expansion comes from NVMe over Gen4 plus UFS 4.0 and triple UHD display output through the board.
CPUs on Qualcomm BGA 2073
8 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Qualcomm Snapdragon X1P-46-100 | 8 / 8 | 3.4 / 4.0 GHz | 30 W | Sep 2024 |
| Qualcomm Snapdragon X1P-26-100 | 8 / 8 | 3.0 / 3.0 GHz | 25 W | Aug 2024 |
| Qualcomm Snapdragon X1P-42-100 | 8 / 8 | 3.2 / 3.4 GHz | 30 W | Aug 2024 |
| Qualcomm Snapdragon X1E-78-100 | 12 / 12 | 3.4 / 3.4 GHz | 35 W | Apr 2024 |
| Qualcomm Snapdragon X1E-80-100 | 12 / 12 | 3.4 / 4.0 GHz | 35 W | Apr 2024 |
| Qualcomm Snapdragon X1E-84-100 | 12 / 12 | 3.8 / 4.2 GHz | 35 W | Apr 2024 |
| Qualcomm Snapdragon X1P-64-100 | 10 / 10 | 3.4 / 3.4 GHz | 35 W | Apr 2024 |
| Qualcomm Snapdragon X1P-66-100 | 10 / 10 | 3.4 / 4.0 GHz | 35 W | Apr 2024 |
Frequently asked questions
Can a BGA 2073 processor be upgraded?
No. The processor is soldered to the board, so an upgrade means replacing the board or the whole laptop.
Which processors fit Qualcomm BGA 2073?
Snapdragon X1 Elite 12-core models and Snapdragon X1 Plus 8-core models from April and August 2024.
What memory does BGA 2073 use?
LPDDR5X-8448 with 135 GB per s of bandwidth shared by CPU, Adreno GPU and Hexagon NPU, up to 64 GB.
Sources and verification
- Snapdragon X Elite ARM laptop processors specs X1E table (Qualcomm)
- Snapdragon X Plus 8-core Product Brief X1P-42-100 X1P-46-100 (Qualcomm)
- Qualcomm Snapdragon X Elite and X Plus laptop chips explained table (CNET)
Facts last checked against these sources on . Page last edited on .