Qualcomm Snapdragon X1E-78-100 socket: Qualcomm BGA 2073
The Qualcomm Snapdragon X1E-78-100 uses Qualcomm BGA 2073, soldered with 2,073 balls. It is a 12-core Snapdragon X Elite part running at 3.4 GHz, and the soldered chip cannot be replaced or upgraded.
- Socket
- Qualcomm BGA 2073
- Launched
- April 2024
- Cores and threads
- 12 and 12
- Base power
- 35 W
- Codename
- Oryon
- Segment
- Mobile (soldered)
- Clocks
- 3.4 / 3.4 GHz
Qualcomm Snapdragon X1E-78-100 specifications
| Cores | 12 |
|---|---|
| Threads | 12 (one thread per core) |
| Core architecture | Qualcomm Oryon (Oryon v1), ARM64 compatible |
| Clocks | 3.4 GHz multi-core, no dual-core boost |
| Cache | 42 MB total |
| Processor base power (TDP) | 35 W |
| Manufacturing process | 4 nm (TSMC) |
| Memory support | LPDDR5X-8448, 135 GB/s shared, up to 64 GB |
| PCI Express | PCIe Gen4 (12 lanes on Plus-class layouts, per-class otherwise) |
| Integrated graphics | Qualcomm Adreno X1, up to 3.8 TFLOPS |
| NPU | Qualcomm Hexagon, 45 TOPS |
| Multiplier | Locked |
| Package | BGA2073 (soldered, 2073 balls) |
Motherboard compatibility
Qualcomm Snapdragon X1E-78-100 needs a motherboard with a Qualcomm BGA 2073 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2073 chipset list and the board maker's CPU support list.
Qualcomm BGA 2073 at a glance
| Type | BGA, 2,073 contacts |
|---|---|
| Package size | n/a |
| Introduced | April 2024 |
| Memory | LPDDR5X-8448, 135 GB/s shared bandwidth, up to 64 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Snapdragon X1E-78-100 is
The Snapdragon X1E-78-100 is a 12-core and 12-thread laptop processor that Qualcomm launched in April 2024 as the entry Snapdragon X Elite tier. Twelve Oryon cores with one thread each give 12 threads at 3.4 GHz multi-core with no dual-core boost. Cache totals 42 MB. The 35 W class with 12 W minimum and higher turbo headroom fits thin Copilot+ laptops with all-day battery goals.
Adreno X1 graphics at up to 3.8 TFLOPS drive three external UHD displays plus the laptop panel. A 45 TOPS Hexagon NPU handles Copilot+ AI locally while CPU and GPU stay free for apps. LPDDR5X-8448 with 135 GB per s of shared bandwidth feeds all three engines from one soldered pool up to 64 GB.
Students and office travelers who want Elite cores without boost pricing fit here. Twelve cores keep builds plus calls smooth at 3.4 GHz. Buyers who need 4.0 GHz bursts for single-threaded snaps should take the Qualcomm Snapdragon X1E-80-100 with dual-core boost instead, since this 78-100 prioritizes steady clocks.
Socket and motherboard compatibility
The X1E-78-100 solders to Qualcomm BGA 2073 with 2,073 balls and soldered LPDDR5X. Laptop makers cool the 23 to 35 W band with thin fans. There is no socket and no later change to chip or memory, so the order sheet fixes the laptop for life.
Boards use LPDDR5X-8448 in 8 channels up to 64 GB. NVMe over Gen4 plus UFS 4.0 covers storage. Firmware from the laptop maker controls power limits, not a desktop BIOS menu.
X Elite shoppers compare the three 12-core tiers on boost and GPU. The 78-100 trails boosted twins on bursts. The LGA, PGA and BGA: CPU package types explained guide explains why ARM laptop designs stay soldered for power.
Memory, PCIe and cooling
LPDDR5X-8448 with 135 GB per s shared by CPU, Adreno and Hexagon NPU is the fixed pool. Capacity up to 64 GB should be sized with AI models plus browser loads in mind. Soldered size cannot grow later, so 32 GB is a common balanced order.
PCIe Gen4 with 12 lanes on Plus-class layouts serves NVMe and wireless. Fixed board wiring means second-drive support varies by model. Three UHD displays plus panel output cover desk setups.
Cooling is a thin-body fan design around the 23 to 35 W band. No retail cooler ships with soldered ARM. Vent clearance preserves the 3.4 GHz sustained feel.
Upgrade paths
No processor or memory upgrade exists on soldered boards. The X Elite choice is 78-100 versus boosted twins at order time. Storage via NVMe is the only later change.
Beyond X1 the move is a whole laptop on Snapdragon X2 with newer Oryon cores. A working 78-100 lasts school years with drive care.
Frequently asked questions
What socket does the Snapdragon X1E-78-100 use?
It uses Qualcomm BGA 2073, soldered with 2,073 balls. Neither chip nor memory can be replaced.
How fast is the Snapdragon X1E-78-100?
Twelve cores and 12 threads at 3.4 GHz with no dual-core boost, with 42 MB of total cache.
What memory does the X1E-78-100 support?
LPDDR5X-8448 with 135 GB per s shared by CPU, GPU and NPU, up to 64 GB.
Can the X1E-78-100 be upgraded?
No. CPU solders at the factory. Only storage can change later.
Sources and verification
- Snapdragon X Elite ARM laptop processors specs X1E table (Qualcomm)
- Qualcomm Snapdragon X Elite and X Plus laptop chips explained table (CNET)
Facts last checked against these sources on . Page last edited on .