Qualcomm Snapdragon X1P-42-100 socket: Qualcomm BGA 2073
The Qualcomm Snapdragon X1P-42-100 uses Qualcomm BGA 2073, soldered with 2,073 balls. It is an 8-core Snapdragon X Plus part running at 3.2 GHz with up to 3.4 GHz single-core boost, and the soldered chip cannot be replaced.
- Socket
- Qualcomm BGA 2073
- Launched
- August 2024
- Cores and threads
- 8 and 8
- Base power
- 30 W
- Codename
- Oryon
- Segment
- Mobile (soldered)
- Clocks
- 3.2 / 3.4 GHz
Qualcomm Snapdragon X1P-42-100 specifications
| Cores | 8 |
|---|---|
| Threads | 8 (one thread per core) |
| Core architecture | Qualcomm Oryon (Oryon v1), ARM64 compatible |
| Clocks | 3.2 GHz multi-core, up to 3.4 GHz single-core boost |
| Cache | 30 MB total, 6 MB L3 shared |
| Processor base power (TDP) | 30 W |
| Manufacturing process | 4 nm (TSMC) |
| Memory support | LPDDR5X-8448, 135 GB/s shared, up to 64 GB |
| PCI Express | PCIe 4.0 x12 |
| Integrated graphics | Qualcomm Adreno X1-45, up to 1.7 TFLOPS |
| NPU | Qualcomm Hexagon, 45 TOPS |
| Multiplier | Locked |
| Package | BGA2073 (soldered, 2073 balls) |
Motherboard compatibility
Qualcomm Snapdragon X1P-42-100 needs a motherboard with a Qualcomm BGA 2073 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2073 chipset list and the board maker's CPU support list.
Qualcomm BGA 2073 at a glance
| Type | BGA, 2,073 contacts |
|---|---|
| Package size | n/a |
| Introduced | April 2024 |
| Memory | LPDDR5X-8448, 135 GB/s shared bandwidth, up to 64 GB |
| Cooler mounting holes | Not applicable (soldered) |
What the Snapdragon X1P-42-100 is
The Snapdragon X1P-42-100 is an 8-core and 8-thread laptop processor that Qualcomm launched in August 2024 as the boosted Snapdragon X Plus 8-core option. Eight Oryon cores with one thread each give 8 threads at 3.2 GHz multi-core with up to 3.4 GHz single-core boost. Cache totals 30 MB with 6 MB of shared L3 in NanoReview readings. The 30 W class with 35 W peak headroom fits mainstream Copilot+ laptops.
Adreno X1-45 graphics at 280 MHz base and up to 1107 MHz boost with 1.7 TFLOPS cover office displays plus video. A 45 TOPS Hexagon NPU handles local AI while CPU stays free. LPDDR5X-8448 with 135 GB per s feeds all engines from up to 64 GB of shared memory.
Mainstream offices and schools that want Plus value with bursts fit here. The 3.4 GHz single-core lift over the 26-100 shortens app launches. Buyers who need 10 cores for heavier multitasking should look to higher Plus tiers instead, since this 42-100 prioritizes balanced 8-core throughput.
Socket and motherboard compatibility
The X1P-42-100 solders to Qualcomm BGA 2073 with soldered LPDDR5X. Makers cool the 30 W band with thin fans and 35 W peaks. No socket and no memory change exist.
Boards use LPDDR5X-8448 up to 64 GB with NVMe Gen4 and 12 Gen4 lanes on Plus layouts. Triple display support covers desks. Power modes shift between battery and performance.
Plus shoppers compare the two 8-core August parts on 0.2 GHz base and boost. The 42-100 leads the Qualcomm Snapdragon X1P-26-100 on bursts. The LGA, PGA and BGA: CPU package types explained guide explains soldered ARM.
Memory, PCIe and cooling
LPDDR5X-8448 with 135 GB per s shared by CPU, 1.7 TFLOPS GPU and 45 TOPS NPU is fixed at order time. Office plus AI loads fit comfortably. Soldered capacity cannot grow.
PCIe Gen4 with 12 lanes serves NVMe and wireless on Plus layouts. Fixed wiring means options vary.
Cooling is thin-body 30 W with 35 W peaks. No retail cooler ships with soldered parts.
Upgrade paths
No CPU or RAM upgrade exists. The Plus 8-core decision is base tier versus boost tier at order time. Storage is the only later change.
The next platform is Snapdragon X2 with newer cores. A working 42-100 lasts office years.
Frequently asked questions
What socket does the Snapdragon X1P-42-100 use?
It uses Qualcomm BGA 2073, soldered with 2,073 balls. The chip cannot be swapped.
How is the X1P-42-100 different from the 26-100?
Eight cores and 8 threads at 3.2 GHz with up to 3.4 GHz single-core boost, with 30 MB of total cache.
What memory does the X1P-42-100 support?
LPDDR5X-8448 with 135 GB per s shared, up to 64 GB.
Can the X1P-42-100 be upgraded?
No. CPU and RAM solder together. Only storage can change.
Sources and verification
- Snapdragon X Plus 8-core Product Brief X1P-42-100 8 cores 3.4GHz (Qualcomm)
- Snapdragon X Plus X1P-42-100 benchmarks 8 cores 30W (NanoReview)
Facts last checked against these sources on . Page last edited on .