Qualcomm Snapdragon X1P-26-100 socket: Qualcomm BGA 2073

The Qualcomm Snapdragon X1P-26-100 uses Qualcomm BGA 2073, soldered with 2,073 balls. It is an 8-core Snapdragon X Plus part running at 3.0 GHz, and the soldered chip cannot be replaced.

Launched
August 2024
Cores and threads
8 and 8
Base power
25 W
Codename
Oryon
Segment
Mobile (soldered)
Clocks
3.0 / 3.0 GHz

Qualcomm Snapdragon X1P-26-100 specifications

Cores8
Threads8 (one thread per core)
Core architectureQualcomm Oryon (Oryon v1), ARM64 compatible
Clocks3.0 GHz
Cache30 MB total, 6 MB L3
Processor base power (TDP)25 W
Manufacturing process4 nm (TSMC)
Memory supportLPDDR5X-8448, 135 GB/s shared
PCI ExpressPCIe Gen4
Integrated graphicsQualcomm Adreno X1-45, up to 1.7 TFLOPS
NPUQualcomm Hexagon, 45 TOPS
MultiplierLocked
PackageBGA2073 (soldered, 2073 balls)

Motherboard compatibility

Qualcomm Snapdragon X1P-26-100 needs a motherboard with a Qualcomm BGA 2073 socket. Chipset by chipset data for this codename is not recorded yet. See the Qualcomm BGA 2073 chipset list and the board maker's CPU support list.

Qualcomm BGA 2073 at a glance

TypeBGA, 2,073 contacts
Package sizen/a
IntroducedApril 2024
MemoryLPDDR5X-8448, 135 GB/s shared bandwidth, up to 64 GB
Cooler mounting holesNot applicable (soldered)

Read the full Qualcomm BGA 2073 socket guide

What the Snapdragon X1P-26-100 is

The Snapdragon X1P-26-100 is an 8-core and 8-thread laptop processor in the Snapdragon X Plus family for value Copilot+ laptops. Eight Oryon cores with one thread each give 8 threads at 3.0 GHz multi-core with single-core peaks to 2.976 GHz per Qualcomm footnotes. Cache totals 30 MB with 8 MB in cpu_list L3 readings. The 25 W class fits school laptops with long battery targets.

Adreno X1-45 graphics at up to 1.7 TFLOPS cover classroom displays plus video playback. A 45 TOPS Hexagon NPU brings Copilot+ AI to value tiers without discrete hardware. LPDDR5X-8448 with 135 GB per s feeds all engines from a shared soldered pool.

Value schools and home offices fit here. Eight cores at 3.0 GHz keep video calls plus browser tabs smooth at 25 W. Buyers who need 3.4 GHz bursts for snappier UI should take the Qualcomm Snapdragon X1P-42-100 with single-core boost instead, since this 26-100 prioritizes battery over peaks.

Socket and motherboard compatibility

The X1P-26-100 solders to Qualcomm BGA 2073 with soldered LPDDR5X. Makers cool the value 25 W band with thin fans. No socket and no memory change exist after sale.

Boards use LPDDR5X-8448 with NVMe Gen4 storage. Display output covers panels plus external UHD monitors. Power profiles favor silent battery operation.

Plus shoppers compare 8-core parts on clocks and GPU. The 26-100 trails boosted twins on bursts. The LGA, PGA and BGA: CPU package types explained guide covers soldered ARM.

Memory, PCIe and cooling

LPDDR5X-8448 with 135 GB per s shared by CPU, GPU and NPU is fixed at order time. Classroom loads fit comfortably. Soldered capacity cannot grow later.

PCIe Gen4 serves NVMe and wireless. Fixed wiring means options vary.

Cooling is thin-body value 25 W with quiet curves. No retail cooler ships with soldered parts.

Upgrade paths

No CPU or RAM upgrade exists. The Plus choice is base tier at order time. Storage is the only later change.

The next platform is Snapdragon X2 Plus with newer cores. A working 26-100 lasts school years.

Frequently asked questions

What socket does the Snapdragon X1P-26-100 use?

It uses Qualcomm BGA 2073, soldered with 2,073 balls. The chip cannot be swapped.

How fast is the Snapdragon X1P-26-100?

Eight cores and 8 threads at 3.0 GHz, with 30 MB of total cache.

What memory does the X1P-26-100 support?

LPDDR5X-8448 with 135 GB per s shared by CPU, GPU and NPU.

Can the X1P-26-100 be upgraded?

No. CPU and RAM solder together. Only storage can change.

Sources and verification

  1. Snapdragon X Elite ARM laptop processors specs X Plus table X1-26-100 (Qualcomm)
  2. Qualcomm Snapdragon X Elite and X Plus laptop chips explained table (CNET)

Facts last checked against these sources on . Page last edited on .