Intel Xeon Phi 7210 socket: LGA 3647

What the Xeon Phi 7210 is

The Xeon Phi 7210 brings Knights Landing to LGA 3647 for HPC racks with stacked memory. It launched on June 20, 2016 with 64 cores at 1.3 GHz base and up to 1.5 GHz boost at 215 W. Intel targets parallel codes that need many threads with high bandwidth memory on one chip.

Thirty two megabytes of L2 with 512 KB per core carry tiles without L3. Four threads per core give 256 threads for throughput. The mesh joins tiles, memory and I/O on die.

Sixteen gigabytes of on package MCDRAM deliver over 400 GB/s beside DDR4-2133 pools up to 384 GB. The process is 14 nm. The multiplier is locked. AVX-512 units speed vector loops where compilers use them.

Buyers choose the board at order time with memory size and cooling tier. The 215 W rating needs 2U airflow with redundant fans. MCDRAM runs as cache, flat NUMA or hybrid per job needs.

Socket and motherboard compatibility

The Xeon Phi 7210 fits LGA 3647 on KNL server boards with DDR4 slots. Makers list Knights Landing with 2016 BIOS builds. Early stock may need an update before posting.

Bootable host builds run Linux directly on the chip with no PCIe card needed. Coprocessor cards use different boards. The Socket vs chipset: what decides whether a CPU works guide covers board matching.

Single socket HPC nodes are the deployment. Growth means more LGA 3647 nodes rather than bigger chips. Power needs metered racks for 215 W per socket plus memory.

Memory, PCIe and cooling

DDR4-2133 in six channels up to 384 GB suits large jobs with ECC. Sixteen gigabytes of MCDRAM lift bandwidth bound loops. Start with flat mode tests to find the best setting per code.

PCIe 3.0 with up to 36 lanes from the CPU serves HBAs and NICs per board layout. Boards split lanes between risers and NVMe. Omni-Path options cut add in cards in fabric builds.

Cooling follows server practice with vendor heatsinks for 215 W classes. No cooler ships in the box. Keep aisles clear where racks run continuously. ECC guards DDR4 memory.

Upgrade paths

On the same socket, the Intel Xeon Phi 7230 shares 64 cores at the same clocks for bandwidth tuned racks. The Intel Xeon Phi 7250 moves to 68 cores for denser nodes. Both share LGA 3647 boards and MCDRAM.

The Intel Xeon Phi 7210F gives the same 64 cores at 230 W for fabric builds. It needs boards with matching support.

Past HPC nodes move to Xeon Scalable with AVX-512. The Phi 7210 covers 2016 clusters where 64 cores with stacked memory must deploy.