AMD EPYC 8324P socket: SP6
The AMD EPYC 8324P uses SP6, the 4844-contact LGA socket for EPYC 8004 server processors. The 32-core single socket chip at 180 W needs an SP6 board with DDR5 ECC memory.
AMD EPYC 8324P specifications
| Cores | 32 |
|---|---|
| Threads | 64 |
| Core architecture | Zen 4c (Siena) |
| Clocks | 2.65 GHz base, up to 3.0 GHz boost |
| Cache | 32 MB L2 plus 128 MB L3 |
| Default TDP | 180 W (155 to 225 W configurable) |
| Manufacturing process | TSMC 5 nm |
| Memory support | DDR5-4800 ECC, 6 channels, up to 1 TB |
| PCI Express | 96 PCIe Gen5 lanes, single socket, plus CXL |
| Integrated graphics | None (BMC graphics on board) |
| Multiplier | Locked |
| ECC memory | Supported, DDR5 ECC RDIMM |
| Package | SP6 LGA4844, 1P |
| Cooler in the box | None, server heatsink required |
Motherboard compatibility
AMD EPYC 8324P needs a motherboard with a SP6 socket. Chipset by chipset data for this codename is not recorded yet. See the SP6 chipset list and the board maker's CPU support list.
SP6 at a glance
| Type | LGA, 4,844 contacts |
|---|---|
| Package size | 58.5 × 75.4 mm |
| Introduced | September 2023 |
| Memory | DDR5 ECC, 6 channels (up to DDR5-4800 on Siena, DDR5-6400 on Sorano) |
| Cooler mounting holes | Board specific (server heatsink) |
What the EPYC 8324P is
The EPYC 8324P is the 32-core single socket Siena server part for SP6 in September 2023. Thirty-two Zen 4c small cores with multithreading run at 2.65 GHz base and up to 3.0 GHz boost with matching all-core boost, backed by 32 MB of L2 and 128 MB of L3. The TSMC 5 nm package targets 180 W inside a 155 to 225 W window for efficient data-centre and edge racks. It leads Siena density below 64-core parts with balanced clocks.
Efficient threads with server IO suit cloud edge, storage and virtual desktops that need many vCPUs without Genoa power. Thirty-two cores share 128 MB of L3 for locality, while 6 DDR5-4800 ECC channels feed data at lower board cost than 12-channel platforms. Ninety-six Gen5 lanes serve networking and NVMe for single-socket nodes. Power stays well below 360 W flagships for dense racks.
Buyers compare the 8324P against Xeon Gold density parts where performance per watt decides. Siena wins single-socket efficiency with 6 channels, while Genoa wins where 12 channels matter. Boards built for SP6 accept the full Siena stack with a BIOS update. The Socket vs chipset: what decides whether a CPU works guide is secondary to SP6 board lists.
Socket and motherboard compatibility
The 8324P fits SP6 on single socket server boards with LGA 4844 frames. Siena is 1P-only, so dual socket pairing is not supported. Board lists must name Siena 8004 for Zen 4c support. Power delivery for 180 W continuous with wide cTDP suits 1U and short-depth chassis.
SP6 boards wire 6 DDR5 channels with one DIMM per channel for best speed in many layouts. BMC firmware covers fleet management. Confirm heatsink height and airflow for dense 32-core nodes.
Memory, PCIe and cooling
DDR5-4800 ECC RDIMM in 6 channels feeds 32 small cores for edge clouds. Capacity scales with large DIMMs for storage nodes. ECC stays enabled for uptime. Validated kits at rated speed are required.
PCIe Gen5 gives 96 lanes in single socket plus CXL for networking and NVMe. A 32-core node typically wires 25 GbE or faster NICs plus NVMe arrays. Cooling needs an SP6 server sink for 180 W with front-to-back flow. Lower cTDP trims clocks for hot aisles.
Upgrade paths
On single socket SP6 the upward moves are higher-core Siena parts where vCPU counts grow, without adding sockets. Memory growth to 6 channels and networking additions often help more than cores. The 32-core point already balances threads and power for branch clouds.
Outside Siena, Genoa on SP5 adds channels and sockets for larger fabrics. Most 8324P owners expand memory and IO on SP6 first, since 32 efficient cores already cover dense edge hosts.
Frequently asked questions
What socket does the EPYC 8324P use?
SP6 (LGA 4844) on single socket server boards. Siena does not support dual socket.
How many cores does the 8324P have?
32 cores and 64 threads at 2.65 GHz base and up to 3.0 GHz boost, with 32 MB L2 and 128 MB L3 and a 180 W TDP.
What memory does the 8324P need?
DDR5-4800 ECC RDIMM in 6 channels.
What is the TDP range of the 8324P?
180 W default inside a 155 to 225 W configurable window for dense racks.
Sources and verification
Facts last checked against these sources on . Page last edited on .