BGA 956 socket: CPUs, chipsets and cooler fit
BGA 956, printed micro-FCBGA, is the Intel soldered ball grid array package for Penryn era mobile processors. It carries 956 contacts for BGA processors that cannot be swapped. Family tables list the Core 2 Solo SU3500 on micro-FCBGA 956 with 3 MB of cache at 5.5 W.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 956 |
| Package size | n/a |
| Introduced | June 2009 |
| Status | Legacy |
| Memory | DDR2 or DDR3, two channels, depending on the chipset |
| PCIe from the CPU | Front side bus 800 MT/s to the chipset; PCIe from the mobile chipset |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | None |
| Replaced by | None |
Overview
The socket matters for this batch because the Pentium SU2700 and SU4100 plus the Core 2 Solo SU3500 are BGA 956 parts at 10 W and 5.5 W, joined by the Merom-L Core 2 Solo U2200 at 1.2 GHz with 1 MB of cache at 5 W. All use a front side bus to mobile chipsets with DDR2 or DDR3 slots. Soldered boards pair them with vendor heat spreaders in thin chassis.
Socketed Penryn parts with the same silicon live on Socket P instead for notebooks with replaceable CPUs.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Penryn | Pentium SU mobile | 2009 | 45 nm mobile parts including the single core SU2700 and dual core SU4100 at 1.3 GHz and 10 W from 2009. |
| Penryn-L | Core 2 Solo mobile | 2009 | 45 nm single core parts with 3 MB of L2 cache, including the 1.4 GHz SU3500 at 5.5 W. |
| Merom-L | Core 2 Solo ULV Merom-L | 2007 | 65 nm single core parts with 1 MB of L2 cache in soldered BGA packages, including the 1.2 GHz U2200 at 5 W from September 2007. |
A soldered package for thin notebooks
BGA 956 follows the same rule as every BGA package on this site: the processor is soldered once at the factory and stays with the board for life. A thin notebook designer qualifies one SKU for the whole production run. Intel marks the SU parts as mobile with tray supply.
The package choice suits thin chassis where a socket lever cannot fit. Compatibility depends on firmware, so a board revision needs a BIOS that knows the exact sSpec stepping.
Memory and expansion
Memory on BGA 956 depends on the chipset generation, with DDR2 on early boards and DDR3 on GS45 class boards in two channels. The board fixes the slots, so check the vendor list.
Expansion comes from the mobile chipset because Penryn CPUs provide no PCIe lanes. The 800 MT/s front side bus carries CPU traffic. Cooling uses vendor heat spreaders drawn for 5.5 W to 10 W.
CPUs on BGA 956
5 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Pentium SU4100 | 2 / 2 | 1.3 GHz | 10 W | Sep 2009 |
| Intel Pentium SU2700 | 1 / 1 | 1.3 GHz | 10 W | Jun 2009 |
| Intel Core 2 Solo ULV SU3300 | 1 / 1 | 1.2 GHz | 5.5 W | May 2009 |
| Intel Core 2 Solo ULV SU3500 | 1 / 1 | 1.4 GHz | 5.5 W | 2009 |
| Intel Core 2 Solo ULV U2200 | 1 / 1 | 1.2 GHz | 5 W | Sep 2007 |
Frequently asked questions
Can a BGA 956 processor be replaced or upgraded?
No. The processor is soldered to the board in the 956-ball micro-FCBGA package. Upgrading means replacing the board or module.
Which processors fit BGA 956?
Penryn mobile parts such as the single core Pentium SU2700 and dual core SU4100 at 10 W, Penryn-L Core 2 Solo parts such as the SU3500 at 5.5 W, plus the Merom-L Core 2 Solo U2200 at 1.2 GHz with 1 MB of cache at 5 W.
What memory does BGA 956 use?
DDR2 or DDR3 in two channels depending on the chipset, commonly DDR3-800 class SO-DIMMs on GS45 boards.
How many PCIe lanes does BGA 956 provide?
No lanes come from these CPUs. The front side bus at 800 MT/s links the CPU to the mobile chipset, while PCIe slots hang off the chipset.
Sources and verification
Facts last checked against these sources on . Page last edited on .