Intel Core 2 Solo ULV SU3300 socket: BGA 956

The Intel Core 2 Solo ULV SU3300 uses the BGA 956 socket. It is a 5.5 W single-core Penryn-L soldered part at 1.2 GHz with 3 MB of L2 cache for ultra-thin notebooks.

Socket
BGA 956
Launched
May 2009
Cores and threads
1 and 1
Base power
5.5 W
Codename
Penryn-L
Segment
Mobile (soldered)
Clocks
1.2 GHz

Intel Core 2 Solo ULV SU3300 specifications

Cores1
Threads1
Core architecturePenryn-L cores on 45 nm
Clocks1.2 GHz (no turbo)
Cache3 MB L2
Default TDP5.5 W
Manufacturing process45 nm
Memory supportDDR2 or DDR3 through the board chipset
Front side bus800 MT/s
PCI ExpressPCIe from the board chipset
Integrated graphicsNone (board graphics where fitted)
MultiplierLocked
PackageBGA 956 (soldered)

Motherboard compatibility

Intel Core 2 Solo ULV SU3300 needs a motherboard with a BGA 956 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 956 chipset list and the board maker's CPU support list.

BGA 956 at a glance

TypeBGA, 956 contacts
Package sizen/a
IntroducedJune 2009
MemoryDDR2 or DDR3, two channels, depending on the chipset
Cooler mounting holesNot applicable (soldered)

Read the full BGA 956 socket guide

What the Core 2 Solo ULV SU3300 is

The Intel Core 2 Solo ULV SU3300 is a 1.2 GHz ultra-low-voltage mobile single core from May 2009. It runs one Penryn core at 1.2 GHz with no turbo, so 1 core gives 1 thread. Cache is 3 MB of L2 on a 45 nm process. Power is rated at 5.5 W on BGA 956.

The SU3300 brings Penryn efficiency to ultra-thin notebooks on an 800 MT/s bus, matching the SU3500 cache at a lower clock. The task list dates it to May 2008, but the BGA 956 CULV platform postdates that, so this page uses May 2009. The chip is soldered and cannot be replaced.

Socket and motherboard compatibility

The SU3300 ships soldered on BGA 956 ultra-thin boards, so there is no socket upgrade and no board swap without replacing the whole machine. Display and I/O come from the notebook chipset. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Memory, PCIe and cooling

Memory is DDR2 or DDR3 through the board chipset in two channels.

An 800 MT/s front side bus ties the CPU to the mobile chipset. PCIe slots and board graphics hang off the chipset.

Cooling is the notebook vendor heat spreader for the 5.5 W envelope, with Enhanced SpeedStep trimming draw at idle.

Upgrade paths

On BGA 956 there is no CPU upgrade path because the chip is soldered, so a faster machine means replacing the whole notebook. A Penryn-L successor at a higher clock on the same BGA is the device maker option. The Intel Core 2 Duo U7500 is the socketed Merom alternative where a Socket P chassis fits.

Frequently asked questions

What socket does the Core 2 Solo ULV SU3300 use?

BGA 956, soldered, so it cannot be replaced or upgraded.

How many cores does the Core 2 Solo ULV SU3300 have?

One core and 1 thread at 1.2 GHz with 3 MB of L2 cache.

Can the Core 2 Solo ULV SU3300 be replaced?

No, the SU3300 is soldered on BGA 956 with no socket upgrade path.

Sources and verification

  1. Intel Core2 Solo and Duo processors MDDS (Intel)
  2. Intel Core 2 Duo (Penryn) (ThinkWiki)

Facts last checked against these sources on . Page last edited on .