Intel Xeon W-1370P socket: LGA 1200
The Intel Xeon W-1370P uses the LGA 1200 socket. It is a 125 W 8-core Rocket Lake workstation processor with P750 graphics and ECC memory support.
- Socket
- LGA 1200
- Launched
- May 2021
- Cores and threads
- 8 and 16
- Base power
- 125 W
- Codename
- Rocket Lake
- Segment
- Workstation
- Family
- Intel Xeon W
- Clocks
- 3.6 / 5.2 GHz
Intel Xeon W-1370P specifications
| Cores | 8 |
|---|---|
| Threads | 16 |
| Core architecture | Cypress Cove (Rocket Lake) |
| Clocks | 3.6 GHz base, up to 5.2 GHz turbo |
| Cache | 16 MB Intel Smart Cache (L3) |
| Processor base power (TDP) | 125 W |
| Manufacturing process | 14 nm |
| Memory support | DDR4 up to 3200 MT/s ECC, two channels, up to 128 GB |
| PCI Express | 20 lanes from the CPU: PCIe 4.0 x16 plus PCIe 4.0 x4 |
| Integrated graphics | Intel UHD Graphics P750 (32 execution units, up to 1.30 GHz) |
| Multiplier | Locked |
| ECC memory | Yes |
| Package | FCLGA1200 |
Motherboard and chipset compatibility
Intel Xeon W-1370P needs a motherboard with a LGA 1200 socket. The table shows which chipset series accept it.
| Series | Chipsets | Support |
|---|---|---|
| 500 series | Z590, H570, B560, H510, Q570, W580 | Works out of the box |
| 400 series: Z490, H470, Q470, W480 | Z490, H470, Q470, W480 | Needs a BIOS update Needs a BIOS update from the board maker. PCIe 4.0 depends on how the board is wired. |
| 400 series: B460, H410 | B460, H410 | Not supported |
Board makers publish a CPU support list for every model. Check it for your exact board before buying. Chipset details for LGA 1200.
LGA 1200 at a glance
| Type | LGA, 1,200 contacts |
|---|---|
| Package size | 37.5 × 37.5 mm |
| Introduced | April 2020 |
| Memory | DDR4 only |
| Cooler mounting holes | 75 × 75 mm |
What the Xeon W-1370P is
The Xeon W-1370P is an 8-core workstation processor that Intel released in May 2021 with the high power Xeon W-1300 range. Its Cypress Cove cores run 3.6 GHz base to 5.2 GHz turbo with Hyper-Threading for 16 threads. Cache is 16 MB of Intel Smart Cache.
The P suffix marks high performance with a 125 W envelope for sustained speed with 8 cores. The high 3.6 GHz base keeps all core work fast for renders that run for hours. The 14 nm process needs strong cooling and power stages for this top bin.
Intel UHD Graphics P750 handle display output, with 32 execution units at 350 MHz base and up to 1.30 GHz boost. ECC memory support guards models in long sessions. The socket package is FCLGA1200 at 37.5 × 37.5 mm.
Socket and motherboard compatibility
The W-1370P fits the LGA 1200 socket. Workstation boards with W580 chipsets accept it with the shipping BIOS, and C252 or C256 server boards also cover it when power stages allow 125 W. The board maker CPU support list for the W-1300 range names the minimum BIOS for this P model.
A buyer who needs error correction should choose a W580, C252 or C256 board with ECC UDIMM support and 125 W power rating. Boards built for 80 W W models may need stronger cooling and power before this chip holds full turbo. Single socket operation is the only option.
Boxed product includes a thermal solution rated for the higher power, while tray product needs a separate tower cooler for 125 W.
Memory, PCIe and cooling
The memory controller supports DDR4 up to 3200 MT/s in two channels, up to 128 GB, with ECC support. Render stations often use 2 by 32 GB ECC UDIMM for large scenes with integrity. The controller does not accept DDR5.
The CPU supplies 20 PCIe 4.0 lanes: x16 plus x4 from the processor. Workstations use the lanes for professional graphics and fast SSD storage. The board specifications state which slots reach full speed.
At 125 W, a large tower workstation cooler with strong directed airflow is needed. Mounting uses the 75 mm LGA 1200 pattern from the CPU cooler compatibility by socket guide. P750 graphics remove the need for a setup card in most chassis.
Upgrade paths
Against the Intel Core i7-11700, the W-1370P adds sustained clocks, ECC and workstation chipsets. The desktop i7 part suits creation towers at lower power, while this workstation part suits render seats with error correction. Both share the same socket but target different boards.
Moving to a newer workstation platform needs a new board and memory generation. The W-1370P fits a render station, a simulation host, or a lab controller with heavy threads.
For used buyers, the P model makes sense when the board can cool 125 W and the workload runs all cores. When power is limited, the 80 W W-1370 gives similar threads with less heat on the same board.
Frequently asked questions
What socket does the Intel Xeon W-1370P use?
It uses LGA 1200, written FCLGA1200 in Intel documents, on W580, C252 or C256 workstation boards rated for 125 W.
How many cores does the Intel Xeon W-1370P have?
8 cores with 16 threads, 3.6 GHz base and up to 5.2 GHz turbo, with 16 MB of Intel Smart Cache.
What memory does the Intel Xeon W-1370P support?
DDR4 up to 3200 MT/s with ECC in two channels, up to 128 GB. ECC guards models in workstation use.
What graphics does the Intel Xeon W-1370P include?
Intel UHD Graphics P750 with 32 execution units up to 1.30 GHz for setup and light CAD use.
What is the TDP of the Intel Xeon W-1370P?
125 W. A large tower workstation cooler with strong directed airflow is needed.
Sources and verification
- List of Intel Xeon processors Rocket Lake-based (W-1300 P models, 125 W)
- Intel Xeon W-1370 Specs (TechPowerUp, same W-1300 family PCIe and ECC data)
Facts last checked against these sources on . Page last edited on .