Intel Xeon MP 3.0 socket: Socket 604

What the Xeon MP 3.0 is

The Intel Xeon MP 3.0 is a 3 GHz single-core server processor with Hyper-Threading from March 2004. It runs one NetBurst Gallatin core at 3 GHz with no turbo, so 1 core gives 2 threads. Cache is 512 KB of L2 plus 4 MB of L3 on a 130 nm process. Power is rated at 85 W in a Socket 604 package with part numbers RN80532KC0804M. The table lists the part on Socket 603 with 400 MT/s operation, while the cpu_list gives Socket 604, and the page uses Socket 604 since 604 boards accept the 603 package with a compatible BIOS.

The MP 3.0 tops the Gallatin Xeon MP line with a 400 MT/s front side bus and a 30x multiplier at 1.50 V. Intel sold it at 3692 dollars in March 2004 for four- and eight-processor servers. The 4 MB L3 quadruples the 1 MB on Gallatin DP parts, which keeps large database working sets on die. The chip supports MMX, SSE, SSE2 and Hyper-Threading with a 226 square mm die.

Large L3 cache with multi-processor scale defines the use case. Four MP 3.0 parts give eight threads with 16 MB of total L3 per chassis, which suited backend databases that scaled with socket count and cache together. That is why MP parts cost far more than DP parts at the same clocks.

Socket and motherboard compatibility

The Xeon MP 3.0 fits Socket 604 multi-processor server boards with DDR memory, a 400 MT/s bus and Gallatin MP BIOS support. It needs a four- or eight-socket board with MP power delivery. The Socket vs chipset: what decides whether a CPU works guide covers pairing rules.

Large Intel E7500 chipset servers are the natural match. Boards listing Gallatin MP parts accept the 3.0 with matched 85 W cooling per socket. Dual-processor Xeon DP boards need DP Gallatin parts instead, even though clocks match.

Memory, PCIe and cooling

Memory is DDR through the server chipset, with registered ECC modules per board. The CPU has no memory controller, so the chipset sets speed and capacity.

A 400 MT/s front side bus ties the CPUs to the chipset in a shared bus layout, while PCI-X slots hang off the chipset for RAID and LAN. No PCIe lanes originate on the die. Cooling uses vendor qualified 85 W server heatsinks per socket with strong chassis airflow. All sockets need equal service for stable multi-processor operation.

Upgrade paths

On Socket 604 the Gallatin MP line tops at 3.0 GHz with 4 MB, so same generation upgrades stop here. Potomac MP parts with 8 MB of L3 offer a 90 nm successor where listed. Cranford MP parts offer 1 MB without L3 as a lower cost path. Beyond Socket 604 a move to LGA 771 needs new boards. The MP 3.0 lifts with the lever, so swaps need no solder work.