Intel Celeron 807 socket: BGA 1023

The Intel Celeron 807 uses the BGA 1023 package. It is a soldered 17 W Sandy Bridge part with Hyper-Threading and cannot be replaced.

Socket
BGA 1023
Launched
July 2012
Cores and threads
1 and 2
Base power
17 W
Codename
Sandy Bridge
Segment
Mobile (soldered)
Clocks
1.5 GHz

Intel Celeron 807 specifications

Cores1
Threads2
Core architectureSandy Bridge cores on 32 nm
Clocks1.5 GHz (no turbo)
Cache1.5 MB Intel Smart Cache (L3)
Processor base power (TDP)17 W
Manufacturing process32 nm
Memory supportDDR3-1066 and 1333, two channels, up to 16 GB
PCI ExpressPCIe lanes from the CPU (layout varies by board design)
Integrated graphicsIntel HD Graphics (350 MHz to 950 MHz)
MultiplierLocked
PackageBGA 1023 (FCBGA, 1023 balls, 31 × 24 mm, soldered)

Motherboard compatibility

Intel Celeron 807 needs a motherboard with a BGA 1023 socket. Chipset by chipset data for this codename is not recorded yet. See the BGA 1023 chipset list and the board maker's CPU support list.

BGA 1023 at a glance

TypeBGA, 1,023 contacts
Package size31 × 24 mm
IntroducedJanuary 2011
MemoryDDR3 and DDR3L, two channels, 1066 to 1600 MT/s
Cooler mounting holesNot applicable (soldered)

Read the full BGA 1023 socket guide

What the Celeron 807 is

Intel Celeron 807 is a single core Sandy Bridge mobile processor that Intel released in July 2012 for thin soldered laptops. It runs at a fixed 1.5 GHz with no turbo, and Hyper-Threading turns the single core into 2 threads. Cache is 1.5 MB Intel Smart Cache. Power is rated at 17 W on a 32 nm process. Notebookcheck, Chipswiki and the retired ARK entry confirm Hyper-Threading, while TechPowerUp lists a single thread.

Graphics are Intel HD Graphics for Sandy Bridge at 350 MHz to 950 MHz. The block covers thin laptop displays without a card. The controller takes DDR3 at 1066 or 1333 MT/s.

The second thread helps light multitasking over the 797, though both stay single core designs. Thin bodies pair it with HM76 class boards and small SSDs. The How to find your CPU socket type guide shows how to confirm the soldered package.

Socket and motherboard compatibility

The Celeron 807 solders to BGA 1023 with 1,023 balls in a 31 by 24 mm footprint and cannot be moved. Thin makers qualify each model with a fixed board and BIOS, so another BGA part is not a field swap.

The BIOS must list the exact Celeron 807 string. Power is light, so the board search is about screen, ports and battery. The CPU cooler compatibility by socket guide notes soldered cooling stays board specific.

Memory, PCIe and cooling

Memory support is DDR3-1066 and 1333, two channels, up to 16 GB. Soldered RAM options lock size at purchase. Two channels help shared graphics.

PCI Express lanes come from the CPU for Wi-Fi and storage. No graphics upgrade exists at this power.

Cooling is a slim 17 W spreader and fan. Fixed clocks need little airflow, but cleaning keeps fan noise down.

Upgrade paths

There is no CPU upgrade path on soldered BGA 1023. The Celeron 807 cannot be removed, so a faster thin laptop means a new board or a new device. A soldered dual on the same package is Intel Celeron 877, but boards rarely cross models.

A platform move means a new thin laptop on a current BGA package. Keep the old body for basic tasks after a wipe.

Frequently asked questions

What socket does the Intel Celeron 807 use?

It uses BGA 1023, a soldered package. The chip cannot be removed.

Does the Celeron 807 have Hyper-Threading?

Yes. One core gives 2 threads at 1.5 GHz per Notebookcheck, Chipswiki and ARK.

What memory does the Celeron 807 use?

DDR3-1066 and 1333, two channels, up to 16 GB.

Can the Celeron 807 be upgraded?

No. Soldered BGA parts need a board or laptop replacement for more speed.

Sources and verification

  1. Intel Celeron 807 Specs (TechPowerUp)
  2. Intel Celeron 807 Notebook Processor (Notebookcheck)

Facts last checked against these sources on . Page last edited on .