AMD Ryzen AI 7 PRO 450 socket: FP8
The AMD Ryzen AI 7 PRO 450 uses the FP8 package, soldered in a 25 × 40 mm grid array. It is the 8-core Gorgon Point business laptop APU with Radeon 860M graphics.
- Socket
- FP8
- Launched
- January 2026
- Cores and threads
- 8 and 16
- Default TDP
- 28 W
- Codename
- Gorgon Point
- Segment
- Mobile (soldered)
- Family
- AMD Ryzen AI 7 PRO
- Clocks
- n/a
AMD Ryzen AI 7 PRO 450 specifications
| Cores | 8 (4 Zen 5 and 4 Zen 5c) |
|---|---|
| Threads | 16 |
| Core architecture | Zen 5 and Zen 5c, monolithic Gorgon Point die |
| Clocks | Up to 5.1 GHz maximum boost frequency |
| Cache | 16 MB L3 and 8 MB L2 (24 MB total) |
| Default TDP | 28 W |
| Configurable TDP | 15 to 54 W |
| Manufacturing process | TSMC 4 nm |
| Memory support | DDR5 or soldered LPDDR5X up to 8533 MT/s (at least 16 GB for Copilot+) |
| PCI Express | PCIe Gen4 lanes from the APU for NVMe storage |
| Integrated graphics | Radeon 860M, 8 compute units |
| NPU | XDNA 2, up to 50 TOPS |
| Multiplier | Locked |
| Package | FP8 (BGA, 25 × 40 mm, soldered) |
| Cooler in the box | None (laptop thermal solution by the OEM) |
Motherboard compatibility
AMD Ryzen AI 7 PRO 450 needs a motherboard with a FP8 socket. Chipset by chipset data for this codename is not recorded yet. See the FP8 chipset list and the board maker's CPU support list.
FP8 at a glance
| Type | BGA, 1,140 contacts |
|---|---|
| Package size | 25 × 40 mm |
| Introduced | 2023 |
| Memory | DDR5 SODIMM or soldered LPDDR5X depending on board design, up to LPDDR5X-8533 on Gorgon Point, dual channel with ECC and Link-ECC options on embedded P100 boards |
| Cooler mounting holes | Not applicable (soldered) |
What the Ryzen AI 7 PRO 450 is
The Ryzen AI 7 PRO 450 is the 8-core business APU of the Gorgon Point mobile range, announced at CES in January 2026. Four Zen 5 cores plus four Zen 5c cores give 16 threads with boost to 5.1 GHz, cache is 8 MB of L2 with 16 MB of L3, and graphics are 8 RDNA 3.5 compute units as Radeon 860M. The XDNA 2 NPU offers up to 50 TOPS. Default TDP is 28 W in the 15 to 54 W range on TSMC 4 nm.
The 8-core point is the mainstream business choice: enough threads for office multitasking with real graphics for presentations, video calls and light creation, in thin chassis that cannot cool the bigger SKUs. Against the 10-core PRO 465 it gives up two cores and four graphics units for lower cost and thermals. Gorgon Point silicon refreshes Strix Point with higher clocks and native LPDDR5X-8533.
PRO qualification brings fleet manageability and business availability to the consumer 450 class formula. Copilot+ certification follows from the NPU with sufficient memory. Gorgon Point reuses Strix Point silicon with higher clocks, faster power management and native LPDDR5X-8533 support, and board designs carry over with new firmware, which is why business models shipped early in 2026.
Socket and system compatibility
The chip solders into FP8, the 25 × 40 mm BGA common to recent AMD mobile generations. Buyers choose a complete laptop with fixed processor, memory and cooling, and service means board replacement. Gorgon Point reuses Strix Point board designs with updated firmware, so business models shipped early in 2026.
The 10-core AMD Ryzen AI 9 PRO 465 steps up inside the PRO range, and the 12-core HX PRO flagships top it. Desktop efficiency parts with related silicon use AM5.
Memory, PCIe and cooling
Systems take DDR5 SODIMM or soldered LPDDR5X to 8533 MT/s, with 16 GB or more for Copilot+ features. Eight graphics compute units drive everyday displays and accelerate video effects without a discrete card, and soldered sizes freeze at purchase.
PCIe Gen4 lanes handle NVMe storage with USB4 and current outputs beside them. Business thin designs rarely include discrete graphics, trading peak 3D for battery life.
Cooling spans 15 to 54 W around the 28 W default, tuned for thin quiet operation. Boost behavior tracks power and temperature on each machine.
Platform and positioning
AMD aims the 8-core PRO at mainstream business fleets where cost, battery and manageability decide. The PRO 450 shares its die with the consumer Ryzen AI 7 450, so reviews of consumer Gorgon Point laptops describe the same performance per watt that business buyers get with fleet features added. The 50 TOPS NPU covers on-device AI assistance in productivity suites, and eight full featured threads handle office multitasking with headroom. Compare laptops on panel, keyboard, battery and service options, which matter more day to day than the APU badge.
Upgrade paths
Soldered laptop silicon cannot be upgraded, so buyers pick between PRO core counts at purchase and judge used machines on battery, memory and panel. The consumer Ryzen AI 7 450 shares the die and speeds, so the used market for either badge behaves the same. Desktop Gorgon efficiency parts sit on AM5.
Frequently asked questions
What socket does the Ryzen AI 7 PRO 450 use?
It uses FP8, a 25 × 40 mm grid array. The chip is soldered and laptop upgrades mean replacing the system.
How are the 8 cores of the PRO 450 arranged?
Four full-size Zen 5 cores and four compact Zen 5c cores, sharing 16 MB of L3, for 16 threads in total.
What memory does the PRO 450 use?
DDR5 SODIMM or soldered LPDDR5X to 8533 MT/s, with at least 16 GB for Copilot+ certification.
Does the PRO 450 include an NPU?
Yes, an XDNA 2 NPU with up to 50 TOPS for local AI features in business applications.
Sources and verification
- AMD Announces Ryzen AI 400 Series Gorgon Point Mobile Processors (TechPowerUp)
- AMD Ryzen AI 400 series includes the first Copilot desktop CPU (Tom's Hardware)
Facts last checked against these sources on . Page last edited on .