AMD Ryzen 3 3300U socket: FP5

The AMD Ryzen 3 3300U uses the FP5 package, a soldered grid array with 1140 balls. It is a 4-core Picasso laptop chip at 15 W that cannot be replaced.

Socket
FP5
Launched
January 2019
Cores and threads
4 and 4
Default TDP
15 W
Codename
Picasso
Segment
Mobile (soldered)
Clocks
2.1 / 3.5 GHz

AMD Ryzen 3 3300U specifications

Cores4
Threads4
Core architectureZen+ on 12 nm
Clocks2.1 GHz base, up to 3.5 GHz boost
Cache4 MB L3
Default TDP15 W
Manufacturing process12 nm
Memory supportDDR4 up to 2400 MT/s, two channels
PCI ExpressPCIe 3.0 from the CPU
Integrated graphicsRadeon Vega 6 (up to 1200 MHz)
MultiplierLocked
PackageFP5 soldered, 1140 balls
Cooler in the boxNone (laptop cooling)

Motherboard compatibility

AMD Ryzen 3 3300U needs a motherboard with a FP5 socket. Chipset by chipset data for this codename is not recorded yet. See the FP5 chipset list and the board maker's CPU support list.

FP5 at a glance

TypeBGA, 1,140 contacts
Package size35 × 25 mm
IntroducedJanuary 2018
MemoryDDR4 up to 2400 MT/s, two channels
Cooler mounting holesNot applicable (soldered)

Read the full FP5 socket guide

What the Ryzen 3 3300U is

The Ryzen 3 3300U is a four core, four thread mobile processor from the Picasso family. It launched in January 2019 for budget thin laptops with a 2.1 GHz base and up to 3.5 GHz boost at 15 W. There is no multithreading, so each core handles one thread.

Four megabytes of L3 back office work and browsing across four cores. The 15 W envelope with 12 W down tuning suits fanless leaning bodies and long battery days. Compared with dual core laptop chips, four real cores keep video calls smooth beside documents.

Radeon Vega 6 graphics with up to 1200 MHz cover the laptop display and 4K video. Light esports play works at reduced settings with dual channel memory. The chip fits students who need all day battery over workstation speed.

Socket and motherboard compatibility

The 3300U solders to FP5 with 1140 balls permanently. Laptop boards define memory size, display outputs and battery for the life of the machine. There is no socketed path or board interchange.

Makers pair the chip with single fan cooling for 15 W sustained. Memory is SODIMM slots on serviceable bodies or soldered LPDDR on thinner ones. The How to find your CPU socket type guide shows where maker specs confirm the soldered package.

Desktop AM4 boards cannot host the mobile package despite shared Picasso naming. Power limits and ball maps differ.

Memory, PCIe and cooling

DDR4-2400 in two channels is the laptop standard for this generation. Two matched sticks feed Vega 6 graphics best. Soldered variants fix 4 or 8 GB at order time.

PCIe 3.0 lanes from the APU wire NVMe storage and board devices. A 256 GB NVMe SSD is the typical 3300U pairing. Chipset style board logic adds USB and networking.

Cooling is a single heat pipe and fan for 15 W, silent at idle. The 12 W down mode stretches battery in lectures. No retail cooler pattern exists for soldered mobile.

Upgrade paths

Soldered packaging leaves no processor path. Memory to 16 GB and a larger NVMe SSD extend student use. Battery service restores travel time.

A laptop change to the Ryzen 5 3500U adds threads on the same FP5 family for heavier multitasking. Newer platforms bring more cores per watt for the next refresh cycle.

Frequently asked questions

What socket does the AMD Ryzen 3 3300U use?

It uses the FP5 soldered package with 1140 balls.

Can the 3300U be upgraded?

No. The soldered chip cannot be replaced, so board replacement is the only path.

Does the 3300U have multithreading?

No. Four cores provide four threads.

What graphics are in the 3300U?

Radeon Vega 6 graphics up to 1200 MHz for display and light play.

When did the 3300U launch?

January 2019 with the Picasso mobile family.

Sources and verification

  1. AMD Ryzen 3 3300U benchmarks and specs (CPU-Monkey)
  2. AMD Ryzen PRO mobile processor specs (Redington, same clocks)

Facts last checked against these sources on . Page last edited on .