FT6 socket: CPUs, chipsets and cooler fit
FT6 is AMDs ball grid array package for Mendocino entry laptop APUs from the Ryzen 7020 series in 2022 through the Ryzen 10 and Athlon 10 refresh in October 2025. It is a soldered BGA on the Sonoma Valley platform that has carried 2-core Athlon parts and 4-core Ryzen parts with the same 100 sq mm die. Against the larger FP8 package used for Phoenix and Hawk Point performance designs, FT6 is the smaller entry option with LPDDR5 only and 4 PCIe Gen3 lanes.
Quick facts
| Maker | AMD |
|---|---|
| Package type | BGA |
| Contacts | 1,140 |
| Package size | n/a |
| Introduced | September 2022 |
| Status | Previous generation |
| Memory | Soldered LPDDR5-5500, two channels, up to 16 GB |
| PCIe from the CPU | 4 PCIe Gen3 lanes from the APU for NVMe storage and expansion, plus USB and integrated display outputs |
| Cooler mounting holes | Not applicable (soldered) |
| Replaces | FP6 |
| Replaced by | None |
Overview
Boards pair FT6 with soldered LPDDR5-5500 in two channels up to 16 GB. The ceiling never rose across the generation, from the Ryzen 5 7520U in 2022 to the Ryzen 5 40 in 2025, so memory choice is fixed at 5500 MT per s. The APU provides 4 PCIe Gen3 lanes for NVMe storage and radios, plus USB-C with DisplayPort alternate mode, HDMI 2.1 and 4-display support through the board wiring.
Like every mobile BGA package, FT6 trades replacement for integration. The chip cannot be swapped, cooling is part of the board design at 15 W, and laptop makers tune fan tables for that band. When a design needs more cores, more graphics or wider memory than FT6 allows, the larger FP8 package carries the higher tier silicon instead.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Mendocino | Ryzen 7020 series and Ryzen 10 series | 2022 to 2025 | Zen 2 with RDNA 2 graphics on TSMC 6 nm for entry laptops, launched in September 2022 and refreshed as Ryzen 10 and Athlon 10 in October 2025. |
A soldered entry package
FT6 follows the same rule as every BGA package on this site: the processor is soldered once at the factory and stays with the board for life. There are no pins to bend and no lever to lift, but there is also no upgrade path. A laptop buyer lives with the chosen SKU, and the 16 GB memory ceiling is permanent. AMD lists the October 2025 Ryzen 10 and Athlon 10 parts with the same FT6 socket as the 2022 Ryzen 7020 parts, which confirms the package carried the refresh without a board change.
The package choice shapes the board. FT6 needs soldered LPDDR5 layout with short traces for battery life, and 5500 MT per s is already fast enough to ask for careful routing. The 15 W thermal design suits thin bodies with a single fan, and passive designs need added engineering. Compatibility across Mendocino generations still depends on firmware, so an older board needs a BIOS that knows the newer SKU.
Memory, expansion and cooling
Memory on FT6 is a fixed answer. Soldered LPDDR5-5500 in two channels up to 16 GB is the only option, and capacity joins the SKU as a permanent choice. Buyers who keep many browser tabs and office apps open should take 16 GB at order time, since nothing can be added later. Display and wireless attach through the board, with DisplayPort 1.4, HDMI 2.1 and USB-C alternate mode on all four SKUs in this batch.
Expansion comes from 4 PCIe Gen3 lanes, plus USB 3.2 Gen2 and Gen1 ports and USB 2.0 ports. The lanes usually serve one NVMe drive and the wireless card, with the exact split fixed per board. Boards that need more than the APU offers cannot add a chipset in the desktop sense, so I/O stays at the Mendocino baseline.
Cooling has no retail answer on FT6. The same package spans 8 W down-configured designs to 15 W standard boards, and the heatsink and fan are drawn for that product. The package is lidless in most implementations, so mounting pressure and the thermal interface follow the board maker specification rather than a cooler maker socket list.
Where FT6 designs are used
FT6 covers the entry laptop market: school machines, home office systems and small business fleets where price and battery life matter more than core count. The Ryzen 10 refresh scales from 2-core Athlon Silver parts through 4-core Ryzen 5 parts in one package, with Windows 11 and Ubuntu support listed by AMD. Production laptops come from mainstream makers with 14-inch and 15-inch bodies.
Desktop builders never meet FT6 silicon on a socketed board. The same Zen 2 cores appear on AM4 in desktop packages with DDR4, while FT6 stays the mobile home of Mendocino. Designs that outgrow 4 cores or 2 graphics compute units move to FP8, which carries Phoenix and Hawk Point silicon with wider memory and more lanes. The LGA, PGA and BGA: CPU package types explained guide covers the soldered tradeoff behind thin mobile designs.
CPUs on FT6
12 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| AMD Athlon Gold 20 | 2 / 4 | 2.4 / 3.7 GHz | 15 W | Oct 2025 |
| AMD Athlon Silver 10 | 2 / 2 | 2.4 / 3.5 GHz | 15 W | Oct 2025 |
| AMD Ryzen 3 30 | 4 / 8 | 2.4 / 4.1 GHz | 15 W | Oct 2025 |
| AMD Ryzen 5 40 | 4 / 8 | 2.8 / 4.3 GHz | 15 W | Oct 2025 |
| AMD Athlon Gold 7220C | 2 / 4 | 2.4 / 3.7 GHz | 15 W | May 2023 |
| AMD Athlon Silver 7120C | 2 / 2 | 2.4 / 3.5 GHz | 15 W | May 2023 |
| AMD Ryzen 3 7320C | 4 / 8 | 2.4 / 4.1 GHz | 15 W | May 2023 |
| AMD Ryzen 5 7520C | 4 / 8 | 2.8 / 4.3 GHz | 15 W | May 2023 |
| AMD Athlon Gold 7220U | 2 / 4 | 2.4 / 3.7 GHz | 15 W | Sep 2022 |
| AMD Athlon Silver 7120U | 2 / 2 | 2.4 / 3.5 GHz | 15 W | Sep 2022 |
| AMD Ryzen 3 7320U | 4 / 8 | 2.4 / 4.1 GHz | 15 W | Sep 2022 |
| AMD Ryzen 5 7520U | 4 / 8 | 2.8 / 4.3 GHz | 15 W | Sep 2022 |
Frequently asked questions
Can an FT6 processor be replaced or upgraded?
No. The processor is soldered to the board with BGA balls. Upgrading means replacing the board or the whole laptop, so choose core count and memory at order time.
Does FT6 use DDR4 or DDR5?
LPDDR5-5500 only, in two channels with up to 16 GB. There are no DDR4 or DDR5 SODIMM options on Mendocino boards, and the soldered memory cannot be added to later.
Does FT6 support PCIe Gen4?
PCIe 3.0 with 4 lanes from the APU. The lanes usually serve NVMe storage and wireless, since Radeon 610M graphics cover display duty and no discrete GPU is paired with these entry APUs.
What is the difference between FT6, FP6 and FP8?
FP6 is the 1140-ball BGA for Ryzen 4000 and 5000 mobile with DDR4 and LPDDR4x. FT6 is the Sonoma Valley BGA for Mendocino with LPDDR5 only. FP8 is larger at 25 by 40 mm and serves higher performance Phoenix and Hawk Point designs.
Sources and verification
- AMD Ryzen 3 30 specifications (AMD)
- AMD Ryzen 5 40 specifications (AMD)
- AMD Mendocino APU specs: FT6 socket, RDNA 2 GPU, up to 32GB LPDDR5 (TweakTown)
- Package FP6 1140-contact BGA reference (ChipsWiki)
Facts last checked against these sources on . Page last edited on .