BGA 5026 socket: CPUs, chipsets and cooler fit
BGA 5026 is Intel large soldered ball grid array package for the densest Xeon 6 Granite Rapids-D edge processors. It carries 5,026 balls in the FCBGA5026 package measuring 77.5 × 56.5 mm. Intel launched the 64-core pair plus the 72-core 6776P-B in December 2025 for single-socket systems that need rack-class density without socketed infrastructure.
Quick facts
| Maker | Intel |
|---|---|
| Package type | BGA |
| Contacts | 5,026 |
| Package size | 77.5 × 56.5 mm |
| Introduced | December 2025 |
| Status | Current |
| Memory | DDR5 ECC, 8 channels (up to 6400 MT/s, up to 2.25 TB per socket) |
| PCIe from the CPU | PCIe 5.0 x32 plus PCIe 4.0 x16 from the CPU |
| Cooler mounting holes | Board specific (server heatsink) |
| Replaces | None |
| Replaced by | None |
Overview
The package pairs up to 72 P-cores with 8 channels of DDR5 ECC memory and 32 lanes of PCIe 5.0 plus 16 lanes of PCIe 4.0. That combination suits storage heads, network appliances and inference nodes where one dense soldered socket must do the work of a full rack node. The case temperature limit of 85 degrees C suits controlled data halls.
Like every soldered Intel BGA package, BGA 5026 trades replacement for integration. The chip cannot be swapped, cooling is part of the board design for the 300 W class and above, and zero UPI links confirm single-socket-only topologies. When a design needs fewer cores at lower power, the smaller BGA 4368 package carries the 20 to 40 core Granite Rapids-D range instead.
Processor generations
| Codename | Marketing name | Years | Notes |
|---|---|---|---|
| Granite Rapids-D | Xeon 6 6756P-B, 6766P-B and 6776P-B | 2025 | Soldered 64-core and 72-core single-socket Granite Rapids edge processors with 256 to 288 MB of cache, launched in December 2025 at 305 and 325 W. |
A large soldered package for dense nodes
BGA 5026 follows the same rule as every BGA package on this site: the processor is soldered once at the factory and stays with the board for life. There are no pins to bend and no lever to lift, but there is also no CPU upgrade path. An edge designer qualifies one of the two 64-core SKUs for the whole production run, and scaling out means more nodes rather than bigger sockets.
The 77.5 × 56.5 mm FCBGA5026 footprint is wider than BGA 4368 to carry the extra balls for 8 memory channels. Compatibility depends on firmware, so a board revision needs a BIOS that knows the Granite Rapids-D stepping.
Memory, expansion and cooling
Memory on BGA 5026 is DDR5 ECC in 8 channels, up to 6400 MT/s for up to 2.25 TB per socket. Eight channels at these rates keep 128 threads supplied in storage, firewall and inference mixes. Population order and maximum capacity vary by board, so the vendor memory list governs every build.
Expansion comes from 32 lanes of PCIe 5.0 plus 16 lanes of PCIe 4.0 for NVMe fleets, high-speed networking and accelerators on a dense single-socket node. AVX-512 with two FMA ports and DL Boost accelerate inference where the workload uses them. Lane bifurcation follows board firmware, so architects confirm slot maps before committing to a storage-heavy layout.
Cooling has no retail answer on BGA 5026. Both SKUs sit above 300 W, so high-airflow heatsinks or liquid cooling rated for the class are mandatory in the intended chassis. The 85 degree case limit assumes steady data hall airflow, and mounting follows the board maker specification rather than a cooler maker socket list.
Where BGA 5026 designs are used
BGA 5026 covers the top of the soldered Xeon 6 edge range: dense storage, telco and inference nodes that need 64 cores with 8 memory channels in one socket. The two SKUs differ only in clocks and TDP, 2.2 GHz at 325 W against 2.3 GHz at 305 W, so thermals and sustained all-core behavior decide between them.
Designs that fit 40 cores and 4 memory channels use BGA 4368 instead at lower power and cost. Tower and rack builders who need dual-socket topologies meet Granite Rapids on LGA 4710 instead. BGA 5026 stays the choice for maximum soldered density in one socket.
CPUs on BGA 5026
4 processor pages in the database, newest first.
| Processor | Cores / threads | Base / boost | TDP | Launched |
|---|---|---|---|---|
| Intel Xeon 6756P-B | 64 / 128 | 2.2 / 3.5 GHz | 325 W | Dec 2025 |
| Intel Xeon 6766P-B | 64 / 128 | 2.3 / 3.5 GHz | 305 W | Dec 2025 |
| Intel Xeon 6768P-B | 64 / 128 | 2.2 / 3.5 GHz | 325 W | Dec 2025 |
| Intel Xeon 6776P-B | 72 / 144 | 2.3 / 3.5 GHz | 325 W | Dec 2025 |
Frequently asked questions
Can a BGA 5026 processor be replaced or upgraded?
No. The processor is soldered to the board in the FCBGA5026 package. Upgrading means replacing the board or module, so choose the SKU for the whole production run.
Which processors fit BGA 5026?
Two 64-core parts plus one 72-core part: the 6756P-B at 325 W, the 6766P-B at 305 W and the 72-core 6776P-B at 325 W, all launched in December 2025. All are single-socket P models. BGA 4368 and LGA4710 parts do not fit.
What memory does BGA 5026 use?
DDR5 ECC in 8 channels, up to 6400 MT/s for up to 2.25 TB per socket. The board vendor qualifies exact DIMM types and speeds.
How many PCIe lanes does BGA 5026 provide?
PCIe Gen 5 with x32 lanes from the CPU plus x16 Gen 4 lanes. That lane budget suits NVMe fleets, 100-gigabit and faster networking and accelerators on a dense single-socket node.
Sources and verification
- Intel Xeon 6756P-B (Granite Rapids-D, 64 cores to 3.5 GHz, 256 MB, 325 W, FCBGA5026, 77.5x56.5mm)
- Intel Xeon 6766P-B (Granite Rapids-D, 64 cores to 3.5 GHz, 256 MB, 305 W, FCBGA5026)
- Intel Xeon 6756P-B (Granite Rapids-D, BGA 5026, DDR5-6400 8-channel, Dec 2025)
Facts last checked against these sources on . Page last edited on .