Intel Xeon 6776P-B socket: BGA 5026

What the Xeon 6776P-B is

The Intel Xeon 6776P-B is the 72-core flagship of the Xeon 6 Granite Rapids-D soldered edge stack on BGA 5026. It runs 72 Performance-cores with Hyper-Threading for 144 threads at 2.3 GHz base with boost to 3.5 GHz and 2.9 GHz all-core turbo, backed by 288 MB of cache and a 325 W TDP. Intel launched the BGA 5026 range in the fourth quarter of 2025 at a 5645 USD recommended price, built on Intel 3 for single-socket dense servers.

Seventy-two cores suit storage heads, telco clouds and inference clusters where maximum soldered density matters more than power draw. The 288 MB cache pool is the largest in the soldered range, which helps huge tables stay near the cores across 8 DDR5 channels. At 325 W the part needs high-airflow or liquid-capable chassis with vendor-qualified heatsinks.

Against the 64-core Intel Xeon 6768P-B below it, the 6776P-B adds 8 cores and 32 MB of cache at the same 325 W class. Against the 64-core Intel Xeon 6756P-B twin of that part, the same density math applies. Zero UPI links confirm single-socket-only topologies. See Socket vs chipset: what decides whether a CPU works for how socket, platform and firmware fit together on server boards.

Socket and motherboard compatibility

The 6776P-B fits BGA 5026, a 5,026-ball soldered package measuring 77.5 × 56.5 mm. The chip is soldered once at the factory and stays with the board for life, so there is no retention mechanism and no aftermarket mounting choice. Cooling is part of the board design for the 325 W class with an 85 degree case limit.

Board choice follows the server vendor list for dense Granite Rapids-D systems. Memory is 8-channel DDR5 ECC fixed per board, and expansion rides on 32 Gen 5 plus 16 Gen 4 PCIe lanes. A board revision needs firmware that knows the Granite Rapids-D stepping. Moving from any other socket is a full platform change with board, memory and heatsinks replaced together.

Memory, PCIe and cooling

Memory on BGA 5026 is DDR5 ECC in 8 channels, up to 6400 MT/s for up to 2.25 TB. Eight channels at these rates keep 144 threads supplied in storage, telco and inference mixes. Population order and maximum capacity vary by board, so the vendor memory list governs every build.

PCI Express connectivity is Gen 5 with x32 lanes plus Gen 4 with x16 lanes from the CPU. That lane budget feeds NVMe fleets, 100-gigabit and faster networking and accelerators on the densest soldered node. AVX-512 with two FMA ports and DL Boost accelerate inference where the workload uses them.

Cooling follows the board vendor list for the 325 W class with high-airflow or liquid heatsinks. No cooler ships with the tray server part. Firmware power limits can cap draw below the default where a cabinet demands it, at some cost in sustained clocks.

Upgrade paths

On the same package, there is no larger soldered part above the 72-core 6776P-B, so growth on BGA 5026 means adding nodes rather than a bigger chip. The 64-core Intel Xeon 6768P-B below it keeps high clocks at the same 325 W class.

The step down to BGA 4368 42-core parts trims cores and channels for lower power and cost. A move to LGA 4710 is a different socketed platform with dual-socket topologies. Both changes replace board, memory and cooling from scratch.