BGA 2540 socket: CPUs, chipsets and cooler fit

BGA 2540 is Intel's soldered package for Panther Lake mobile processors in the Core Ultra Series 3 family. It is a ball grid array with 2,540 contacts, and the package measures 50 × 25 mm. Intel launched it in January 2026 for performance thin laptops.

Quick facts

MakerIntel
Package typeBGA
Contacts2,540
Package size50 × 25 mm
IntroducedJanuary 2026
StatusCurrent
MemoryLPDDR5X up to 9600 MT/s or DDR5 up to 7200 MT/s, two channels
PCIe from the CPUPCIe 5.0 and PCIe 4.0: 20 lanes on H series (12 Gen 5 plus 8 Gen 4), 12 lanes on low-power and Arc models (4 Gen 5 plus 8 Gen 4)
Cooler mounting holesNot applicable (soldered)
ReplacesLunar Lake
Replaced byNone

Overview

The package carries Cougar Cove Performance-cores with Darkmont Efficient-cores, Xe3 integrated graphics up to 12 Xe cores and an NPU rated to 50 TOPS. The H series runs at 25 W with turbo power to 80 W, while low-power models turbo to 65 W.

Panther Lake follows Lunar Lake and Arrow Lake in mobile. Memory is soldered on most designs, so processor, memory capacity and wireless are fixed at purchase.

Processor generations

CodenameMarketing nameYearsNotes
Panther LakeCore Ultra Series 3 mobile2026Cougar Cove Performance-cores with Darkmont Efficient-cores, Xe3 graphics and NPU 5. Includes Arc G3 parts and H models from 8 to 16 cores. Launched in January 2026.

Soldered package

BGA 2540 processors are soldered with 2,540 balls and cannot be removed or replaced. There is no socket, no retention and no cooler choice beyond the laptop heatsink, which is sized for the 25 W class with model-dependent turbo power.

Memory choice matters as much as the processor because most boards solder it. Confirm capacity and whether the specific laptop offers slots before buying.

Memory and I/O

The memory controller supports LPDDR5X up to 9600 MT/s on X models, or LPDDR5X up to 8533 MT/s and DDR5 up to 7200 MT/s on standard H models, across two channels and up to 96 to 128 GB depending on the design. Faster memory also feeds the large Xe3 integrated GPU, which shares system RAM.

PCIe connectivity splits by model. H series processors expose 20 lanes for a fast SSD plus Thunderbolt and Wi-Fi 7, while low-power and Arc models expose 12 lanes for compact designs.

CPUs on BGA 2540

11 processor pages in the database, newest first.

ProcessorCores / threadsBase / boostTDPLaunched
Intel Arc G314 / 141.9 / 4.6 GHz25 WMay 2026
Intel Arc G3 Extreme14 / 141.9 / 4.7 GHz25 WMay 2026
Intel Core Ultra X9 378H16 / 162.0 / 5.0 GHz25 WMay 2026
Intel Core Ultra 5 336H12 / 121.9 / 4.6 GHz25 WJan 2026
Intel Core Ultra 5 338H12 / 121.9 / 4.7 GHz25 WJan 2026
Intel Core Ultra 7 356H16 / 161.9 / 4.7 GHz25 WJan 2026
Intel Core Ultra 7 366H16 / 162.0 / 4.8 GHz25 WJan 2026
Intel Core Ultra 9 386H16 / 162.1 / 4.9 GHz25 WJan 2026
Intel Core Ultra X7 358H16 / 161.9 / 4.8 GHz25 WJan 2026
Intel Core Ultra X7 368H16 / 162.0 / 5.0 GHz25 WJan 2026
Intel Core Ultra X9 388H16 / 162.1 / 5.1 GHz25 WJan 2026

Frequently asked questions

Can a BGA 2540 processor be upgraded?

No. The processor is soldered to the board, so an upgrade means replacing the board or the whole laptop.

Which processors fit BGA 2540?

Panther Lake Core Ultra X and Core Ultra mobile processors plus Arc G3 parts, from 8 to 16 cores with Xe3 graphics and a 50 TOPS NPU.

What memory does BGA 2540 use?

LPDDR5X up to 9600 MT/s on X models and up to 8533 MT/s with DDR5-7200 support on standard H models, two channels. The board decides the fitted type.

How many PCIe lanes does BGA 2540 have?

H series processors expose 20 lanes (12 PCIe 5.0 plus 8 PCIe 4.0). Low-power and Arc models expose 12 lanes (4 PCIe 5.0 plus 8 PCIe 4.0). Board wiring decides how they reach slots.

Sources and verification

  1. Intel Core Ultra X7 Processor 368H specifications (Intel)
  2. Intel Core Ultra Series 3 Quick Reference Guide (Intel)
  3. Panther Lake microprocessor (Wikipedia)
  4. Intel Core Ultra X7 368H Specs (TechPowerUp)

Facts last checked against these sources on . Page last edited on .